Soft touch resin and transaction card comprising the same

US10325437B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10325437-B2
Application numberUS-201815958876-A
CountryUS
Kind codeB2
Filing dateApr 20, 2018
Priority dateDec 9, 2016
Publication dateJun 18, 2019
Grant dateJun 18, 2019

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Apparatuses and methods are provided for manufacturing a transaction card. The disclosed apparatuses and methods may be used to form a transaction card frame configured to house a data storage component. The card frame may be formed of a resin mixture comprising a thermoplastic elastomer (TPE). The card frame may also have a Shore D hardness in the range of 20-80.

First claim

Opening claim text (preview).

What is claimed is: 1. A transaction card, comprising: a transaction component; and a card frame configured to house the transaction component, wherein: the card frame comprises a pocket, the pocket comprising a first surface, a second surface, and a third surface; the card frame is formed of a resin mixture comprising thermoplastic elastomer (TPE) and at least one of acetal homopolymer or polybutylene terephthalate (PBT), with a ratio of TPE to the at least one of acetal homopolymer or PBT being between 30:70 and 70:30; and the TPE has a flexural modulus in the range of 1100-1150 MPa. 2. The transaction card of claim 1 , wherein: the second surface is recessed a first depth from the first surface; and the third surface is recessed a second depth from the first surface. 3. The transaction card of claim 2 , wherein the second depth is greater than the first depth. 4. The transaction card of claim 1 , wherein the pocket comprises a base portion formed by the third surface. 5. The transaction card of claim 1 , wherein: the transaction component comprises a contact plate; and the second surface is configured to house the contact. 6. The transaction card of claim 1 , wherein: the transaction component comprises a contact plate; and the third surface is configured to house the contact. 7. The transaction card of claim 1 , wherein the transaction component comprises at least one of a microchip, a communication device, a Near Field Communication (NFC) device, an antenna, a Bluetooth® device, and a WiFi device. 8. The transaction card of claim 1 , wherein the ratio of TPE to the at least one of acetal homopolymer or PBT is between 40:60 to 60:40. 9. The transaction card of claim 1 , wherein: the resin mixture comprises PBT; and the PBT has a flexural modulus in the range of 1600-8500 MPa. 10. The transaction card of claim 1 , wherein the TPE has a flexural modulus in the range of 900-1150 MPa. 11. A method of manufacturing a transaction card, comprising: forming a card frame out of a resin mixture, the resin mixture comprising thermoplastic elastomer (TPE) and at least one of acetal homopolymer or polybutylene terephthalate (PBT), with a ratio of TPE to the at least one of acetal homopolymer or PBT being between 30:70 and 70:30, and the TPE having a flexural modulus in the range of 1100-1150 MPa; and forming a pocket on the card frame, the pocket comprising a first surface, a second surface, and a third surface. 12. The method of claim 11 , further comprising forming the pocket such that the second surface is recessed a first depth from the first surface, and the third surface is recessed a second depth from the first surface. 13. The method of claim 12 , further comprising forming the pocket on the card frame such that the second depth is greater than the first depth. 14. The method of claim 11 , wherein forming the pocket comprises forming the pocket such that the third surface defines a base portion of the pocket. 15. The method of claim 11 , wherein forming the pocket comprises forming the pocket such that the second surface is configured to house a contact plate of a transaction component. 16. The method of claim 11 , wherein forming the pocket comprises forming the pocket such that the third surface is configured to house a contact plate of a transaction component. 17. The method of claim 11 , further comprising disposing a transaction component in the pocket, wherein the transaction component comprises at least one of a microchip, a communication device, a Near Field Communication (NFC) device, an antenna, a Bluetooth® device, and a WiFi device. 18. The method of claim 11 , wherein the ratio of TPE to the at least one of acetal homopolymer or PBT is between 40:60 to 60:40. 19. The method of claim 11 , wherein: the resin mixture comprises PBT; and the PBT has a flexural modulus in the range of 1600-8500 MPa. 20. The method of claim 11 , wherein the TPE has a flexural modulus in the range of 900-1150 MPa.

Assignees

Inventors

Classifications

  • Thermoplastic elastomer · CPC title

  • G07F7/0806Primary

    Details of the card (record carriers per se G06K) · CPC title

  • Cards, e.g. identity cards, credit cards · CPC title

  • smooth · CPC title

  • Physical layout of the record carrier · CPC title

Patent family

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External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10325437B2 cover?
Apparatuses and methods are provided for manufacturing a transaction card. The disclosed apparatuses and methods may be used to form a transaction card frame configured to house a data storage component. The card frame may be formed of a resin mixture comprising a thermoplastic elastomer (TPE). The card frame may also have a Shore D hardness in the range of 20-80.
Who is the assignee on this patent?
Capital One Services Llc
What technology area does this patent fall under?
Primary CPC classification G07F7/0806. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jun 18 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).