Multi-layer transparent structures for electronic device housings

Patent metadata

Field	Value
Publication number	US-10320959-B2
Application number	US-201615338157-A
Country	US
Kind code	B2
Filing date	Oct 28, 2016
Priority date	Sep 29, 2011
Publication date	Jun 11, 2019
Grant date	Jun 11, 2019

Abstract

Transparent structures for portions of electronic device housings are disclosed. The transparent structures are formed from multiple layers of transparent (optically clear) materials. The multiple layers can include at least an outer glass layer and one or more other transparent layers that can be either glass or polymer layers. The multiple layers can be bonded together with one or more lamination layers. Accordingly, multi-layer transparent structures that are formed from multiple layers bonded together are able to be not only thin but also sufficiently strong and resistant to damage. The multi-layer transparent structures are well suited for use in consumer products, such as consumer electronic devices (e.g., portable electronic devices).

First claim

What is claimed is:

1. A housing for an electronic device comprising:
a multi-layer cover for the housing including:
a first glass layer having a first level of chemical strengthening to a first depth of layer and defining at least a portion of an external surface of the electronic device; and
a second glass layer bonded to the first glass layer and having a second level of chemical strengthening different from the first level of chemical strengthening, the second level of chemical strengthening to a second depth of layer that is less than the first depth of layer; and

a glass housing structure defining an opening and having sides and a bottom defining at least a portion of the external surface of the electronic device, the multi-layer cover positioned over the opening in the glass housing structure.

2. The housing of claim 1 , wherein the housing further comprises a lamination layer positioned between the first glass layer and the second glass layer.

3. The housing of claim 2 , wherein the first glass layer, the second glass layer, and the lamination layer are transparent.

4. The housing of claim 1 , wherein the multi-layer cover further comprises an additional layer bonded to the second glass layer.

5. The housing of claim 4 , wherein the additional layer is a glass layer.

6. The housing of claim 4 , wherein the additional layer is a polymer layer.

7. A housing for an electronic device comprising:
a front cover member for the housing including:
a first layer including a first chemically strengthened glass material having a first inner surface and a first outer surface, the first outer surface defining at least a first portion of an exterior surface of the housing and having a first compressive stress; and
a second layer including a second chemically strengthened glass material having a second inner surface and a second outer surface, the second inner surface having a second compressive stress that is less than the first compressive stress; and

a housing structure having glass sides and a bottom and defining at least a portion of an interior volume and a second portion of the exterior surface of the housing, the second inner surface of the front cover member coupled to the glass sides of the housing.

8. The housing of claim 7 , wherein the second outer surface is bonded to the first inner surface.

9. The housing of claim 8 , further comprising a lamination film bonded to the second outer surface and the first inner surface.

10. The housing of claim 7 , further comprising a third layer including a transparent material having a third inner surface and a third outer surface, the third outer surface being bonded to the first inner surface.

11. The housing of claim 10 , further comprising a first lamination film bonded to the third outer surface and the first inner surface and a second lamination film bonded to the third inner surface and the second outer surface.

12. The housing of claim 7 , wherein:
the first layer has a thickness from 0.5 mm to 2.5 mm; and
the second layer has a thickness from 0.5 mm to 2.5 mm.

13. An electronic device housing comprising:
a glass housing structure having sides and a bottom formed from glass and defining at least a first portion of an exterior surface of the electronic device housing; and
a cover structure attached to the glass housing structure and comprising:
a first glass layer having a first compressive stress profile with a first depth, the first glass layer defining at least a second portion of the exterior surface of the electronic device housing; and
a second glass layer bonded to the first glass layer and having a second compressive stress profile with a second depth that is less than the first depth.

14. The electronic device housing of claim 13 , wherein the first compressive stress profile has a first surface compressive stress and the second compressive stress profile has a second surface compressive stress, the second surface compressive stress being greater than the first surface compressive stress.

15. The electronic device housing of claim 13 , wherein the cover structure is substantially transparent.

16. The electronic device housing of claim 13 , wherein the cover structure comprises a display region.

17. The electronic device housing of claim 13 , wherein:
the first glass layer has a thickness less than or equal to 1 mm; and
the second glass layer has a thickness less than or equal to 1 mm.

Assignees

• Apple Inc

Inventors

• Wright Derek W
• Wodrich Justin R
• Rappoport Benjamin M

Classifications

• B32B17/10137

  Chemical strengthening · CPC title

• H04M1/0202 Primary

  Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets (constructional features of telephone transmitters or receivers, e.g. of speakers or microphones H04M1/03) · CPC title

• B32B17/10036

  comprising two outer glass sheets · CPC title

• B32B2307/412

  Transparent · CPC title

• Y10T156/10

  Methods of surface bonding and/or assembly therefor · CPC title