Method of making a thermally insulated shipper

US10329074B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10329074-B2
Application numberUS-201514938966-A
CountryUS
Kind codeB2
Filing dateNov 12, 2015
Priority dateJun 3, 2013
Publication dateJun 25, 2019
Grant dateJun 25, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of making a thermally insulated shipper for a temperature sensitive payload is provided. The shipper comprises vacuum insulated panels located between inner and outer molded shells.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of making a thermally insulated packaging system for a temperature sensitive payload, the method comprising the steps of: Step 200 : molding an outer shell, the outer shell having a bottom and sides extending from the bottom; Step 202 : placing a bottom VIP panel against the bottom of the outer shell and a side VIP panel against each of the sides of the outer shell to create an outer shell assembly, each side VIP having a top edge facing away from the bottom; Step 204 : transferring the outer shell assembly to a steam chest insert molding machine; Step 206 : positioning a male plug within the outer shell assembly, leaving a space therebetween; Step 208 : molding an inner shell into the space between the outer shell assembly and the male plug by high temperature and high pressure steam chest molding, thereby pushing the bottom and side VIP panels against each other, wherein the outer shell and inner shell have adjoining faces; and Step 210 : applying a sealant between the adjoining faces of the outer shell and inner shell so the VIP panels are completely enclosed. 2. The method of claim 1 wherein: Step 208 is carried out so that the top edge of each side VIP is covered by the inner shell. 3. A method of making a thermally insulated packaging system for a temperature sensitive payload, the method comprising the steps of: Step 200 : molding an outer shell, the outer shell having a bottom and sides extending from the bottom; Step 202 : placing a bottom VIP panel against the bottom of the outer shell and a side VIP panel against each of the sides of the outer shell to create an outer shell assembly, the bottom VIP panel and the side VIP panels forming a five sided housing, each side VIP panel having a top edge facing away from the bottom; Step 204 : transferring the outer shell assembly to a steam chest insert molding machine; Step 206 : positioning a male plug within the outer shell assembly, leaving a space therebetween; and Step 208 : molding an inner shell such that it occupies the space between the outer shell assembly and the male plug and such that it covers the entire top edge of each side VIP panel, wherein during Step 208 the outer shell and the inner shell are sealed together along a perfect seal line so the VIPs are completely enclosed. 4. The method of claim 3 wherein: during step 208 the bottom VIP panel and the side VIP panels are press fitted against the outer shell and the inner shell.

Assignees

Inventors

Classifications

  • making hollow articles · CPC title

  • the preformed layer being a lining, e.g. shaped in the mould before compression moulding, or a preformed shell adapted to the shape of the mould · CPC title

  • Boxes, cartons, cases · CPC title

  • incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles {(B29C45/1671 takes precedence)} · CPC title

  • formed of foam material · CPC title

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Frequently asked questions

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What does patent US10329074B2 cover?
A method of making a thermally insulated shipper for a temperature sensitive payload is provided. The shipper comprises vacuum insulated panels located between inner and outer molded shells.
Who is the assignee on this patent?
Sonoco Dev Inc
What technology area does this patent fall under?
Primary CPC classification B65D81/3816. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 25 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).