Cooling device, method for producing a cooling device and power circuit

Patent metadata

Field	Value
Publication number	US-10314208-B2
Application number	US-201515325266-A
Country	US
Kind code	B2
Filing date	Apr 2, 2015
Priority date	Jul 10, 2014
Publication date	Jun 4, 2019
Grant date	Jun 4, 2019

Abstract

The present disclosure relates to cooling devices. The teachings thereof may be embodied in methods for producing cooling devices and power circuits equipped with a cooling device. Embodiments may include cooling device having an aluminum cooling element; and at least one nickel metal sheet connected to the aluminum cooling element by a solder layer; wherein the cooling device includes a mounting surface formed by a side of the at least one nickel metal sheet facing away from the aluminum cooling element.

First claim

What is claimed is:

1. A cooling device comprising:
an aluminum cooling element;
a nickel metal sheet soldered directly to the aluminum cooling element, wherein the nickel metal sheet contains at least 95% by mass of nickel and the nickel metal sheet has a thickness of at least 200 μm; and
a mounting surface defined by a side of the nickel metal sheet facing away from the aluminum cooling element.

2. The cooling device as claimed in claim 1 , wherein:
the aluminum cooling element comprises a plurality of aluminum sheets stacked above one another and connected to one another; and
at least one aluminum sheet includes cutouts forming a cooling channel covered by a second at least one of the aluminum sheets.

3. The cooling device as claimed in claim 2 , wherein the aluminum sheets are connected to one another by solder layers.

4. The cooling device as claimed in claim 2 , wherein the aluminum sheets comprise rolled aluminum sheets soldered by hard solder.

5. A method for producing the cooling device of claim 1 , the method comprising:
applying a solder material to a connecting surface of a plurality of aluminum sheets;
stacking the plurality of aluminum sheets;
melting the solder material to form at least one first solder layer between two respective aluminum sheets by heating the stacked aluminum sheets and the solder material, forming the aluminum cooling element; and
arranging the nickel metal sheet on an outer side of the aluminum cooling element, with solder material in direct contact with both the nickel metal sheet and the aluminum cooling element;
wherein the solder material located between the nickel metal sheet and the aluminum cooling element melts during the heating of the stacked aluminum sheets to form a second solder layer directly connected to both the nickel metal sheet and the aluminum cooling element.

6. The method as claimed in claim 5 , further comprising, before the stacking procedure, punching at least one of the aluminum sheets to form a cooling channel of the surrounding aluminum sheets once the aluminum sheets are stacked.

7. The cooling device as claimed in claim 1 , wherein the nickel metal sheet includes a metal core and a nickel layer surrounding the metal core, the nickel layer containing at least 95% by mass of nickel.

8. A power circuit comprising:
an aluminum cooling element;
a nickel metal sheet directly soldered to the aluminum cooling element, wherein the nickel metal sheet contains at least 95% by mass nickel and the nickel metal sheet has a thickness of at least 200 μm;
wherein the power circuit includes a mounting surface defined by a side of the nickel metal sheet facing away from the cooling element;
a printed circuit board with a conductive layer applied on both sides, the printed circuit board connected to the nickel metal sheet by a solder layer; and
at least one semiconductor mounted on the printed circuit board on a side of the printed circuit board facing away from the nickel metal sheet.

9. The power circuit as claimed in claim 8 , wherein the at least one semiconductor comprises an unhoused semiconductor mounted on the printed circuit board by a soft solder layer.

Assignees

• Continental Automotive Gmbh

Inventors

• Smit Arnoud
• Schmid Thomas
• Keller Lars
• Rittstieg Soeren

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/255 Primary

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H01L23/3736

  Electricity · mapped topic