Cooler and cooler fixing method

Patent metadata

Field	Value
Publication number	US-10319665-B2
Application number	US-201515108275-A
Country	US
Kind code	B2
Filing date	Apr 23, 2015
Priority date	Jun 19, 2014
Publication date	Jun 11, 2019
Grant date	Jun 11, 2019

Abstract

A cooler for cooling a semiconductor module to be secured to a base, the cooler including: a cooler body that includes a refrigerant flow path surrounded by a first wall part having a first through-hole, a second wall part that is arranged facing the first wall part and that includes a connection region which is to be connected to the base at a position opposing the first through-hole, and a side wall part for connecting the periphery of the first wall part and the periphery of the second wall part; and a lid for closing off the first through-hole.

First claim

The invention claimed is:

1. A cooler for cooling a semiconductor module, the cooler being securable to a base, and the cooler comprising:
a cooler body that comprises a refrigerant flow path defined by (i) a first wall part having a first through-hole, (ii) a second wall part that is arranged facing the first wall part and that comprises a connection region which is connectable to the base at a position opposing the first through-hole, the connection region of the second wall part having a second through-hole, and a maximum inner diameter of the first through hole being greater than a maximum inner diameter of the second through-hole, and (iii) a side wall part for connecting a periphery of the first wall part and a periphery of the second wall part; and
a lid for closing off the first through-hole.

2. The cooler according to claim 1 , wherein the cooler further comprises a securing member small enough to be capable of passing through the first through-hole, the securing member being inserted through the second through-hole to secure the cooler body to the base.

3. The cooler according to claim 2 , wherein an inner diameter of a refrigerant-flow-path-side of the second through-hole is greater than an inner diameter of a base-side of the second through-hole.

4. The cooler according to claim 3 , wherein:
the securing member comprises a screw having a head part and a screw part; and
the refrigerant-flow-path side of the second through-hole comprises a groove which accommodates the head part of the screw such that the head part does not protrude into the refrigerant flow path.

5. The cooler according to claim 4 , further comprising a seal member between the second through-hole and the securing member.

6. The cooler according to claim 3 , further comprising a seal member between the second through-hole and the securing member.

7. The cooler according to claim 2 , further comprising a seal member between the second through-hole and the securing member.

8. The cooler according to claim 1 , wherein a wall part is provided in the connection region of the second wall part such that a wall thickness of the wall part is less than a wall thickness in other regions of the second wall part.

9. The cooler according to claim 1 , wherein a plurality of fins are connected so as not to block the first through-hole on a refrigerant-flow-path side of the first wall part.

10. The cooler according to claim 1 , wherein the lid is detachable from the first wall part.

11. The cooler according to claim 1 , wherein the lid, when fully received in the first through-hole, does not to protrude from a refrigerant-flow-path side of the first wall part into the refrigerant flow path.

12. The cooler according to claim 1 , wherein:
the semiconductor module is securable to an outer side of the first wall part; and
a thickness of the first wall part is less than a thickness of the second wall part.

Assignees

• Fuji Electric Co Ltd

Inventors

• Maruyama Ryo

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title