Crimping terminal and electric wire with crimping terminal

US10312604B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10312604-B2
Application numberUS-201715616513-A
CountryUS
Kind codeB2
Filing dateJun 7, 2017
Priority dateJun 7, 2017
Publication dateJun 4, 2019
Grant dateJun 4, 2019

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A crimping terminal includes a crimping part that is compressed to a conductive part of an electric wire, and a buffer layer formed on a surface where the crimping part contacts the conductive part. The buffer layer includes a resin, a plating or a grease and a conductive microscopic particle that is mixed and dispersed therein. The microscopic particle includes a fractal structure including a fine protrusion on a surface of the microscopic particle.

First claim

Opening claim text (preview).

What is claimed is: 1. A crimping terminal, comprising: a crimping part that is compressed to a conductive part of an electric wire; and a buffer layer formed on a surface where the crimping part contacts the conductive part, wherein the buffer layer comprises a resin, a plating or a grease and a conductive microscopic particle that is mixed and dispersed therein, wherein the microscopic particle comprises a fractal structure comprising a fine protrusion on a surface of the microscopic particle, wherein the crimping part comprises a flat surface, wherein a tip curvature diameter of the fine protrusion arranged on a surface of the microscopic particle is not less than 0.0006% of a radius of the microscopic particle and not more than 10% of the radius of the microscopic particle, wherein a height of the fine protrusion arranged on the surface of the microscopic particle is less than 0.5% of a diameter of the microscopic particle, and wherein the microscopic particle comprises Ni including P. 2. The crimping terminal according to claim 1 , wherein the microscopic particle further comprises a coating layer coating a core, wherein the core comprises Ni, and wherein the coating layer comprises an Ni—P layer. 3. An electric wire with a crimping terminal, comprising: an electric wire comprising a conductive part; and a crimping terminal comprising a crimping part that is compressed to the conductive part of the electric wire, wherein a buffer layer comprising a resin, a plating or a grease that is interposed in a contact interface between the conductive part and the crimping part, wherein a conductive microscopic particle that comprises a fractal structure comprising a fine protrusion on a surface of the microscopic particle is mixed and dispersed in the buffer layer, wherein the microscopic particle in the buffer layer pierces an insulating coat on a surface of the conductive part and contacts the conductive part, wherein the crimping part comprises a flat surface, wherein a tip curvature diameter of the fine protrusion arranged on the surface of the microscopic particle is not less than 0.0006% of a radius of the microscopic particle and not more than 10% of the radius of the microscopic particle, wherein a height of the fine protrusion arranged on the surface of the microscopic particle is less than 0.5% of a diameter of the microscopic particle, and wherein the microscopic particle comprises Ni including P. 4. The crimping terminal according to claim 1 , wherein the conductive part comprises a flat surface that opposes and is substantially parallel to the flat surface of the crimping part. 5. The crimping terminal according to claim 3 , wherein the conductive part comprises a flat surface that opposes and is substantially parallel to the flat surface of the crimping part. 6. The crimping terminal according to claim 4 , further comprising a plurality of microscopic particles of uniform size that form electrically conductive paths when the fine protrusions thereon intrude into the flat surfaces of the conductive part and crimping part. 7. The crimping terminal according to claim 5 , further comprising a plurality of microscopic particles of uniform size that form electrically conductive paths when the fine protrusions thereon intrude into the flat surfaces of the conductive part and crimping part. 8. The crimping terminal according to claim 2 , wherein a component ratio between Ni and P in the Ni—P layer is inclined in a thickness direction of the coating layer. 9. The crimping terminal according to claim 2 , wherein the microscopic particle has a cylindrical structure.

Assignees

Inventors

Classifications

  • using a crimping sleeve {(H01R4/01 takes precedence)} · CPC title

  • Nanotechnology for materials or surface science, e.g. nanocomposites · CPC title

  • H01R4/58Primary

    characterised by the form or material of the contacting members (H01R4/01 takes precedence) · CPC title

  • H01R4/18Primary

    by crimping {(H01R4/01, H01R4/2495 take precedence; for coaxial cables H01R9/0518)} · CPC title

  • with wire-insulation stripping · CPC title

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Frequently asked questions

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What does patent US10312604B2 cover?
A crimping terminal includes a crimping part that is compressed to a conductive part of an electric wire, and a buffer layer formed on a surface where the crimping part contacts the conductive part. The buffer layer includes a resin, a plating or a grease and a conductive microscopic particle that is mixed and dispersed therein. The microscopic particle includes a fractal structure including a …
Who is the assignee on this patent?
Hitachi Metals Ltd
What technology area does this patent fall under?
Primary CPC classification H01R4/58. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 04 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).