Integrated multi-sensor module

Patent metadata

Field	Value
Publication number	US-10317357-B2
Application number	US-201816128076-A
Country	US
Kind code	B2
Filing date	Sep 11, 2018
Priority date	Mar 29, 2013
Publication date	Jun 11, 2019
Grant date	Jun 11, 2019

Abstract

A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.

First claim

The invention claimed is:

1. A method, comprising:
forming a first sensor on a substrate, the first sensor including a first conductive layer and a first dielectric film;
forming a second sensor on the substrate, the second sensor including a second conductive layer and a second dielectric film;
forming a third sensor on the substrate, the third sensor including a third conductive layer and a cavity; and
forming a fourth conductive layer on the substrate, the first conductive layer, the second conductive layer, and the third conductive layer being spaced from the fourth conductive layer by the first dielectric film, the second dielectric film, and the cavity, respectively.

2. The method of claim 1 wherein the first sensor is a first pressure sensor, the second sensor is a humidity sensor, and the third sensor is a second pressure sensor.

3. The method of claim 2 wherein the third sensor is positioned between the first sensor and the second sensor.

4. The method of claim 2 , further comprising:
forming a temperature sensor on the substrate.

5. The method of claim 4 wherein the temperature sensor includes a Wheatstone bridge.

6. The method of claim 1 , further comprising:
forming a cap that covers the first sensor and the third sensor, the cap including an opening that exposes the second sensor to an external environment.

7. The method of claim 1 wherein the first conductive layer, the second conductive layer, and the third conductive layer each include a plurality of through holes.

8. A method, comprising:
forming a first sensor on a substrate, the first sensor including a first conductive plate having a first plurality of through holes, a second conductive plate, and a cavity that separates the first conductive plate from the second conductive plate; and
forming a second sensor on the substrate, the second sensor including a third conductive plate having a second plurality of through holes, a fourth conductive plate, and a dielectric film that separates the third conductive plate from the fourth conductive plate.

9. The method of claim 8 wherein the second conductive plate of the first sensor and the fourth conductive plate of the second sensor are electrically coupled to each other.

10. The method of claim 8 wherein the first sensor is a pressure sensor and the second sensor is a humidity sensor.

11. The method of claim 8 , further comprising:
forming a third sensor on the substrate; and
forming a cap on the first sensor and the third sensor, the cap including an opening that exposes the second sensor to an external environment.

12. The method of claim 11 wherein the first sensor is a pressure sensor, the second sensor is a humidity sensor, and the third sensor is a temperature sensor.

13. The method of claim 8 wherein the first plurality of through holes are arranged in a first array including a plurality of rows and columns, and the second plurality of through holes are arranged in a second array including a plurality of rows and columns.

Assignees

• St Microelectronics Pte Ltd

Inventors

• Le Neel Olivier
• Shankar Ravi
• Cherian Suman
• Leung Calvin
• Loh Tien-Choy
• Kam Shian-Yeu

Classifications

• H10W90/00

  Package configurations · CPC title

• G01L9/12

  by making use of variations in capacitance {, i.e. electric circuits therefor} · CPC title

• G01K7/01

  using semiconducting elements having PN junctions (G01K7/02, G01K7/16, G01K7/30 take precedence) · CPC title

• G01D21/02

  Measuring two or more variables by means not covered by a single other subclass · CPC title

• G01K7/16

  using resistive elements · CPC title