Sealing sheet, member for electronic devices, and electronic device

Patent metadata

Field	Value
Publication number	US-10326106-B2
Application number	US-201415526656-A
Country	US
Kind code	B2
Filing date	Nov 14, 2014
Priority date	Nov 14, 2014
Publication date	Jun 18, 2019
Grant date	Jun 18, 2019

Abstract

The present invention is a sealing sheet comprising at least a base resin layer and a sealing resin layer, the base resin layer having a microstructure that is provided to one surface of the base resin layer,
the sealing resin layer being provided on a side of the base resin layer on which the microstructure is provided, and the microstructure having a protrusion that has a maximum difference in height (H) of 1 to 50 μm and is arranged two-dimensionally on the surface of the base resin layer, and an electronic device member, and an electronic device.

The sealing sheet according to the invention exhibits an excellent gas barrier capability that suppresses or reduces the entry of a gas (e.g., water vapor) not only in the vertical direction, but also in the horizontal direction (from the edge) with respect to the surface of the sealing sheet.

First claim

The invention claimed is:

1. A sealing sheet comprising at least a base resin layer and a sealing resin layer,
the base resin layer having a microstructure that is provided to one surface of the base resin layer,
the sealing resin layer being provided on a side of the base resin layer on which the microstructure is provided,
the microstructure having a protrusion that has a maximum difference in height (H) of 1 to 50 μm and is arranged two-dimensionally on the surface of the base resin layer, and
a ratio (h/H) of a thickness (h) of the sealing resin layer to the maximum difference in height (H) of the microstructure being 1.0 or more and less than 3.

2. The sealing sheet according to claim 1 , wherein a ratio (h/H) of a thickness (h) of the sealing resin layer to the maximum difference in height (H) of the microstructure is 1.0 or more and less than 2.

3. The sealing sheet according to claim 1 , wherein a thickness (h) of the sealing resin layer is 1.0 to 100 μm.

4. The sealing sheet according to claim 1 , wherein the microstructure has (i) a configuration in which a plurality of the protrusions are arranged on the surface of the base resin layer either regularly or irregularly at a nanometer pitch, (ii) a configuration in which the protrusion that is formed in a shape of a rail is arranged on the surface of the base resin layer either regularly or irregularly, or (iii) a combination thereof.

5. The sealing sheet according to claim 4 , wherein the protrusion has a shape selected from a pyramidal shape, a conical shape, and a tapered shape.

6. The sealing sheet according to claim 4 , wherein the microstructure has a configuration in which the protrusion that is formed in a shape of a rail is provided at least at an edge of the surface of the base resin layer.

7. The sealing sheet according to claim 4 , wherein the microstructure has a configuration in which the protrusion that is formed in a shape of a rail is two-dimensionally arranged on the surface of the base resin layer so as to have a circular shape, a spiral shape, a rectangular shape, a rounded rectangular shape, a grid-like shape, an orthogonal-oblique grid-like shape, or a wavy grid-like shape.

8. The sealing sheet according to claim 1 , wherein the protrusion has a quadrangular, triangular, or semicircular cross-sectional shape.

9. The sealing sheet according to claim 1 , wherein the microstructure is formed by embossing.

10. The sealing sheet according to claim 1 , wherein the sealing resin layer is a layer formed using a resin composition that comprises a rubber-based resin.

11. The sealing sheet according to claim 10 , wherein the rubber-based resin is a polyisobutylene-based resin.

12. The sealing sheet according to claim 1 , wherein the sealing resin layer is a layer formed using a sealing resin composition that comprises a rubber-based resin and a tackifier.

13. The sealing sheet according to claim 1 , wherein the sealing resin layer is formed contiguous to the base resin layer.

14. The sealing sheet according to claim 1 , further comprising a gas barrier layer.

15. The sealing sheet according to claim 14 , the sealing sheet being a laminate in which the gas barrier layer, the base resin layer, and the sealing resin layer are stacked in this order.

16. The sealing sheet according to claim 15 , wherein a water vapor transmission rate of the base resin layer measured at a temperature of 40° C. and a relative humidity of 90% is lower than that of the sealing resin layer.

17. The sealing sheet according to claim 14 , the sealing sheet being a laminate in which the base resin layer, the gas barrier layer, and the sealing resin layer are stacked in this order.

18. An electronic device member comprising the sealing sheet according to claim 1 .

19. An electronic device comprising the electronic device member according to claim 18 .

Assignees

• Lintec Corp

Inventors

• Hara Tsutomu
• Kondo Takeshi
• FUCHI Emi

Classifications

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W74/40

  characterised by their materials · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H05B33/04

  Sealing arrangements {, e.g. against humidity} · CPC title

• H01L2924/0002

  Electricity · mapped topic