Magnetic field sensor package

Patent metadata

Field	Value
Publication number	US-10317478-B2
Application number	US-201414913558-A
Country	US
Kind code	B2
Filing date	Aug 21, 2014
Priority date	Aug 21, 2013
Publication date	Jun 11, 2019
Grant date	Jun 11, 2019

Abstract

A magnetic field sensor package according to an embodiment includes: a package body; a magnetic field sensor disposed on top of the package body and including a sensor assembly in which a displacement is generated by a magnetic field; and a conductive line formed on the package body, which is for making current to be measured flow and generating a magnetic field for displacing the sensor assembly, wherein the conductive line generates a magnetic field applied in a perpendicular direction to the sensor assembly.

First claim

The invention claimed is:

1. A magnetic field sensor package comprising:
a package body;
a conductive line provided on the package body to allow current to be measured to flow;
a magnetic field sensor provided on the package body, comprising a sensor assembly displaced by a magnetic field, a first driving electrode having a path that reference current flows and movable by the magnetic field of the current to be measured, and a second driving electrode having the path that the reference current flows and movable by the magnetic field of the current to be measured, and sensing the magnetic field generated by the current to be measured, wherein variation in a capacitance formed as the first driving electrode and the second driving electrode move while floating is measured;
a magnetic substance formed at a peripheral part of the conductive line to transfer a magnetic field generated through the conductive line to the magnetic field sensor, and
a protective layer on the package body to surround the magnetic field sensor and the conductive line.

2. The magnetic field sensor package of claim 1 , wherein the conductive line is spaced apart from the sensor assembly in the magnetic field sensor.

3. The magnetic field sensor package of claim 2 , wherein the magnetic field sensor is disposed on the conductive line and the magnetic substance.

4. The magnetic field sensor package of claim 3 , wherein a bottom part of the magnetic field sensor comprises
a first part directly contacted with the conductive line, and
a second part directly contacted with the magnetic substance.

5. The magnetic field sensor package of claim 4 , wherein the magnetic substance is formed vertically under the sensor assembly in a direction perpendicular to an extension direction of the sensor assembly.

6. The magnetic field sensor package of claim 5 , wherein a top surface of the magnetic substance is located vertically under a region formed therein with the sensor assembly and overlapped with the region formed therein with the sensor assembly.

7. The magnetic field sensor package of claim 5 , further comprising a conductive line pad on the package body and directly connected with the conductive line.

8. The magnetic field sensor package of claim 7 , wherein the package body is formed therein with a groove, and the magnetic substance is inserted into the groove while being vertically erected.

9. The magnetic field sensor package of claim 8 , wherein a top surface of the magnetic substance is exposed through a surface of the package body, and the magnetic field sensor is attached to the exposed top surface of the magnetic substance and a top surface of the conductive line.

10. The magnetic field sensor package of claim 8 , further comprising a coil wound around the magnetic substance.

11. The magnetic field sensor package of claim 10 , wherein the coil is formed of a same material as that of the conductive line and with a thickness equal to that of the conductive line.

12. The magnetic field sensor package of claim 8 , wherein the conductive line is spaced apart from the magnetic substance inserted into the groove by a predetermined distance to surround a peripheral part of the magnetic substance.

13. The magnetic field sensor package of claim 8 , further comprising a connection line disposed in the groove and to connect the conductive line with the coil.

14. The magnetic field sensor package of claim 5 , wherein the conductive line is formed to partially circle around a first region formed in the package body, and the first region is located vertically under a second region formed therein with the sensor assembly to be overlapped with at least a portion of the second region when viewed from a top of the package body.

15. The magnetic field sensor package of claim 14 , wherein the magnetic substance is buried in the first region, and the conductive line is spaced apart from the magnetic substance by a predetermined distance to surround a peripheral part of the magnetic substance.

16. The magnetic field sensor package of claim 14 , wherein the conductive line is located vertically under the second region and arranged in a region that is not overlapped with the second region.

17. The magnetic field sensor package of claim 2 , further comprising a control device provided on the package body and adjacent to the magnetic field sensor.

18. The magnetic field sensor package of claim 2 , wherein the magnetic field sensor further comprises
a substrate.

19. The magnetic field sensor package of claim 1 , wherein the conductive line generates a magnetic field applied perpendicularly to the sensor assembly.

Assignees

• Lg Innotek Co Ltd

Inventors

• Seo Sang Won
• Seo Jeong Gi
• Kim Chul
• Ko Yong Jun
• Choi Wan Seop

Classifications

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/752

  between stacked chips · CPC title

• G01R33/06 Primary

  using galvano-magnetic devices · CPC title

• G01R33/0052

  Manufacturing aspects; Manufacturing of single devices, i.e. of semiconductor magnetic sensor chips (devices based on galvano-magnetic effect or the like H10N50/85) · CPC title