Bonding of composite materials

Patent metadata

Field	Value
Publication number	US-10315404-B2
Application number	US-201715707160-A
Country	US
Kind code	B2
Filing date	Sep 18, 2017
Priority date	Nov 3, 2014
Publication date	Jun 11, 2019
Grant date	Jun 11, 2019

Abstract

A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.

First claim

What is claimed is:

1. A bonding method comprising:
(a) providing a first composite substrate comprising reinforcing fibers infused or impregnated with a first curable matrix resin;
(b) applying a resin film onto a surface of the first composite substrate, said resin film is formed from a second curable matrix resin, which is formulated to cure at a slower rate than the first curable matrix resin;
(c) co-curing the first composite substrate and the resin film until the first composite substrate is fully cured but the resin film remains partially cured, thereby providing a bondable surface with chemically-active functional groups;
(e) joining the cured, first composite substrate to a second composite substrate with a curable adhesive film in between the composite substrates,
wherein the curable adhesive film comprises chemically-active functional groups capable of reacting with the chemically-active functional groups on the bondable surface of the first composite substrate; and
(f) curing the adhesive film to form a covalently bonded structure.

2. The bonding method of claim 1 , wherein the second composite substrate is cured prior to being joined to the cured, first composite substrate.

3. The bonding method of claim 1 , wherein the second composite substrate is uncured or partially cured prior to being joined to the first composite substrate, and during curing at (f), the adhesive film and the second composite substrate are cured simultaneously.

4. The bonding method of claim 1 , wherein the first and second curable matrix resins comprise different curing agents that are selected to affect curing at different rates.

5. The bonding method of claim 4 , wherein
the first and second curable matrix resins comprise one or more epoxy resins,
the curing agents for the first and second curable matrix resins are selected from: melamine and substituted melamine derivatives, polymercaptan, polyamide, aliphatic polyamine, aromatic polyamine derivatives, tertiary amine boron trifluoride complex, acid anhydride, imidazoles, aromatic polyamine, cyanoguanadine, and phenol novolac, and
the curing agents for the first and second curable matrix resins are selected to enable the first matrix resin to cure at a faster rate relative to that of the second matrix resin.

6. The method of claim 1 , wherein the second curable matrix resin comprises one or more thermoset resins, a curing agent, and an inhibitor which can slow the rate of reaction between the one or more thermoset resins and the curing agent in the second matrix resin.

7. The method of claim 6 , wherein said inhibitor is selected from: boric acid; trifluoroborane; alkyl borane, trimethoxyboroxine, organic acids having a pKa from 1 to 3, metal oxides, metal hydroxides, alkoxides of metal, and combinations thereof.

Assignees

• Cytec Ind Inc

Inventors

• Macadams Leonard
• Kohli Dalip

Classifications

• B05D3/007

  After-treatment · CPC title

• B29C66/73753

  the to-be-joined area of at least one of the parts to be joined being partially cured, i.e. partially cross-linked, partially vulcanized · CPC title

• C09J5/02

  involving pretreatment of the surfaces to be joined · CPC title

• C09J2463/008

  in the pretreated surface to be joined · CPC title

• B29C65/4835

  Heat curing adhesives · CPC title