Chip device and a particle analyzing apparatus

Patent metadata

Field	Value
Publication number	US-10315194-B2
Application number	US-201615260849-A
Country	US
Kind code	B2
Filing date	Sep 9, 2016
Priority date	Aug 3, 2011
Publication date	Jun 11, 2019
Grant date	Jun 11, 2019

Abstract

A chip device is provided. The chip device includes a flow channel configured to pass a fluid therein; an ejection portion including an opening toward an end face of a substrate layer including at least one layer, the ejection portion is configured to provide the fluid from the flow channel, and a cavity provided between the opening of the ejection portion and the end face of the substrate layer, wherein at least a portion of the cavity is provided at the end face of the substrate layer.

First claim

The invention claimed is:

1. A chip device comprising:
a flow channel configured to pass a fluid therein;
an ejection portion including an opening toward an end face of a substrate layer including at least one layer, the ejection portion is configured to provide the fluid from the flow channel, and
a cavity provided between the opening of the ejection portion and the end face of the substrate layer,
wherein at least a portion of the cavity is provided at the end face of the substrate layer, and
wherein the opening has a width different from the portion of the cavity at the end face of the substrate layer.

2. The chip device according to claim 1 , further comprising a connection portion having a linear shape, wherein the connection portion is configured to connect the flow channel with the ejection portion.

3. The chip device according to claim 2 , wherein the substrate layer is formed by injection molding.

4. The chip device according to claim 3 , wherein the substrate layer is formed by thermocompression bonding.

5. The chip device according to claim 4 , wherein
the cavity has a width of 0.2 millimeters or more in corresponding with a distance between the opening of the ejection portion and the end face of the substrate layer.

6. The chip device according to claim 5 , wherein
the chip device is configured to be used in a particle analyzing apparatus.

7. The chip device according to claim 1 , wherein
the cavity is broader than the opening of the ejection portion.

8. The chip device according to claim 1 , wherein the cavity includes an octagonal shape.

9. The chip device according to claim 1 , further comprising a suction channel, wherein the suction channel is connected with the flow channel via a communicating port.

10. The chip device according to claim 1 , further comprising a first tapered portion, wherein the first tapered portion is provided between the flow channel and the opening of the ejection portion.

11. The chip device according to claim 1 , wherein the chip device includes two substrate layers and wherein the flow channel is formed by at least two layers and the flow channel is at one or both of the two substrate layers.

12. The chip device according to claim 1 , wherein the cavity has a width at least twice larger than the opening.

13. A particle analyzing apparatus comprising:
a chip device configured to convey a fluid;
an optical detector; and
a plurality of electrodes,
wherein the chip device includes
a flow channel configured to pass a fluid therein;
an ejection portion including an opening toward an end face of a substrate layer including at least one layer, the ejection portion is configured to provide the fluid from the flow channel, and
a cavity provided between the opening of the ejection portion and the end face of the substrate layer,
wherein at least a portion of the cavity is provided at the end face of the substrate layer, and
wherein the opening has a width different from the portion of the cavity at the end face of the substrate layer.

14. The particle analyzing apparatus according to claim 13 , wherein the cavity is broader than the opening of the ejection portion.

15. The particle analyzing apparatus according to claim 13 , wherein the substrate layer is formed by injection molding.

16. The particle analyzing apparatus according to claim 13 , wherein the substrate layer is formed by thermocompression bonding.

17. The particle analyzing apparatus according to claim 13 , wherein the optical detector includes a laser light source, an irradiation system and a detection system.

18. The particle analyzing apparatus according to claim 13 , further comprising a vibrating device, wherein the vibrating device is configured to vibrate the device.

19. The particle analyzing apparatus according to claim 13 , wherein the cavity includes an octagonal shape.

20. The particle analyzing apparatus according to claim 13 , further comprising a ground electrode, wherein the ground electrode is provided between the cavity and the electrodes.

21. The particle analyzing apparatus according to claim 13 , further comprising a second tapered portion, wherein the second tapered portion is downstream of the first tapered portion and is provided between the flow channel and the opening of the ejection portion.

Assignees

• Sony Corp

Inventors

• Akiyama Yuji
• Akiyama Shoji
• Yamasaki Takeshi

Classifications

• B01L3/502761

  specially adapted for handling suspended solids or molecules independently from the bulk fluid flow, e.g. for trapping or sorting beads or physically stretching molecules · CPC title

• G01N15/1484

  microstructural devices · CPC title

• B01L2200/12

  Specific details about manufacturing devices · CPC title

• B01L2400/0487

  fluid pressure, pneumatics · CPC title

• B01L2300/0887

  Laminated structure · CPC title