Systems for adhesive bonding of electronic devices

Patent metadata

Field	Value
Publication number	US-10319890-B2
Application number	US-201615006242-A
Country	US
Kind code	B2
Filing date	Jan 26, 2016
Priority date	Jan 26, 2015
Publication date	Jun 11, 2019
Grant date	Jun 11, 2019

Abstract

In accordance with certain embodiments, an apparatus for bonding electronic components such as light-emitting elements each to a connection point on a substrate via an adhesive includes a platform for supporting the substrate, a membrane for covering the electronic components, a source of pressure for urging the membrane against the electronic components, whereby pressure is applied between each electronic component and its corresponding connection point, and a source of energy for at least partially curing the adhesive.

First claim

What is claimed is:

1. A system for bonding a plurality of electronic components each to an electrically conductive connection point on a substrate via a conductive adhesive, the system comprising:
an adhesive dispense station for dispensing conductive adhesive to adhere the electronic components to the electrically conductive connection points, the adhesive dispense station comprising a reservoir containing conductive adhesive;
positioned to receive the electronic components and the substrate after dispensing of the conductive adhesive at the adhesive dispense station, a component placement station for placing the electronic components over the substrate with conductive adhesive between each electronic component and its corresponding connection point; and
a bonding apparatus comprising:
a platform for supporting the substrate;
a reusable membrane for covering at least some of electronic components;
a source of pressure for urging the membrane against the plurality of electronic components, whereby pressure is applied between each electronic component and its corresponding connection point with conductive adhesive therebetween; and
a source of energy for at least partially curing the conductive adhesive without laminating or adhering any portion of the membrane to the substrate or to the electronic components, the source of energy comprising an array of individually addressable heating elements within the platform.

2. The system of claim 1 , further comprising:
a test station for electronically and/or optically testing at least some of the electronic components after removal of the membrane therefrom.

3. The system of claim 2 , wherein:
the conductive adhesive comprises an anisotropic conductive adhesive.

4. The system of claim 2 , wherein:
the conductive adhesive comprises an isotropic conductive adhesive.

5. The system of claim 1 , wherein the source of pressure comprises a vacuum pump for inducing a negative pressure between the membrane and the substrate.

6. The system of claim 5 , wherein the vacuum pump is fluidly connected to a volume between the membrane and the substrate via an opening defined in the membrane.

7. The system of claim 1 , further comprising a control system configured to activate only heating elements disposed under portions of the substrate over which the electronic components are disposed.

8. The system of claim 7 , wherein the control system is configured to activate the heating elements based on a representation of positions of the electronic components over the substrate.

9. The system of claim 1 , wherein the source of pressure comprises a source of fluid pressure.

10. The system of claim 1 , wherein the membrane comprises a flexible membrane.

11. The system of claim 1 , wherein the source of pressure comprises a source of liquid or a source of gas.

12. The system of claim 1 , further comprising an autoclave chamber for receiving therewithin the substrate, the platform, and the membrane, wherein the autoclave chamber comprises the source of pressure and the source of energy.

13. The system of claim 1 , wherein the source of energy further comprises one or more second resistive heating elements that are part of the membrane.

14. The system of claim 1 , wherein the source of energy further comprises an ultraviolet light source.

15. The system of claim 1 , wherein at least one of the electronic components comprises a light-emitting element.

16. The system of claim 1 , wherein at least one of the electronic components comprises a light-emitting diode.

17. The system of claim 1 , further comprising:
a supply roll for supplying at least a portion of the substrate to the adhesive dispense station;
a take-up roll for receiving the at least a portion of the substrate downstream of the bonding apparatus,
wherein the component placement station is positioned downstream of the adhesive dispense station and upstream of the bonding apparatus.

18. The system of claim 1 , wherein the platform is substantially rigid.

19. The system of claim 1 , wherein the membrane is sized and shaped to cover only some of the electronic components on the substrate.

20. The system of claim 1 , further comprising a removable rigid force modifier for (i) placement between one of the electronic components and the membrane during pressure application and (ii) preventing conformal contact between the membrane and the one of the electronic components during pressure application, the removable rigid force modifier being configured such that, during pressure application, a first force is applied to the one of the electronic components, the first force being larger than a second force applied to at least one of the other electronic components disposed beneath the membrane.

21. The system of claim 1 , wherein a stiffness of the membrane is sufficient to prevent conformal contact between the membrane and underlying electronic components and the substrate.

22. The system of claim 1 , further comprising a control system configured to activate selected ones of the heating elements to apply heat to different portions of the substrate at different magnitudes, whereby different ones of the electronic components are heated at different magnitudes.

23. The system of claim 1 , further comprising a control system configured to activate different ones of the heating elements at different times during the application of pressure.

24. The system of claim 1 , wherein different ones of the heating elements are configured to apply heat at different magnitudes.

25. The system of claim 1 , wherein the heating elements are configured to at least partially cure the conductive adhesive via application of heat without application of optical radiation.

Assignees

• Tischler Michael A
• Amini Alborz
• Cooledge Lighting Inc

Inventors

• Tischler Michael A
• Amini Alborz

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07125

  Means for controlling the bonding environment, e.g. valves or vacuum pumps · CPC title