Nitrogen-containing ligands and their use in atomic layer deposition methods

US10315995B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10315995-B2
Application numberUS-201715407369-A
CountryUS
Kind codeB2
Filing dateJan 17, 2017
Priority dateOct 29, 2010
Publication dateJun 11, 2019
Grant dateJun 11, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Methods for deposition of elemental metal films on surfaces using metal coordination complexes comprising nitrogen-containing ligands are provided. Also provided are nitrogen-containing ligands useful in the methods of the invention and metal coordination complexes comprising these ligands.

First claim

Opening claim text (preview).

What is claimed is: 1. A metal coordinating ligand having a formula wherein each R is independently hydrogen, C 1-6 alkyl, acyl, aldehyde, keto or C 2-4 alkenyl, provided that at least one of R 1 , R 2 , R 3 and R 4 is not methyl. 2. A metal coordination complex which has a formula wherein each R is independently hydrogen, C 1-6 alkyl, acyl, aldehyde, keto or C 2-4 alkenyl, L is one or more neutral, anionic or mixed ligands, and M is a transition metal ion or a boron group ion, provided that at least one of R 1 , R 2 , R 3 and R 4 is not methyl. 3. The metal coordination complex of claim 2 , wherein the transition metal ion or the boron group ion is selected from the group consisting of aluminum, titanium, tungsten, zirconium, vanadium, niobium, tantalum, chromium, molybdenum, palladium, platinum, rhodium, iridium, silver, gold, hafnium, manganese, ruthenium and copper. 4. An apparatus comprising: a deposition chamber; and the metal coordination complex of claim 2 . 5. The apparatus of claim 4 , wherein the metal coordination complex is in the vapor phase.

Assignees

Inventors

Classifications

  • having amino groups bound to two or three six-membered aromatic rings · CPC title

  • without C-boron linkages · CPC title

  • Compounds containing elements of Groups 1 or 11 of the Periodic Table · CPC title

  • Radicals substituted by nitrogen atoms not forming part of a nitro radical · CPC title

  • compounds without a metal-carbon linkage · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10315995B2 cover?
Methods for deposition of elemental metal films on surfaces using metal coordination complexes comprising nitrogen-containing ligands are provided. Also provided are nitrogen-containing ligands useful in the methods of the invention and metal coordination complexes comprising these ligands.
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification C07D213/38. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 11 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).