Visible diode laser systems, apparatus and methods of use

Patent metadata

Field	Value
Publication number	US-10323460-B2
Application number	US-201715821411-A
Country	US
Kind code	B2
Filing date	Nov 22, 2017
Priority date	Dec 11, 2015
Publication date	Jun 18, 2019
Grant date	Jun 18, 2019

Abstract

Systems, apparatus and methods for performing laser operations in boreholes and other remote locations, such operations including laser drilling of a borehole in the earth. Systems, apparatus and methods for generating and delivering high power laser energy below the surface of the earth and within a borehole. Laser operations using such downhole generated laser beams.

First claim

What is claimed:

1. A high power laser source for generating high power beams in situ in a borehole, the laser source comprising:
a. a downhole assembly having an outer housing, the outer housing defining a first cavity, a length and an axis;
b. a cooling assembly in thermal contact with the first cavity:
c. a semiconductor laser module assembly located in the first cavity, the semiconductor laser module assembly comprising: an outer wall defining a second cavity;
d. a plurality of laser units located in the second cavity, each laser unit in thermal contact with the cooling assembly; each laser unit comprising a plurality of diode lasers;
e. the laser diodes configured in the laser units, wherein the laser diodes are capable of generating a plurality of initial laser beamlets, wherein the initial laser beamlets from the laser units have substantially parallel beamlet paths and a spacing between the beamlet paths;
f. the laser units configured in the second cavity, whereby the substantially parallel beamlet paths are directed toward a beam transformation system;
g. the beam transformation system containing optics, wherein the beamlet paths are directed in a direction substantially parallel to the axis, and wherein the spacing between the beamlet paths is reduced; and,
h. a focusing optics package, wherein an operation laser beam is formed.

2. The laser source of claim 1 , wherein the laser beamlets from each laser unit have a total power of greater than 10W, a wavelength from about 400 nm to about 900 nm, and an M 2 of less than 100.

3. The laser source of claim 2 , wherein the operational beam has a power of greater than 5 kW and an M 2 of less than 50.

4. The laser source of claim 2 , wherein the operational beam has a power of greater than 10 kW and an M 2 of less than 20.

5. The laser source of claim 2 , wherein the operational beam has a power of greater than 10 kW and an M 2 of less than 20, and a wavelength from about 400 nm to about 500 nm.

6. The laser source of claim 2 , wherein the operational beam has a power of greater than 10 kW and an M 2 of less than 20, and a wavelength from about 500 nm to about 600 nm.

7. The laser source of claim 1 , wherein the laser beamlets have a power of greater than 0.25 W, a wavelength from about 400 nm to about 900 nm, and an M 2 of less than 50.

8. The laser source of claim 7 , wherein the operational beam has a power of greater than 5 kW and an M 2 of less than 20.

9. The laser source of claim 1 , wherein the initial beamlet paths are substantially normal to the axis.

10. The laser source of claim 1 comprising a source of electrical power, wherein the electrical power source lowers an incoming voltage and increases an current to provide a transformed electrical power to the laser units.

11. The laser source of claim 7 comprising a source of electrical power, wherein the electrical power source lowers an incoming voltage and increases a current to provide a transformed electrical power supply to the laser units; wherein the incoming voltage is from about 400V to 1,000V and the incoming current is from about 40 A to 100 A; and the transformed electrical power supply has a voltage of from about 80V to 300V and a current of from about 80 A to 300 A.

12. A system for generating a high power operational laser beam in situ in a borehole, the system comprising:
a. a mobile field unit, the mobile field unit comprising a control unit, a cooling system, conveyance structure, the conveyance structure having a proximal end and a distal end;
b. the conveyance structure comprising a line structure, a cooling fluid delivery line, and an electrical power line;
c. a downhole assembly in mechanical, fluid and electrical association with the distal end of the conveyance structure, whereby electrical power and cooling fluid can be supplied to the downhole assembly;
d. the downhole assembly having an outer housing, the outer housing defining a first cavity, a length and an axis;
e. a cooling assembly located in the first cavity, the cooling assembly having a cooling fluid flow channel, the fluid flow channel in fluid communication with the conveyance structure fluid delivery line;
f. a semiconductor laser module assembly located in the first cavity, the semiconductor laser module assembly comprising: an outer wall defining a second cavity;
g. a plurality of laser units located in the second cavity, each laser unit in thermal contact with the cooling assembly; each laser unit comprising a plurality of diode lasers;
h. the laser diodes configured in the laser units, wherein the laser diodes are capable of generating a plurality of initial laser beamlets, wherein the initial laser beamlets from the laser units have substantially parallel beamlet paths and a spacing between the beamlet paths;
i. the laser laser units configured in the second cavity, whereby the substantially parallel beamlet paths are directed toward a beam transformation system;
j. the beam transformation system containing optics, wherein the beamlet paths are directed in a direction substantially parallel to the axis, and wherein the spacing between the beamlet paths is reduced; and,
k. a focusing optics package, wherein an operation laser beam is formed.

13. The laser source of claim 12 , wherein the laser beamlets from each laser unit have a total power of greater than 10 W, a wavelength from about 400 nm to about 900 nm, and an M 2 of less than 100.

14. The laser source of claim 12 , wherein the operational beam has a power of greater than 10 kW and an M 2 of less than 20, and a wavelength from about 400 nm to about 500 nm.

15. The laser source of claim 12 , wherein the operational beam has a power of greater than 10 kW and an M 2 of less than 20, and a wavelength from about 500 nm to about 600 nm.

16. The laser systems of claim 12 , wherein the cooling system comprises an aqueous coolant, and has the capability to flow the coolant at a flow rate of at least about 2 gpm.

Assignees

• Foro Energy Inc

Inventors

• Faircloth Brian O
• Lee Ian
• Kuznetsov Andrey

Classifications

• B23K26/0869

  Devices involving movement of the laser head in at least one axial direction · CPC title

• B23K26/382

  by boring · CPC title

• G02B6/3624

  Fibre head, e.g. fibre probe termination (optical details of light guide terminations G02B6/241; reshaping of light guides G02B6/2552; optical details of coupling light into or out of fibre end G02B6/262) · CPC title

• H01S5/4025

  Array arrangements, e.g. constituted by discrete laser diodes or laser bar (H01S5/42 takes precedence) · CPC title

• H01S5/02423

  Liquid cooling, e.g. a liquid cools a mount of the laser · CPC title