Ultrasonic transducer

US10315224B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10315224-B2
Application numberUS-201615154899-A
CountryUS
Kind codeB2
Filing dateMay 13, 2016
Priority dateMay 20, 2015
Publication dateJun 11, 2019
Grant dateJun 11, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Systems and techniques are provided for an ultrasonic transducer. A substrate may include a main cavity, a secondary cavity, and a channel. The main cavity may have a greater depth than the secondary cavity. The secondary cavity may have a greater depth than channel. A first step may be formed where the main cavity and the secondary cavity overlap. A second step may be formed where the secondary cavity and the main cavity overlap. An electromechanically active device may be attached to the substrate at the first step and the second step such that a free end of the electromechanically active device is suspended over the main cavity. A membrane section may be bonded to the substrate such that the membrane covers the main cavity and the secondary cavity and is bonded to the free end of the electromechanically active.

First claim

Opening claim text (preview).

The invention claimed is: 1. An ultrasonic transducer comprising: a substrate comprising a main cavity, a secondary cavity, and a channel, wherein the main cavity has a greater depth than the secondary cavity, the secondary cavity has a greater depth than the channel, a first step is formed at a location between the main cavity and the secondary cavity, and a second step is formed at a location between the secondary cavity and the channel overlap; an electromechanically active device attached to the substrate at the first step and the second step such that a free end of the electromechanically active device is suspended over a bottom of the main cavity; and a membrane bonded to the substrate such that the membrane covers the main cavity and the secondary cavity and is bonded to the free end of the electromechanically active device such that vibration of the electromechanically active device at ultrasonic frequencies causes the membrane to vibrate at ultrasonic frequencies. 2. The ultrasonic transducer of claim 1 , wherein the membrane comprises a material impedance matched with the air. 3. The ultrasonic transducer of claim 1 , wherein the substrate further comprises a first trench creating a flat riser for the first step and a second trench creating a flat riser for the second step. 4. The ultrasonic transducer of claim 1 , further comprising a PCB bonded to the substrate, the PCB comprising at least one conductive layer. 5. The ultrasonic transducer of claim 4 , further comprising a first via disposed in the first step and a second via disposed in the second step, the first via and the second via descending through the substrate to connect the at least one conductive layer of the PCB. 6. The ultrasonic transducer of claim 5 , wherein a first electrode of the electromechanically active device is bonded to the first via and a second electrode of the electromechanically active device is bonded to the second via. 7. The ultrasonic transducer of claim 1 , wherein the substrate comprises a material with greater rigidity than FR-4. 8. The ultrasonic transducer of claim 4 , further comprising a rigid mass bonded to the PCB. 9. The ultrasonic transducer of claim 1 , wherein the electromechanically active device comprises a piezoceramic unimorph or a piezoceramic bimorph.

Assignees

Inventors

Classifications

  • using a piezoelectric bender, e.g. bimorph · CPC title

  • B06B1/0666Primary

    used as a diaphragm · CPC title

  • using piezoelectric driving means {(G10K9/121 takes precedence)} · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10315224B2 cover?
Systems and techniques are provided for an ultrasonic transducer. A substrate may include a main cavity, a secondary cavity, and a channel. The main cavity may have a greater depth than the secondary cavity. The secondary cavity may have a greater depth than channel. A first step may be formed where the main cavity and the secondary cavity overlap. A second step may be formed where the secondar…
Who is the assignee on this patent?
Ubeam Inc
What technology area does this patent fall under?
Primary CPC classification B06B1/0666. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 11 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).