Adhesive agent, adhesive material using the same, and method of use thereof

Patent metadata

Field	Value
Publication number	US-10328683-B2
Application number	US-201213445398-A
Country	US
Kind code	B2
Filing date	Apr 12, 2012
Priority date	Apr 12, 2011
Publication date	Jun 25, 2019
Grant date	Jun 25, 2019

Abstract

An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2), and the following (3):
(1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A), and the monomer (B) is liquid at 25° C.; (2) the condensation resin has a polyoxyalkanediyl group; and (3) the condensation resin has a cyclohexane ring.

First claim

What is claimed is:

1. An adhesive agent comprising a polyamide resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, the polyamide resin contains an isophthalic acid unit, and meeting at least one of the following (1) and (2)
(1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A), and the monomer (B) is liquid at 25° C.;
(2) the polyamide resin has a polyoxyalkanediyl group; and
wherein the polyamide resin contains a diamine unit having a cyclohexane ring;
wherein the content of the diamine unit having a cyclohexane ring in the polyamide resin is 0.1 to 20 mol % based on the total amount of the monomer (A) unit and the monomer (B) unit, and
wherein the content of the isophthalic acid unit in the polyamide resin is 87.5-100 mol %, based on the total amount of the isophthalic acid unit and a terephthalic acid unit.

2. The adhesive agent according to claim 1 , meeting both of the (1) and (2).

3. The adhesive agent according to claim 1 , wherein the structural unit in the polyamide resin has the polyoxyalkanediyl group.

4. The adhesive agent according to claim 1 , wherein a structure derived from the monomer (B) in the structural unit has the polyoxyalkanediyl group.

5. The adhesive agent according to claim 1 , wherein polymerizable monomer contains a monomer (b-1) having a polyoxyalkanediyl group and 2 or more amino groups in a proportion of 2 to 8 mol % based on the total amount of the monomer (A) and the monomer (B).

6. An adhesive agent containing a polyamide resin, the polyamide resin having a cyclohexane ring and a polyoxyalkanediyl group,
wherein the polyamide resin has a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups,
the polyamide resin contains a diamine unit having a cyclohexane ring;
the polyamide resin contains an isophthalic acid unit; and
the content of the diamine unit having a cyclohexane ring in the polyamide resin is 0.1 to 20 mol % based on the total amount of the monomer (A) unit and the monomer (B) unit, and
wherein the content of the isophthalic acid unit in the polyamide resin is 87.5-100 mol %, based on the total amount of the isophthalic acid unit and a terephthalic acid unit.

7. The adhesive agent according to claim 6 , wherein the polyamide resin contains a diamine unit having a cyclohexane ring and a diamine unit having a polyoxyalkanediyl group.

8. The adhesive agent according to claim 6 , wherein the polyamide resin further has a 1,4-piperazinediyl group.

9. The adhesive agent according to claim 8 , wherein the polyamide resin contains a diamine unit having a 1,4-piperazinediyl group.

10. The adhesive agent according to claim 1 , wherein the content of the polyamide resin is 50 mass % or more.

11. The adhesive agent according to claim 1 , consisting of the polyamide resin.

12. An adhesive material comprising a substrate and an adhesive layer containing the adhesive agent according to claim 1 formed on the substrate.

13. A method of using an adhesive agent comprising:
an application step of applying a second adherend to a first adherend via an adhesive layer containing the adhesive agent according to claim 1 ;
a heating step of heating the first adherend and the second adherend under a condition such that a temperature of the adhesive layer is 200° C. or higher; and
a peeling step of peeling the adhesive layer and the second adherend from the first adherend subjected to the heating step.

14. The method according to claim 13 , wherein the first adherend and the second adherend are applied at 0 to 50° C. in the application step.

15. The method according to claim 13 , wherein the adhesive layer and the second adherend are peeled from the first adherend at 0 to 50° C. in the peeling step.

16. The method according to claim 13 , wherein the adhesive layer peeled in the peeling step is reused in the application step.

17. A method of using an adhesive material comprising:
an application step of applying the adhesive material according to claim 12 to an adherend such that the adhesive layer is disposed on the side closer to the adherend;
a heating step of heating the adherend under a condition such that the temperature of the adhesive material is 200° C. or higher; and
a peeling step of peeling the adhesive material from the adherend subjected to the heating step.

18. The method according to claim 17 , wherein the adhesive material is applied to the adherend at 0 to 50° C. in the application step.

19. The method according to claim 17 , wherein the adhesive material is peeled from the adherend at 0 to 50° C. in the peeling step.

20. The method according to claim 17 , wherein the adhesive material peeled in the peeling step is reused in the application step.

21. The adhesive agent according to claim 1 , wherein the polyamide resin contains a dicarboxylic acid unit having a bivalent aromatic ring group, wherein the content of the dicarboxylic acid unit having a bivalent aromatic group in the polyamide resin is 20 to 50 mol % based on the total amount of the monomer (A) unit and the monomer (B) unit.

22. The adhesive agent according to claim 6 , wherein the polyamide resin contains a dicarboxylic acid unit having a bivalent aromatic ring group, wherein the content of the dicarboxylic acid unit having a bivalent aromatic ring group in the polyamide resin is 20 to 50 mol % based on the total amount of the monomer (A) unit and the monomer (B) unit.

Assignees

• Masuda Katsuyuki
• Yamaguchi Masatoshi
• Shinada Eiichi
• Fukuyama Takehiro
• SAKAIRI Yoshihiro
• Hitachi Chemical Co Ltd

Inventors

• Masuda Katsuyuki
• Yamaguchi Masatoshi
• Shinada Eiichi
• Fukuyama Takehiro
• SAKAIRI Yoshihiro

Classifications

• C08G69/265 Primary

  from at least two different diamines or at least two different dicarboxylic acids · CPC title

• Y10T428/2896

  including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.] · CPC title

• B32B43/006 Primary

  Delaminating · CPC title

• C09J179/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• C09J177/06

  Polyamides derived from polyamines and polycarboxylic acids (C09J177/10 takes precedence) · CPC title