Superconducting wire material having laminated structure and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-10319500-B2
Application number	US-201314900103-A
Country	US
Kind code	B2
Filing date	Dec 10, 2013
Priority date	Jun 28, 2013
Publication date	Jun 11, 2019
Grant date	Jun 11, 2019

Abstract

Disclosed is a method for manufacturing a superconducting wire material having a laminated structure. The present invention provides a method for manufacturing a laminated superconducting wire material, comprising the steps of: providing a deposition substrate having a predetermined width; sequentially forming, on the deposition substrate, a laminated structure including a buffer layer, a superconducting layer and a stabilization layer, thereby forming, on both sides of the deposition substrate, regions in which a metal substrate is exposed in the width direction; providing a lamination substrate, having a width corresponding to the deposition substrate, to the laminated structure; and providing solder to the regions, in which the metal substrate is exposed, to thereby bond the deposition substrate and the lamination substrate.

First claim

What is claimed is:

1. A superconducting wire material comprising:
a deposition substrate having a first width;
a laminated structure comprising a buffer layer, a superconducting layer and a stabilization layer sequentially disposed on the deposition substrate, the buffer layer being disposed directly on the deposition substrate, the laminated structure having a second width which is smaller than the first width and recessed spaces at both ends in a width direction;
a lamination substrate having a third width that is substantially the same as the first width of the deposition substrate; and
a solder filling the recessed spaces thereby soldering the deposition substrate with the lamination substrate,
wherein the stabilization layer includes first and second layers, the first layer including any one of gold, silver, platinum, palladium, and a combination thereof, the second layer including any one of copper, aluminum, and a combination thereof.

2. The superconducting wire material of claim 1 , wherein the lamination substrate comprises one material selected from the group consisting of stainless steel, a copper alloy and a nickel alloy.

3. The superconducting wire material of claim 1 , wherein the solder comprises at least one metal selected from the group consisting of silver, lead, tin, bismuth, aluminum, zinc and indium, or an alloy thereof.

Assignees

• Keri Korea Electrotechnology Res Inst

Inventors

• Ko Rock Kil
• Kim Seog Whan
• Jo Young Sik
• Ha Dong Woo

Classifications

• B23K26/364

  for making a groove or trench, e.g. for scribing a break initiation groove · CPC title

• H01B13/0036 Primary

  Details · CPC title

• B23K26/402

  involving non-metallic material, e.g. isolators · CPC title

• B23K1/20

  Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating · CPC title

• H01L39/2461

  Electricity · mapped topic