Shift-and-match fusion of color and mono images
US-2017318273-A1 · Nov 2, 2017 · US
US10313642B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10313642-B2 |
| Application number | US-201715408724-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 18, 2017 |
| Priority date | Jan 18, 2017 |
| Publication date | Jun 4, 2019 |
| Grant date | Jun 4, 2019 |
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An imaging system for capturing an image of an object comprises a first lens, a dichroic beam splitter, which transmits light of a color band and reflects light of all colors outside the color band, a first image sensor for capturing an image formed by the transmitted light in the color band, a second image sensor for capturing an image formed by the reflected light outside the color band. The first image sensor is a monochrome image sensor and the second image sensor is a color image sensor having a color filter array disposed on pixels of the second image sensor. The image captured by the first image sensor and the image captured by the second image sensor are combined to form a single color image.
Opening claim text (preview).
What is claimed is: 1. An imaging system for capturing an image of an object comprising: a first lens; a dichroic beam splitter having a dichoric filter disposed between two prisms, wherein the dichroic filter transmits light of a color band and reflects light of all colors outside the color band; a first image sensor for capturing an image formed by the transmitted light in the color band; a second image sensor for capturing an image formed by the reflected light outside the color band; wherein the first image sensor is a monochrome image sensor and the second image sensor is a color image sensor having a color filter array disposed on pixels of the second image sensor; wherein the image captured by the first image sensor and the image captured by the second image sensor are combined to form a single color image; wherein the dichroic beam splitter is a wafer level dichroic beam splitter singulated from a dichroic beam splitter wafer, and wherein the dichroic beam splitter wafer is produced by dicing diagonally a block comprising a plurality of planar substrate layers and a plurality of planar dichroic filter layers, each dichroic filter layer is disposed between two substrate layers. 2. The imaging system of claim 1 , wherein the first image sensor is a monochrome image sensor having no color filter array disposed on pixels of the first image sensor. 3. The imaging system of claim 1 , wherein the color band is green color band and the first image sensor is a green monochrome image sensor. 4. The imaging system of claim 1 , wherein the color filter array comprises red color filter. 5. The imaging system of claim 4 , wherein the color filter array further comprises one of blue and yellow color filters. 6. The imaging system of claim 4 , wherein the color filter array further comprises one of blue-red, red-blue, and red-yellow color filters. 7. The imaging system of claim 1 , wherein the first image sensor and the second image sensor are mounted on two sides of the dichroic beam splitter. 8. The imaging system of claim 1 further comprising a second lens disposed on the dichroic beam splitter opposite the first image sensor. 9. The imaging system of claim 1 , wherein the imaging system is installed in a mobile phone. 10. An electronic device comprising an imaging system for capturing an image of an object, the imaging system comprising: a first lens; a reflector for folding an optical path 90°; a dichroic beam splitter having a dichoric filter disposed between two prisms, wherein the dichroic filter transmits light of a color band and reflects light of all colors outside the color band; a first image sensor for capturing an image formed by the transmitted light in the color band; a second image sensor for capturing an image formed by the reflected light outside the color band; wherein the first image sensor is a monochrome image sensor and the second image sensor is a color image sensor having a color filter array disposed on pixels of the second image sensor; wherein the image captured by the first image sensor and the image captured by the second image sensor are combined to form a single color image; wherein the dichroic beam splitter is a wafer level dichroic beam splitter singulated from a dichroic beam splitter wafer, and wherein the dichroic beam splitter wafer is produced by dicing diagonally a block comprising a plurality of planar substrate layers and a plurality of planar dichroic filter layers, each dichroic filter layer is disposed between two substrate layers. 11. The electronic device of claim 10 , wherein the first image sensor and the second image sensor are mounted on two sides of the dichroic beam splitter. 12. The electronic device of claim 10 further comprising a second lens disposed on the dichroic beam splitter opposite of the first image sensor. 13. The electronic device of claim 10 , wherein the electronic device comprises a mobile phone.
Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title
Optical arrangements associated therewith, e.g. for beam-splitting or for colour correction · CPC title
for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images · CPC title
for a camera module assembly · CPC title
Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title
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