Fixing structure and fixing method

Patent metadata

Field	Value
Publication number	US-10312603-B2
Application number	US-201715821886-A
Country	US
Kind code	B2
Filing date	Nov 24, 2017
Priority date	Oct 20, 2015
Publication date	Jun 4, 2019
Grant date	Jun 4, 2019

Abstract

A fixing method for fixing a terminal to a conductive pattern with a brazing filler metal disposed therebetween includes: a first step of disposing the brazing filler metal on the conductive pattern; a second step of bringing the terminal into contact with the brazing filler metal; and a third step of forming a penetrating hole in the terminal by irradiating a laser beam onto the terminal. In the third step, the laser beam is irradiated onto the terminal in such a manner that the penetrating hole is filled with the brazing filler metal melted by the irradiation of the laser beam.

First claim

What is claimed is:

1. A fixing structure comprising:
a substrate;
a conductive pattern formed on the substrate;
an adhesive layer formed of a brazing filler metal; and
a terminal, the terminal being fixed to the conductive pattern by the adhesive layer,
wherein a penetrating hole is formed in the terminal, the penetrating hole being gradually widened in a direction away from the substrate toward an upper surface of a fixed portion of the terminal,
the penetrating hole is filled with the brazing filler metal, and
the brazing filler metal is a solder.

2. The fixing structure according to claim 1 , wherein the brazing filler metal spreads over an upper surface of the terminal.

3. The fixing structure according to claim 1 , wherein the conductive pattern and the adhesive layer are fixed to each other by wetting phenomena.

4. The fixing structure according to claim 1 , wherein the terminal is a Cu-based or Au-based metal.

5. A fixing structure comprising:
a wire including a conductor;
a brazing filler metal wetting the conductor; and
a terminal, the terminal being fixed to the conductor by the brazing filler metal,
wherein a penetrating hole is formed in the terminal, the penetrating hole being gradually widened in a direction toward an upper surface of a fixed portion of the terminal,
the penetrating hole is filled with the brazing filler metal, and
the brazing filler metal is a solder.

6. The fixing structure according to claim 5 , wherein the brazing filler metal spreads over an upper surface of the terminal.

7. The fixing structure according to claim 5 , wherein the conductor and the brazing filler metal are fixed to each other by wetting phenomena.

8. The fixing structure according to claim 5 , further comprising a fixing structure body including a wire holding body configured to hold the wire and a terminal holding body configured to hold the terminal,
wherein the wire holding body and the terminal holding body are mated together.

9. The fixing structure according to claim 8 , wherein the terminal is supported by the fixing structure body at two locations sandwiching a portion of the terminal, the two locations comprising the portion being connected and fixed to the conductor.

10. The fixing structure according to claim 8 , wherein a mating surface of the terminal holding body with respect to the wire holding body is inclined with respect to a fixed surface of the terminal in such a manner that the brazing filler metal is pressed against the fixed surface of the terminal when the wire holding body and the terminal holding body are mated together.

Assignees

• Japan Aviation Electronics Ind Ltd

Inventors

• Yoshida Takushi
• Akimoto Hiroshi
• Seki Yosuke

Classifications

• B23K2103/12

  Copper or alloys thereof · CPC title

• H01R43/0221

  Laser welding (H01R43/0228 takes precedence) · CPC title

• H01R4/029

  Welded connections (H01R4/021 - H01R4/028 take precedence) · CPC title

• H05K3/3421 Primary

  Leaded components · CPC title

• H05K3/3494 Primary

  Heating processes for reflow soldering · CPC title