Coating method for an optoelectronic chip-on-board module
US-8956922-B2 · Feb 17, 2015 · US
US10324232B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10324232-B2 |
| Application number | US-201314397984-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 21, 2013 |
| Priority date | May 2, 2012 |
| Publication date | Jun 18, 2019 |
| Grant date | Jun 18, 2019 |
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A method is provided for production of a module, including the steps of: providing a substrate ( 1 ) having a first surface ( 5 ) in the form of a translucent carrier; providing an open casting mold ( 6 ), wherein the formation of at least one optical element ( 4, 4′ ) is provided in the casting mold ( 6 ); covering the surface ( 5 ) with a polymeric casting compound ( 3 ) in the open casting mold, while forming the optical element from the casting compound ( 3 ); and curing the casting compound in the casting mold, wherein the translucent carrier and the casting compound ( 3 ) together form an optical system ( 10 ).
Opening claim text (preview).
We claim: 1. A method for producing an optical module comprising the following steps: (a) providing a translucent carrier having a first surface; (b) providing an open casting mold, wherein a molding for at least one optical element is formed in the open casting mold, the open casting mold including supports for supporting the translucent carrier and an overflow region; (c) coating the first surface with an adhesion promoter, the adhesion promoter comprising a mixture of reactive siloxanes and silicon resins; (d) after the first surface is coated with the adhesion promoter, positioning the translucent carrier on the supports and covering the first surface with a polymeric casting compound in the open casting mold while forming the at least one optical element from the polymeric casting compound, such that excess polymeric casting compound displaced by the translucent carrier flows into the overflow region, the polymeric casting compound comprising at least predominantly a silicone; and (e) curing the casting compound in the casting mold, wherein the translucent carrier and the at least one optical element together form an optical system. 2. The method according to claim 1 , wherein the polymeric casting compound contains no admixture of adhesion promoter. 3. The method according to claim 1 , wherein the polymeric casting compound contains a catalyst for initiation of a curing process. 4. The method according to claim 1 , further comprising the following step: heating the polymeric casting compound in the casting mold to a defined temperature to initiate and/or accelerate the curing step. 5. The method according to claim 1 , wherein the adhesion promoter is applied onto the first surface as a layer having a mean thickness of less than 100 nm. 6. The method according to claim 1 , wherein the polymeric casting compound has a viscosity before curing of less than 1,000 mPa·s. 7. The method according to claim 1 , wherein the cured casting compound possesses a hardness in a range of 10 to 90 Shore A. 8. The method according to claim 1 , wherein the at least one optical element formed from the polymeric casting compound possesses a UV resistance for irradiation intensities in excess of 1 W/cm 2 in a wavelength range below 400 nm. 9. The method according to claim 1 , wherein the silicone is provided as a mixture of at least two silicones right before placing it into the casting mold. 10. The method according to claim 1 , wherein the silicone contains less than 100 ppm of foreign substances. 11. The method according to claim 1 , further comprising the following step: coating a second surface after step (e), wherein the coating of the second surface also comprises procedural steps (a) to (e). 12. The method according to claim 1 , wherein the open casting mold is reusable, the method further comprising the following steps: (f) releasing the optical system from the casting mold; and (g) re-using the casting mold to produce a second optical system. 13. The method according to claim 1 , wherein the first surface of the translucent carrier is completely wetted.
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for making multilayered articles · CPC title
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incorporating preformed parts or layers, e.g. moulding inserts or for coating articles · CPC title
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