Roundness measuring apparatus

US10323921B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10323921-B2
Application numberUS-201715664273-A
CountryUS
Kind codeB2
Filing dateJul 31, 2017
Priority dateAug 31, 2016
Publication dateJun 18, 2019
Grant dateJun 18, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A roundness measuring device including: an angle detector detecting a current rotation angle of a table relative to an X axis direction; a joystick (external operator) issuing an instruction for an operation amount of a rotation axis line of the table; a centering controller calculating a CX axis displacement amount and a CY axis displacement amount from the operation amount and the rotation angle, and displacing a CX axis displacement mechanism and CY axis displacement mechanism based on the calculated CX axis displacement amount and CY axis displacement amount; and a centering controller calculating an LX axis tilt amount and an LY axis tilt amount from the operation amount and the rotation angle, and displacing an LX axis tilt mechanism and LY axis tilt mechanism based on the calculated LX axis tilt amount and LY axis tilt amount.

First claim

Opening claim text (preview).

What is claimed is: 1. A roundness measuring device comprising: a table provided with a placement plate on which a work piece is to be placed, the table configured to rotate around a rotation axis line and cause the work piece placed on the placement plate to rotate; a detector provided with a stylus brought into contact with the work piece placed on the placement plate, the detector configured to detect a change in position of the stylus, wherein: the stylus is brought into contact with a peripheral surface of the work piece when the table is rotated, and a measurement is made of a circular shape of the work piece from the change in position of the stylus detected by the detector; a first displacer and a second displacer installed on the table, the first displacer and second displacer configured to respectively displace the placement plate in a first displacement axis direction and a second displacement axis direction orthogonal to the rotation axis line; an angle detector configured to detect a current rotation angle of the table; an external operator configured to issue an instruction for an operation amount of the work piece placed on the placement plate, the operation amount occurring in an operation direction orthogonal to the rotation axis line; and a centering controller configured to calculate a first displacement amount in the first displacement axis direction and a second displacement amount in the second displacement axis direction from the operation amount and the rotation angle, the centering controller further configured to drive the first and second displacers based on the respective calculated first and second displacement amounts. 2. The roundness measuring device according to claim 1 , wherein a first tilter and a second tilter are further installed on the table, the first and second tilters respectively adjusting a tilt of the placement plate relative to a first tilt axis direction and a second tilt axis direction orthogonal to the rotation axis line, and a leveling controller is further provided calculating a first tilt amount relative to the first tilt axis direction and a second tilt amount relative to the second tilt axis direction from the operation amount and the rotation angle θ, and driving the first and second tilters based on the respective calculated first and second tilt amounts. 3. A roundness measuring device comprising: a table provided with a placement plate on which a work piece is to be placed, the table configured to rotate around a rotation axis line and cause the work piece placed on the placement plate to rotate; and a detector provided with a stylus brought into contact with the work piece placed on the placement plate, the detector configured to detect a change in position of the stylus, wherein: the stylus is brought into contact with a peripheral surface of the work piece when the table is rotated, and a measurement is made of a circular shape of the work piece from the change in position of the stylus detected by the detector; a first tilter and a second tilter installed on the table, the first tilter and second tilter configured to respectively adjust a tilt of the placement plate relative to the first tilt axis direction and the second tilt axis direction; an angle detector configured to detect a current rotation angle of the table; an external operator configured to issue an instruction for an operation amount of the work piece placed on the placement plate, the operation amount occurring in an operation direction orthogonal to the rotation axis line; and a leveling controller configured to calculate a first tilt amount relative to the first tilt axis direction and a second tilt amount relative to the second tilt axis direction from the operation amount and the rotation angle, and further configured to drive the first and second tilters based on the respective calculated first and second tilt amounts. 4. The roundness measuring device according to claim 1 , wherein the first and second displacement amounts are values in which a distance corresponding to the instructed operation amount in the operation direction is distributed into components in the first and second displacement axis directions in accordance with the rotation angle, such that a displacement amount combining the first and second displacement amounts is equal to a distance corresponding to the operation amount in the operation direction. 5. The roundness measuring device according to claim 2 , wherein the first and second displacement amounts are values in which a distance corresponding to the instructed operation amount in the operation direction is distributed into components in the first and second displacement axis directions in accordance with the rotation angle, such that a displacement amount combining the first and second displacement amounts is equal to a distance corresponding to the operation amount in the operation direction. 6. The roundness measuring device according to claim 2 , wherein: the first and second tilt amounts are displacement amounts in the operation direction at a rotation axis line direction position of the stylus, and the first and second tilt amounts are values distributed into components in the first and second tilt axis directions in accordance with the rotation angle, such that a tilt amount combining the first and second tilt amounts is equal to a distance corresponding to the instructed operation amount in the operation direction at a position of the stylus in the rotation axis line direction. 7. The roundness measuring device according to claim 3 , wherein: the first and second tilt amounts are displacement amounts in the operation direction at a rotation axis line direction position of the stylus, and the first and second tilt amounts are values distributed into components in the first and second tilt axis directions in accordance with the rotation angle, such that a tilt amount combining the first and second tilt amounts is equal to a distance corresponding to the instructed operation amount in the operation direction at a position of the stylus in the rotation axis line direction.

Assignees

Inventors

Classifications

  • G01B5/201Primary

    for measuring roundness · CPC title

  • G01B21/20Primary

    for measuring contours or curvatures, e.g. determining profile · CPC title

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What does patent US10323921B2 cover?
A roundness measuring device including: an angle detector detecting a current rotation angle of a table relative to an X axis direction; a joystick (external operator) issuing an instruction for an operation amount of a rotation axis line of the table; a centering controller calculating a CX axis displacement amount and a CY axis displacement amount from the operation amount and the rotation an…
Who is the assignee on this patent?
Mitutoyo Corp
What technology area does this patent fall under?
Primary CPC classification G01B5/201. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jun 18 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).