Thermoelectric device, thermoelectric module including the thermoelectric device, thermoelectric apparatus including the thermoelectric module, and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-10326068-B2
Application number	US-201314048236-A
Country	US
Kind code	B2
Filing date	Oct 8, 2013
Priority date	Oct 8, 2012
Publication date	Jun 18, 2019
Grant date	Jun 18, 2019

Abstract

A thermoelectric device including: a thermoelectric material layer comprising a thermoelectric material; a transition layer on the thermoelectric material; and a diffusion prevention layer on the transition layer, wherein the thermoelectric material comprises a compound of Formula 1:

(A 1-a A′ a ) 4-x (B 1-b B′ b ) 3-y-z C z   Formula 1

wherein A and A′ are different from each other, A is a Group 13 element, and A′ is at least one element of a Group 13 element, a Group 14 element, a rare-earth element, or a transition metal, B and B′ are different from each other, B is a Group 16 element, and B′ is at least one element of a Group 14 element, a Group 15 element, or a Group 16 element, C is at least one halogen atom, a complies with the inequality 0≤a<1, b complies with the inequality 0≤b<1, x complies with the inequality −1<x<1, y complies with the inequality −1<y<1, and z complies with 0≤z<0.5.

First claim

What is claimed is:

1. A thermoelectric device comprising:
a thermoelectric material layer comprising a thermoelectric material;
a diffusion prevention layer on the thermoelectric material layer, wherein the diffusion prevention layer comprises at least one of Co, Sn, Te, Ti, Pt, Pd, Ti, Si, Ta, TiW, TiN, WN, TaN, or TiWN, or a silicide of Ti, Pt, Pd, Ti, W, Ni, or Ta;
a contact layer directly on the diffusion prevention layer, wherein the contact layer comprises at least one of Fe, Ag, or Mn; and
a transition layer between the thermoelectric material layer and the diffusion prevention layer, wherein the transition layer comprises a material that has a thermal expansion coefficient that is similar to that of the thermoelectric material,
wherein the transition layer comprises a combination including a compound of Formula 1 and at least one of Co, Sn, CoTe, CoTe 2 , or SnTe,
wherein a weight ratio of the compound of Formula 1 and at least one of Co, Sn, CoTe, CoTe 2 , or SnTe is in a range of 1:9 to 9:1,
wherein the thermoelectric material comprises a compound of Formula 1:
(A 1-a A′ a ) 4-x (B 1-b B′ b ) 3-y-z C z   Formula 1

wherein A and A′ are different from each other, A is In, and A′ is at least one element of B, Al, Ga, In, Tl, C, Si, Ge, Sn, Pb, a rare-earth element, or a transition metal,
wherein B and B′ are different from each other, B Se, and B′ is at least one element of C, Si, Ge, Sn, Pb, N, P, As, Sb, Bi, O, S, Se, Te, or Po,
wherein C, if present, is at least one halogen atom, and

wherein
a complies with the inequality 0≤a<1,
b complies with the inequality 0≤b<1,
x complies with the inequality −1<x<1,
y complies with the inequality −1<y<1, and
z complies with the inequality 0≤z<0.5.

2. The thermoelectric device of claim 1 , wherein the compound of Formula 1 is a In 4 Se 3-x material.

3. The thermoelectric device of claim 1 , wherein the transition layer and the diffusion prevention layer are each disposed on a top and on a bottom of the thermoelectric material layer.

4. A thermoelectric module comprising:
an n-type thermoelectric device and a p-type thermoelectric device; and
top and bottom electrodes to which the p-type thermoelectric device and the n-type thermoelectric device are attached so that the p-type thermoelectric device and the n-type thermoelectric device are alternately arranged,
wherein each of the n-type thermoelectric device and the p-type thermoelectric device comprise
a thermoelectric material layer comprising a thermoelectric material,
a diffusion prevention layer, wherein the diffusion prevention layer comprises at least one of Co, Sn, Te, Ti, Pt, Pd, Ti, Si, Ta, TiW, TiN, WN, TaN, or TiWN, or a silicide of Ti, Pt, Pd, Ti, W, Ni, or Ta,
a contact layer directly on the diffusion prevention layer, wherein the contact layer comprises at least one of Fe, Ag, or Mn, and
a transition layer between the thermoelectric material layer and the diffusion prevention layer, wherein the transition layer comprises a material that has a thermal expansion coefficient that is similar to that of the thermoelectric material,

wherein the transition layer comprises a combination including a compound of Formula 1 and at least one of Co, Sn, CoTe, CoTe 2 , or SnTe,
wherein a weight ratio of the compound of Formula 1 and at least one of Co, Sn, CoTe, CoTe 2 , or SnTe is in a range of 1:9 to 9:1,
wherein the thermoelectric material comprises a compound of Formula 1:
(A 1-a A′ a ) 4-x (B 1-b B′ b ) 3-y-z C z   Formula 1

wherein
A and A′ are different from each other, A is In and A′ is at least one element of B, Al, Ga, In, Tl, C, Si, Ge, Sn, Pb, a rare-earth element, or a transition metal,
wherein B and B′ are different from each other, B is Se and B′ is at least one element of C, Si, Ge, Sn, Pb, N, P, As, Sb, Bi, O, S, Se, Te, or Po,
wherein C, if present, is at least one halogen atom, and

wherein
a complies with the inequality 0≤a<1,
b complies with the inequality 0≤b<1,
x complies with the inequality −1<x<1,
y complies with the inequality −1<y<1, and
z complies with the inequality 0≤z<0.5.

5. A thermoelectric apparatus comprising the thermoelectric module of claim 4 .

6. The thermoelectric apparatus of claim 5 , wherein
the thermoelectric apparatus is a power-generation apparatus.

7. A thermoelectric apparatus comprising:
a heat supplier; and
the thermoelectric module of claim 4 .

8. A method of manufacturing the thermoelectric device of claim 1 , the method comprising:
disposing a top portion of a diffusion prevention layer powder, a top portion of a transition layer powder, a thermoelectric material powder, a bottom portion of the transition layer powder, and bottom portion of the diffusion prevention layer powder sequentially and in the foregoing order in a mold;
compression-molding to form a powder body;
vacuum hot-pressing the powder body by heating and compressing the powder body in a vacuum to form a compression-molded body; and
rapidly cooling the compression-molded body to manufacture the thermoelectric device,
wherein the thermoelectric device comprises the diffusion prevention layer integrally attached to top and bottom portions of the thermoelectric device.

9. The method of claim 8 , wherein
the vacuum hot pressing provides the thermoelectric material layer, the transition layer, and the diffusion prevention layer, which are integrally bonded.

10. A thermoelectric device comprising:
a thermoelectric material layer comprising a thermoelectric material;
a diffusion prevention layer on the thermoelectric material layer, wherein the diffusion prevention layer comprises at least one of Co, Sn, Te, Ti, Pt, Pd, Ti, Si, Ta, TiW, TiN, WN, TaN, or TiWN, or a silicide of Ti, Pt, Pd, Ti, W, Ni, or Ta;
a contact layer directly on the diffusion prevention layer, wherein the contact layer comprises at least one of Fe, Ag, or Mn; and
a transition layer between the thermoelectric material layer and the diffusion prevention layer,
wherein the transition layer comprises a combination including a compound of Formula 1 and at least one of Co, Sn, CoTe, CoTe 2 , or SnTe,
wherein a weight ratio of the compound of Formula 1 and at least one of Co, Sn, CoTe, CoTe 2 , or SnTe is in a range of 1:9 to 9:1,
wherein the thermoelectric material comprises a compound of Formula 1:
(A 1-a A′ a ) 4-x (B 1-b B′ b ) 3-y-z C z   Formula 1

wherein A is In,
wherein B is Se,
and

wherein
a is equal to 0,
b is equal to 0,
x complies with the inequality −1<x<1,
y complies with the inequality −1<y<1, and
z is equal to 0.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Sang-Il
• Hwang Sung-Woo
• Lee Sang-Mock
• Lee Kyu-Hyoung
• Mykhailovsky Vilius
• Mochernyuk Roman

Classifications

• H01L35/26 Primary

  Electricity · mapped topic

• H01L35/16

  Electricity · mapped topic

• H01L35/34

  Electricity · mapped topic

• H10N10/857 Primary

  comprising compositions changing continuously or discontinuously inside the material · CPC title

• H10N10/01 Primary

  Manufacture or treatment · CPC title