Simulation method, simulation apparatus, and simulation program

Patent metadata

Field	Value
Publication number	US-10311176-B2
Application number	US-201615244809-A
Country	US
Kind code	B2
Filing date	Aug 23, 2016
Priority date	Sep 3, 2015
Publication date	Jun 4, 2019
Grant date	Jun 4, 2019

Abstract

A coupled simulation of a structural-elastic phenomenon and a heat conduction phenomenon of a simulation target including plural particles is performed. Here, numerical calculation of a motion equation capable of being transformed into an equation of the same form as that of a heat conduction equation is performed with respect to a term of a spatial temperature distribution and a term of a derivative of temperature with respect to time, to perform a simulation of the heat conduction phenomenon of the simulation target.

First claim

What is claimed is:

1. A computer program product embodied on a tangible, non-transitory computer-readable data storage device, the computer program product causes a computer to execute a coupled simulation of a structural-elastic phenomenon and a heat conduction phenomenon of a simulation target including a plurality of particles, the computer program product comprising:
computer code for performing numerical calculation of a motion equation capable of being transformed into an equation of the same form as that of a heat conduction equation with respect to a term of a spatial temperature distribution and a term of a derivative of temperature with respect to time to perform a simulation of the heat conduction phenomenon of the simulation target,
wherein in a case where a sign of a rate of temperature change of the simulation target and a sign of an acceleration of temperature change thereof are equal to each other, an attenuation coefficient of the motion equation is set to be smaller than an attenuation coefficient at a current time point,
wherein in a case where the sign of the rate of temperature change of the simulation target and the sign of the acceleration of temperature change thereof are different from each other, the attenuation coefficient of the motion equation is restored to an original value calculated from the heat conduction equation, and a virtual mass which is a parameter corresponding to a mass in the motion equation is increased to be greater than a virtual mass at a current time point, and
wherein when the virtual mass exceeds an upper limit value, the virtual mass is set to the upper limit value.

2. The computer program product according to claim 1 ,
wherein an attenuation coefficient of the motion equation is set to a value smaller than an original value calculated from the heat conduction equation applied to the simulation target, or to zero to perform the numerical calculation of the motion equation.

3. The computer program product according to claim 2 ,
wherein it is determined whether a condition for setting a rate of temperature change to zero is satisfied for each time pitch of the numerical calculation of the motion equation, and in a case where the condition is satisfied, the rate of temperature change is set to zero in the next time pitch of the numerical calculation of the motion equation.

4. The computer program product according to claim 2 , further comprising:
computer code for determining whether a distribution of calculation values of temperatures obtained by the simulation of the heat conduction phenomenon reaches a steady state for each time pitch of the numerical calculation of the motion equation; and
computer code for setting, in a case where it is determined that the distribution of the calculation values of the temperatures obtained by the simulation of the heat conduction phenomenon reaches the steady state, the attenuation coefficient of the motion equation to the original value calculated from the heat conduction equation applied to the simulation target to perform the numerical calculation of the motion equation.

5. The computer program product according to claim 1 ,
wherein in a case where a sign of a rate of temperature change of the simulation target and a sign of an acceleration of temperature change thereof are equal to each other, an attenuation coefficient of the motion equation is set to be smaller than an attenuation coefficient at a current time point,
wherein in a case where the sign of the rate of temperature change of the simulation target and the sign of the acceleration of temperature change thereof are different from each other, the attenuation coefficient of the motion equation is restored to an original value calculated from the heat conduction equation, and
wherein when the number of time pitches from the start of the simulation becomes equal to or greater than a reference value, the attenuation coefficient of the motion equation is fixed to the original value calculated from the heat conduction equation.

6. A simulation apparatus that performs a coupled simulation of a structural-elastic phenomenon and a heat conduction phenomenon of a simulation target including a plurality of particles, comprising:
a storage unit that stores a motion equation capable of being transformed into an equation of the same form as that of a heat conduction equation with respect to a term of a spatial temperature distribution and a term of a derivative of temperature with respect to time;
a central processing unit that performs numerical calculation of the motion equation stored in the storage unit to calculate a temperature distribution of the simulation target; and
an output unit that outputs a result of the numerical calculation performed by the central processing unit,
wherein in a case where a sign of a rate of temperature change of the simulation target and a sign of an acceleration of temperature change thereof are equal to each other, an attenuation coefficient of the motion equation is set to be smaller than an attenuation coefficient at a current time point,
wherein in a case where the sign of the rate of temperature change of the simulation target and the sign of the acceleration of temperature change thereof are different from each other, the attenuation coefficient of the motion equation is restored to an original value calculated from the heat conduction equation, and a virtual mass which is a parameter corresponding to a mass in the motion equation is increased to be greater than a virtual mass at a current time point, and
wherein when the virtual mass exceeds an upper limit value, the virtual mass is set to the upper limit value.

7. The simulation apparatus according to claim 6 ,
wherein the motion equation includes an attenuation coefficient, and
wherein the central processing unit sets the attenuation coefficient of the motion equation to a value smaller than an original value calculated from the heat conduction equation applied to the simulation target, or to zero to perform the numerical calculation of the motion equation.

8. The simulation apparatus according to claim 7 ,
wherein the central processing unit determines whether a condition for setting a rate of temperature change to zero is satisfied for each time pitch of the numerical calculation of the motion equation, and sets, in a case where the condition is satisfied, the rate of temperature change to zero in the next time pitch of the numerical calculation of the motion equation.

9. The simulation apparatus according to claim 7 ,
wherein the central processing unit performs
determining whether a distribution of calculation values of temperatures calculated by the numerical calculation of the motion equation reaches a steady state for each time pitch of the numerical calculation of the motion equation, and
setting, in a case where it is determined that the distribution of the calculation values of the temperatures calculated by the numerical calculation of the motion equation reaches the steady state, the attenuation coefficient of the motion equation to the original value calculated from the heat conduction equation applied to the simulation target to perform the numerical calculation of the motion equation.

Assignees

• Sumitomo Heavy Industries

Inventors

• Ohnishi Yoshitaka
• Ichishima Daiji
• Miyazaki Shuji

Classifications

• G06F2111/10

  Numerical modelling · CPC title

• G06F2119/08

  Thermal analysis or thermal optimisation · CPC title

• G16C60/00 Primary

  Computational materials science, i.e. ICT specially adapted for investigating the physical or chemical properties of materials or phenomena associated with their design, synthesis, processing, characterisation or utilisation · CPC title

• G06F30/20 Primary

  Design optimisation, verification or simulation (optimisation, verification or simulation of circuit designs G06F30/30) · CPC title

• G06F17/13

  Differential equations (using digital differential analysers G06F7/64) · CPC title