Peripheral component interconnect express (PCIe) solid state drive (SSD) accelerator

Patent metadata

Field	Value
Publication number	US-10324642-B2
Application number	US-201414300231-A
Country	US
Kind code	B2
Filing date	Jun 9, 2014
Priority date	Jun 7, 2013
Publication date	Jun 18, 2019
Grant date	Jun 18, 2019

Abstract

A peripheral component interconnect express (PCIe) solid state drive (SSD) accelerator, having a PCIe card and separate a flash daughter-card, is provided. By including flash memory devices on a separate daughter-card, the flash memory devices are thermally decoupled from the hotter devices on the main PCIe providing additional thermal operating margins for the entire design. Furthermore, as flash memory devices are the most likely part of the subsystem to wear out over time due, including flash memory devices on a separate daughter-card allows the flash memory devices to become a field replaceable unit that can be easily replaced. EEPROMs may be included on the flash daughter-card to record the current wear state of the NAND flash devices. Knowing the wear history of the flash memory device allows the seller to replace the flash daughter-card of a customer with a daughter-card having a similar wear state.

First claim

The invention claimed is:

1. A peripheral component interconnect express (PCIe) solid state drive (SSD) accelerator, comprising:
a PCIe card comprising PCIe card components, the PCIe card components comprising:
a microcontroller;
one or more SSD controller chips in communication with the microcontroller;
a first temperature sensor, readable by the microcontroller, for determining if the PCIe card is operating within pre-determined thermal operating margins;
a flash daughter-card connector connected to the one or more SSD controller chips; and
a power conversion and monitor circuit coupled to the microcontroller, the power conversion and monitor circuit including one or more current sensors for monitoring current flowing to the PCIe card; and

a flash daughter-card removably mounted to the PCIe card, the flash daughter-card connected to the PCIe card by the flash daughter-card connector and comprising flash daughter- card components decoupled from the PCIe card components on the PCIe card, the flash daughter-card components comprising:
one or more groups of flash memory devices; and
a second temperature sensor, readable by the microcontroller, for determining if the flash daughter-card is operating within the pre-determined thermal operating margins,

wherein the microcontroller throttles performance of one or more SSD controller chips to reduce power consumption by providing an artificially high temperature reading to the one or more SSD controllers in response to the monitored current flowing to the PCIe card indicating a power consumption approaching a power threshold, causing the one or more SSD controller chips to invoke performance throttling.

2. The accelerator of claim 1 , wherein the microcontroller periodically polls the first temperature sensor and the second temperature sensor to measure system temperature to determine if system temperature exceeds a pre-determined temperature threshold.

3. The accelerator of claim 2 , wherein the microcontroller operates the one or more SSD controllers at full throttle performance if the system temperature is below the pre-determined temperature threshold.

4. The accelerator of claim 2 , wherein the microcontroller operates the one or more SSD controllers at reduced throttle performance if the system temperature exceeds the predetermined temperature threshold.

5. The accelerator of claim 1 , wherein the power conversion and monitor circuit provides short term energy during a host power failure.

6. The accelerator of claim 1 , wherein the PCIe card further comprises a PCIe to SATA bridge chip for routing data via computer bus interfaces to the one or more SSD controller chips.

7. The accelerator of claim 1 , wherein each group in the one or more groups of flash memory devices comprises eight (8) flash devices.

8. The accelerator of claim 1 , wherein the flash daughter-card further comprises an electrically erasable programmable read-only memory (EEPROM) connected to each SSD controller chip in the one or more controller chips.

9. The accelerator of claim 8 , wherein the one or more SSD controller chips track wear statistics of each flash memory device in the one or more groups of flash memory devices during runtime.

10. The accelerator of claim 9 , wherein the wear statistics are periodically stored in the EEPROM for each of the one or more SSD controller chips.

11. The accelerator of claim 1 , wherein performance throttling of one or more SSD controller chips includes delaying read/write operation requests from a host system to the one or more groups of flash memory devices.

12. The accelerator of claim 1 , wherein if a first temperature, from the first temperature sensor, and a second temperature, from the second temperature sensor, are below a pre-determined temperature threshold, the microcontroller provides the greater of the first temperature and the second temperature to the one or more SSD controller chips.

13. A peripheral component interconnect express (PCIe) solid state drive (SSD) accelerator, comprising:
a PCIe card comprising PCIe card components, the PCIe card components comprising:
a microcontroller;
one or more SSD controller chips in communication with the microcontroller;
a first temperature sensor, readable by the microcontroller, for determining if the PCIe card is operating within pre-determined thermal operating margins;
a flash daughter-card connector connected to the one or more SSD controller chips; and
a power conversion and monitor circuit coupled to the microcontroller, the power conversion and monitor circuit including one or more current sensors for monitoring current flowing to the PCIe card; and

a flash daughter-card removably mounted to the PCIe card, the flash daughter-card connected to the PCIe card by the flash daughter-card connector and comprising flash daughter-card components decoupled from the PCIe card components on the PCIe card, the flash daughter-card components comprising:
one or more groups of flash memory devices;
an electrically erasable programmable read-only memory (EEPROM) connected to each SSD controller chip in the one or more controller chips; and
a second temperature sensor, readable by the microcontroller, for determining if the flash daughter-card is operating within the pre-determined thermal operating margins; and
wherein the one or more SSD controller chips track wear statistics of each flash memory device in the one or more groups of flash memory devices during runtime; and
wherein the wear statistics are periodically stored in the EEPROM for each of the one or more SSD controller chips, and
the microcontroller throttles performance of one or more SSD controller chips by providing an artificially high temperature reading to the one or more SSD controllers in response to the monitored current flowing to the PCIe card indicating a power consumption approaching a power threshold, causing the one or more SSD controller chips to reduce power consumption.

14. The accelerator of claim 13 , wherein the microcontroller periodically polls the first temperature sensor and the second temperature sensor to determine if system temperature exceed a pre-determined temperature threshold.

15. The accelerator of claim 14 , wherein the microcontroller operates the one or more SSD controllers at full throttle performance if the system temperature is below the predetermined temperature threshold; and wherein the microcontroller operates the one or more SSD controllers at reduced throttle performance if the system temperature exceeds the predetermined temperature threshold.

16. The accelerator of claim 13 , wherein the power conversion and monitor circuit provides short term energy during a host power failure.

17. The accelerator of claim 13 , wherein the PCIe card further comprises a PCIe to SATA bridge chip for routing data via computer bus interfaces to the one or more SSD controller chips.

Assignees

• Sanmina Corp

Inventors

• Sweere Paul
• Patel Jay
• Syed Irfan

Classifications

• G06F1/206

  comprising thermal management · CPC title

• G06F11/3058

  Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations (thermal management in cooling arrangements of a computing system G06F1/206) · CPC title

• G11C7/04

  with means for avoiding disturbances due to temperature effects · CPC title

• G06F2212/7211

  Wear leveling · CPC title

• Y02D10/154

  Cross-Sectional Technologies · mapped topic