Printed chemical mechanical polishing pad

Patent metadata

Field	Value
Publication number	US-10322491-B2
Application number	US-201514885955-A
Country	US
Kind code	B2
Filing date	Oct 16, 2015
Priority date	Oct 17, 2014
Publication date	Jun 18, 2019
Grant date	Jun 18, 2019

Abstract

A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.

First claim

What is claimed is:

1. A method of fabricating a polishing pad comprising:
successively forming a plurality of polishing pad layers using a print head of an additive manufacturing system, wherein forming a polishing pad layer comprises:
ejecting droplets comprising a base material from one of one or more nozzles of the print head;
ejecting droplets comprising an additive material from one of the one or more nozzles of the print head, wherein the droplets comprising the additive material are ejected from the print head independently of the droplets comprising the base material, and wherein the droplets of the additive material are ejected non-uniformly across the polishing pad; and
polymerizing the ejected droplets of the base material to form the polishing pad layer,
wherein the polishing pad layer comprises a polymer matrix of the base material crosslinked with the additive material,
wherein a concentration of the additive material in the polishing pad changes in a first direction or a second direction across the polishing pad, and
wherein the first direction is parallel to a polishing surface of the polishing pad and the second direction is orthogonal to the polishing surface.

2. The method of claim 1 , wherein the additive material modifies a thermal conductivity of the polishing pad.

3. The method of claim 1 , wherein the additive material modifies a porosity of the polishing pad.

4. The method of claim 1 , wherein the additive material comprises piezoelectric material.

5. The method of claim 1 , further comprising:
successively depositing a plurality of layers on the plurality of polishing layers to integrally form a backing layer therewith.

6. The method of claim 5 , wherein forming the backing layer comprises:
ejecting droplets comprising a composition of material different than the composition of the base material from one of the one or more nozzles of the print head.

7. The method of claim 5 , wherein the polishing layer has a Shore D hardness of about 30 Shore D to about 90 Shore D.

8. The method of claim 7 , wherein the polishing layer has a Shore D hardness of about 50 Shore D to about 65 Shore D.

9. The method of claim 5 , wherein the polishing layer has a Shore A hardness between about 26 Shore A to about 95 Shore A.

10. The method of claim 5 , wherein at least one of the plurality of layers comprises
two or more discrete areas having different characteristics, wherein a first discrete area comprises a first concentration of additive material and a second discrete area comprises a second concentration of additive material, and wherein the first concentration of additive material and the second concentration of additive material are different.

11. The method of claim 10 , wherein the additive material modifies at least one property of the polishing layer selected from the group consisting of porosity, stiffness, surface energy, abrasiveness, conductivity, and chemical functionality.

12. The method of claim 5 , wherein the droplets of the
additive material are ejected using one or more nozzles which are different from the one or more nozzles used to eject the droplets of the base material.

13. The method of claim 5 , wherein a deposition rate for the additive material is independent from a deposition rate for the base material.

14. The method of claim 5 , wherein ejecting droplets of the additive material from one of the one or more nozzles controls a local concentration of the additive material disposed in or crosslinked with the polymerized base material.

15. A polishing pad, comprising:
a polishing layer comprising:
a plurality of printer deposited layers, wherein a first layer of the plurality of layers comprises:
a polymerized base material forming a polymer matrix; and
an additive material crosslinked with the base material in the polymer matrix,
wherein a concentration of the additive material in the polishing pad changes in a first direction or a second direction across the polishing pad, and
wherein the first direction is parallel to a polishing surface of the polishing pad and the second direction is orthogonal to the polishing surface.

16. The polishing pad of claim 15 , further comprising:
a backing layer integrally formed with the polishing layer, wherein the backing layer is formed from a different material than the base material of the polishing layer.

17. The polishing pad of claim 15 , wherein at least one of the plurality of layers comprising the polishing pad further comprises two or more discrete areas having different characteristics, wherein a first discrete area comprises a first concentration of additive material and a second discrete area comprises concentration of additive material and the second concentration of additive material are different.

Assignees

• Applied Materials Inc

Inventors

• Orilall Mahendra Christopher
• Michaelson Timothy
• Krishnan Kasiraman
• Bajaj Rajeev
• Patibandla Nag B
• Redfield Daniel
• Redeker Fred C
• Menk Gregory E

Classifications

• B33Y80/00

  Products made by additive manufacturing · CPC title

• B24B37/245

  Pads with fixed abrasives · CPC title

• B24B37/22 Primary

  characterised by a multi-layered structure · CPC title

• B24B37/26

  characterised by the shape of the lapping pad surface, e.g. grooved · CPC title

• B24D18/0045 Primary

  by stacking sheets of abrasive material · CPC title