Touch device
US-2017371461-A1 · Dec 28, 2017 · US
US10318789B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10318789-B2 |
| Application number | US-201715475989-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 31, 2017 |
| Priority date | Jun 10, 2016 |
| Publication date | Jun 11, 2019 |
| Grant date | Jun 11, 2019 |
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A display device includes a display panel, a fingerprint recognition sensor on the display panel, and a cover glass on the fingerprint recognition sensor. The cover glass is defined with at least one groove on a surface that faces the display panel.
Opening claim text (preview).
What is claimed is: 1. A display device, comprising: a display panel; a fingerprint recognition sensor on the display panel; and a cover glass on the fingerprint recognition sensor, wherein: the cover glass is defined with at least one groove on a surface that faces the display panel; and the groove has an arch-shaped cross-section having a continuous curvature such that a thickness of the cover glass decreases in a gradual manner from an edge of the groove to a central portion of the groove. 2. The display device of claim 1 , wherein the fingerprint recognition sensor is accommodated in the groove. 3. The display device of claim 1 , wherein the cover glass has a greater residual stress within the groove. 4. The display device of claim 3 , wherein the groove of the cover glass has a residual stress in a range of 1 MPa to 10 MPa. 5. The display device of claim 1 , wherein the cover glass has a minimum thickness at a central portion of the groove, and the minimum thickness is from 5 percent (%) to 95% of a thickness of the cover glass. 6. The display device of claim 5 , wherein the minimum thickness is from 5% to 30% of the thickness of the cover glass. 7. The display device of claim 2 , further comprising an adhesive member between the groove and the fingerprint recognition sensor. 8. The display device of claim 7 , further comprising a high dielectric material between the groove and the adhesive member. 9. The display device of claim 8 , wherein the high dielectric material comprises at least one material selected from the group consisting of low melting glass (LMG), ZnO, Al 2 O 3 , Ta 2 O 5 , TiO 2 , ZrO 2 , La 2 O 3 , and Y 2 O 3 . 10. The display device of claim 8 , wherein the high dielectric material has a thickness in a range of 10 μm to 100 μm. 11. A method of manufacturing a display device, the method comprising: defining a groove in a cover glass; accommodating a fingerprint recognition sensor in the groove; and coupling the cover glass and a display panel, wherein: the defining of the groove in the cover glass comprises: contacting a heat source with a portion of the cover glass to be defined with the groove; moving the heat source at a predetermined speed to chamfer the cover glass; and cooling the cover glass rapidly; the defining of the groove in the cover glass further comprises disposing a high dielectric material in the groove; and the high dielectric material is LMG comprising material selected from the group consisting of selenium, potassium, arsenic, and sulfur. 12. The method of claim 11 , wherein the cover glass has a greater residual stress within the groove. 13. The method of claim 12 , wherein the groove of the cover glass has a residual stress in a range of 1 Mpa to 10 Mpa. 14. The method of claim 11 , wherein the cover glass has a minimum thickness at a central portion of the groove, and the minimum thickness is in a range from 5% to 95% of a thickness of the cover glass. 15. The method of claim 14 , wherein the minimum thickness is in a range from 5% to 30% of the thickness of the cover glass. 16. The method of claim 11 , wherein the heat source has a temperature in a range from 1200° C. to 1600° C. 17. The method of claim 11 , wherein the heat source contacts the cover glass at a pressure is in a range from 100 kgf to 500 kgf. 18. The method of claim 11 , wherein the groove has an arch-shaped cross-section. 19. The method of claim 11 , wherein the high dielectric material is selected from the group consisting of low melting glass (LMG), ZnO, Al 2 O 3 , Ta 2 O 5 , TiO 2 , ZrO 2 , La 2 O 3 , and Y 2 O 3 . 20. The method of claim 11 , wherein the high dielectric material is disposed in the groove to a thickness in a range of 10 μm to 100 μm. 21. The method of claim 11 , wherein the fingerprint recognition sensor is accommodated in the groove with an adhesive member. 22. The display device of claim 8 , wherein the high dielectric material is LMG comprising material selected from the group consisting of selenium, potassium, arsenic, and sulfur. 23. The display device of claim 1 , wherein the groove has a maximum depth at the central portion of the groove, and the maximum depth is greater than a thickness of the fingerprint recognition sensor.
Oxides (C03C17/02 takes precedence) · CPC title
with glass (C03C17/34, C03C17/44 take precedence) · CPC title
Physics · mapped topic
Physics · mapped topic
non-optical, e.g. ultrasonic or capacitive sensing · CPC title
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