Water-cooling heat dissipation device and water block thereof

Patent metadata

Field	Value
Publication number	US-10327355-B2
Application number	US-201514645509-A
Country	US
Kind code	B2
Filing date	Mar 12, 2015
Priority date	Jan 29, 2015
Publication date	Jun 18, 2019
Grant date	Jun 18, 2019

Abstract

A water-cooling heat dissipation device includes a vapor chamber, a heat conduction cylinder, and a cover. A first chamber is formed in the vapor chamber. The heat conduction cylinder extends from a surface of the vapor chamber. A second chamber communicating with the first chamber is formed in the heat conduction cylinder. A working fluid flows in the first chamber and the second chamber. The cover covers the vapor chamber; the heat conduction cylinder is disposed in the cover. By means of the working fluid flowing in the first chamber and the second chamber which communicate with each other, heat can be delivered rapidly from the vapor chamber to the heat conduction cylinder.

First claim

What is claimed is:

1. A water block, comprising:
a vapor chamber, wherein a first chamber is formed in the vapor chamber;
a plurality of heat conduction cylinders extending from a surface of the vapor chamber, wherein a second chamber is formed in the plurality of heat conduction cylinders, wherein the second chamber communicates with the first chamber, wherein a working fluid flows in the first chamber and the second chamber;
a plurality of fins disposed on the plurality of heat conduction cylinders, wherein on each of the plurality of heat conduction cylinders, the plurality of fins are bent to extend transverse to the plurality of heat conduction cylinders and are formed integrated with plurality of the heat conduction cylinders; and
a cover covering the vapor chamber, wherein the plurality of heat conduction cylinders are disposed in the cover,
wherein a subset of the plurality of heat conduction cylinders are located on a straight line between an inlet and an outlet of the vapor chamber, and another subset of the plurality of heat conduction cylinders are arranged in rows arranged in a direction orthogonal to the straight line between the inlet and the outlet and not aligned with the subset of the plurality of heat conduction cylinders located on the straight line between the inlet and the outlet.

2. The water block according to claim 1 , wherein the heat conduction cylinder connects the fins in series.

3. The water block according to claim 1 , wherein the fins are individually formed on the plurality of heat conduction cylinders and extend from a side surface of the plurality of heat conduction cylinders.

4. The water block according to claim 1 , wherein each of the plurality of fins is only attached to one of the heat conduction cylinders.

5. The water block according to claim 1 , wherein the plurality of heat conduction cylinders are parallel and spaced to one another.

6. The water block according to claim 1 , wherein each of an inner wall of the first chamber and an inner wall of the second chamber is provided with a wick structure.

7. A water-cooling heat dissipation device, comprising:
a vapor chamber, wherein a first chamber is formed in the vapor chamber;
a plurality of heat conduction cylinders extending from a surface of the vapor chamber, wherein a second chamber is formed in the plurality of heat conduction cylinders, wherein the second chamber communicates with the first chamber, wherein a working fluid flows in the first chamber and the second chamber;
a plurality of fins disposed on the plurality of heat conduction cylinders, wherein on each of the plurality of heat conduction cylinders, the plurality of fins are formed integrated with the plurality of heat conduction cylinders; and
a cover covering the vapor chamber wherein the plurality of heat conduction cylinders are disposed in the cover and
a pump connected to the cover,
wherein a subset of the plurality of heat conduction cylinders are located on a straight line between an inlet and an outlet of the vapor chamber, and another subset of the plurality of heat conduction cylinders are arranged in rows arranged in a direction orthogonal to the straight line between the inlet and the outlet and not aligned with the subset of the plurality of heat conduction cylinders located on the straight line between the inlet and the outlet.

8. The water-cooling heat dissipation device according to claim 7 , wherein the plurality of heat conduction cylinders connect the fins in series.

9. The water-cooling heat dissipation device according to claim 7 , wherein the fins are individually formed on the plurality of heat conduction cylinders and extend from a side surface of the plurality of heat conduction cylinders.

10. The water-cooling heat dissipation device according to claim 7 , where in each of the plurality of fins is only attached to one of the heat conduction cylinders.

11. The water-cooling heat dissipation device according to claim 7 , wherein the plurality of heat conduction cylinders are parallel and spaced to one another.

12. The water-cooling heat dissipation device according to claim 7 , wherein each of an inner wall of the first chamber and an inner wall of the second chamber is provided with a wick structure.

13. The water-cooling heat dissipation device according to claim 7 , further comprising a circulation pipe, wherein two ends of the circulation pipe are connected to the cover, wherein the pump communicates with and is connected to the circulation pipe in series.

14. The water-cooling heat dissipation device according to claim 13 , further comprising a water tank communicating with and connected to the circulation pipe in series.

15. The water-cooling heat dissipation device according to claim 13 , further comprising a radiator communicating with and connected to the circulation pipe in series.

16. The water-cooling heat dissipation device according to claim 7 , wherein the pump is attached on the cover.

Assignees

• Cooler Master Co Ltd

Inventors

• Lin Jen-Cheng

Classifications

• H10W40/228

  the projecting parts being wire-shaped or pin-shaped · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H01L23/427

  Electricity · mapped topic

• H01L23/3677

  Electricity · mapped topic