Porous plate-shaped filler, heat insulation film, and method for producing porous plate-shaped filler

US10317004B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10317004-B2
Application numberUS-201615284798-A
CountryUS
Kind codeB2
Filing dateOct 4, 2016
Priority dateApr 17, 2014
Publication dateJun 11, 2019
Grant dateJun 11, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A porous plate-shaped filler is a plate shape having an aspect ratio of 3 or more, and has a minimum length of 0.1 to 50 μm and a porosity of 20 to 90%. Furthermore, the porous plate-shaped filler 1 includes plate-shaped pores 2 having an aspect ratio of 1.5 or more. Consequently, in the porous plate-shaped filler, a thermal conductivity is low. The heat insulation film includes the porous plate-shaped filler, whereby a heat insulation effect of the heat insulation film can improve.

First claim

Opening claim text (preview).

The invention claimed is: 1. A porous plate-shaped filler which is a plate shape having a length to thickness aspect ratio of 3 or more, has a thickness of 0.1 to 50 μm and a porosity of 20 to 90%, and includes plate-shaped pores having an aspect ratio of 1.5 or more. 2. The porous plate-shaped filler according to claim 1 , wherein in a cross section in the thickness direction of the porous plate-shaped filler, an average of angles between directions of thicknesses of the pores and the thickness direction of the porous plate-shaped filler is 45° or less. 3. The porous plate-shaped filler according to claim 1 , wherein a thermal conductivity in the thickness direction of the porous plate-shaped filler is 1 W/(m·K) or less. 4. A heat insulation film which includes the porous plate-shaped filler according to claim 1 . 5. The heat insulation film according to claim 4 , wherein the thermal conductivity in a thickness direction is 1.5 W/(m·K) or less. 6. A method for producing the porous plate-shaped filler according to claim 1 , which comprises: preparing a slurry including a plate-shaped pore former having an aspect ratio of 1.5 or more; and firing the pore former to produce the porous plate-shaped filler including the plate-shaped pores having an aspect ratio of 1.5 or more. 7. The method for producing the porous plate-shaped filler according to claim 6 , wherein a viscosity of the slurry is from 100 to 90000 cps.

Assignees

Inventors

Classifications

  • Aluminium oxides or hydroxides · CPC title

  • Treatment with macromolecular organic compounds {(C09C3/006 takes precedence)} · CPC title

  • Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof (treating slag with gases or gas generating material C04B5/06 {; expanded graphite C04B35/536}) · CPC title

  • Nanoplates, i.e. plate-like particles with a thickness from 1-100 nanometer · CPC title

  • Titanium dioxide · CPC title

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What does patent US10317004B2 cover?
A porous plate-shaped filler is a plate shape having an aspect ratio of 3 or more, and has a minimum length of 0.1 to 50 μm and a porosity of 20 to 90%. Furthermore, the porous plate-shaped filler 1 includes plate-shaped pores 2 having an aspect ratio of 1.5 or more. Consequently, in the porous plate-shaped filler, a thermal conductivity is low. The heat insulation film includes the porous …
Who is the assignee on this patent?
Ngk Insulators Ltd
What technology area does this patent fall under?
Primary CPC classification C09D7/62. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 11 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).