Copper-containing conductive pastes and electrodes made therefrom

US10325693B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10325693-B2
Application numberUS-201415505690-A
CountryUS
Kind codeB2
Filing dateAug 28, 2014
Priority dateAug 28, 2014
Publication dateJun 18, 2019
Grant dateJun 18, 2019

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

Disclosed herein are copper-containing (Cu-containing) conductive pastes, copper (Cu) electrodes formed by firing the Cu-containing conductive paste over a substrate, and articles comprising a structural element with such Cu electrodes, wherein, the Cu-containing conductive paste contains a powder mixture of Cu, Ge, and B particles dispersed in an organic medium.

First claim

Opening claim text (preview).

What is claimed is: 1. A copper-containing (Cu-containing) conductive paste comprising: a) about 10-95 wt % of a powder mixture of Cu, germanium (Ge), and boron (B) particles, and b) about 0.1-15 wt % of a glass frit, dispersed in c) an organic medium, with the total wt % of all components comprising the paste totaling to 100 wt %, and wherein, (i) the powder mixture comprises about 0.1-35 parts by weight of the Ge particles and about 0.05-15 parts by weight of the B particles, based on 100 parts by weight of the Cu particles, and provided that the combined content level of Ge and B particles is about 35 parts by weight or less; and (ii) the organic medium is comprised of at least one organic polymer dissolved in at least one solvent. 2. The Cu-containing conductive paste of claim 1 , wherein, the powder mixture comprises about 0.1-25 parts by weight of the Ge particles and about 0.1-12 parts by weight of the B particles, based on 100 parts by weight of the Cu particles, and provided that the combined content level of Ge and B particles is about 25 parts by weight or less. 3. The Cu-containing conductive paste of claim 2 , wherein, the powder mixture comprises about 0.2-13 parts by weight of the Ge particles and about 0.1-6.5 parts by weight of the B particles, based on 100 parts by weight of the Cu particles, and provided that the combined content level of Ge and B particles is about 12.5 parts by weight or less. 4. The Cu-containing conductive paste of claim 1 , wherein, the Cu particles have a particle diameter (D50) of about 1-50 μm. 5. The Cu-containing conductive paste of claim 4 , wherein, the Cu particles have a particle diameter (D50) of about 1.5-30 μm. 6. The Cu-containing conductive paste of claim 5 , wherein, the Cu particles have a particle diameter (D50) of about 1.5-15 μm. 7. The Cu-containing conductive paste of claim 1 , wherein, the Ge particles have a particle diameter (D50) of about 1-1000 nm, and the B particles have a particle diameter (D50) of about 1-1000 nm. 8. An article comprising a structural element, wherein the structural element is comprised of a substrate and at least one Cu electrode, wherein the at least one Cu electrode is formed by: (I) applying a Cu-containing conductive paste onto one side of the substrate in a predetermined shape and at a predetermined position; (II) drying the Cu-containing conductive paste; and (III) firing the Cu-containing conductive paste to form the at least one Cu electrode, wherein, the Cu-containing conductive paste comprises: a) about 10-95 wt % of a powder mixture of Cu, Ge, and B particles, and b) about 0.1-15 wt % of a glass frit, dispersed in c) an organic medium, with the total wt % of all components comprised in the paste totaling to 100 wt %, and wherein, (i) the powder mixture comprises about 0.01-35 parts by weight of the Ge particles and about 0.05-15 parts by weight of the B particles, based on 100 parts by weight of the Cu particles; and (ii) the organic medium is comprised of at least one organic polymer dissolved in at least one solvent. 9. The article of claim 8 , wherein during step (III), the Cu-containing conductive paste is fired in air. 10. The article of claim 9 , wherein during step (III), the Cu-containing conductive paste is fired in air for about 3 min to 2 hr. 11. The article of claim 10 , wherein during step (III), the Cu-containing conductive paste is fired in air for about 3 min to 1 hr. 12. The article of claim 11 , wherein during step (III), the Cu-containing conductive paste is fired in air for about 3-18 min. 13. The article of claim 8 , which is selected from the group consisting of hybrid integrated circuit, resistors, ceramic capacitors, super capacitors, resistive heaters, and fuel sensors.

Assignees

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Classifications

  • with one or more parts not made from powder {(B22F7/062 takes precedence)} · CPC title

  • Operations & Transport · mapped topic

  • Photovoltaic [PV] energy · CPC title

  • Electricity · mapped topic

  • Operations & Transport · mapped topic

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Frequently asked questions

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What does patent US10325693B2 cover?
Disclosed herein are copper-containing (Cu-containing) conductive pastes, copper (Cu) electrodes formed by firing the Cu-containing conductive paste over a substrate, and articles comprising a structural element with such Cu electrodes, wherein, the Cu-containing conductive paste contains a powder mixture of Cu, Ge, and B particles dispersed in an organic medium.
Who is the assignee on this patent?
Du Pont
What technology area does this patent fall under?
Primary CPC classification H01B1/22. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 18 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).