Touch-controlled panel, method of manufacturing the same, and display device

Patent metadata

Field	Value
Publication number	US-10310647-B2
Application number	US-201615232949-A
Country	US
Kind code	B2
Filing date	Aug 10, 2016
Priority date	Jan 11, 2016
Publication date	Jun 4, 2019
Grant date	Jun 4, 2019

Abstract

Embodiments of the present invention discloses a touch-controlled panel and a method of manufacturing the same, and a display device, to reduce the number of masks and production cost. The method of manufacturing a touch-controlled panel includes: forming a first electrode and a second electrode on a substrate through a patterning process, the first electrode and the second electrode being broken at a position where they are overlapped; depositing a layer of an organic film and forming an organic film fully remained region, an organic film partially remained region and an organic film removed region from the organic film through a mask; depositing a conductive layer and coating a photoresist on the conductive layer, and then forming a photoresist fully remained region, a photoresist partially remained region and a photoresist removed region through the mask.

First claim

The invention claimed is:

1. A method of manufacturing a touch-controlled panel, comprising:
forming a first electrode and a second electrode on a substrate through a patterning process, both the first electrode and the second electrode being broken at a position where they are overlapped;
depositing a layer of an organic film on the substrate on which the first electrode and the second electrode have been formed, and forming an organic film fully remained region, an organic film partially remained region and an organic film removed region from the organic film through a mask, wherein the organic film removed region corresponds to a region where a bridging connection layer provided in a subsequent step is in contact with the first electrode or the second electrode, the organic film partially remained region corresponds to a region where the bridging connection layer will be provided in a subsequent step, and a portion of the organic film corrsponding to the organic film fully remained region and the organic film partially remained region constitutes a first organic film;
depositing a conductive layer and coating a photoresist on the conductive layer, and then forming a photoresist fully remained region, a photoresist partially remained region and a photoresist removed region through the mask, wherein the photoresist fully remained region corresponds to a region where the conductive layer is in contact with the first electrode or the second electrode, and the photoresist partially remained region corresponds to the region where the bridging connection layer will be provided;
etching the conductive layer where the above steps have been finished, and removing the residual photoresist, so as to form the bridging connection layer.

2. The method as claimed in claim 1 , wherein the first electrode and the second electrode are transparent electrodes; or the first electrode and the second electrode are metal electrodes.

3. The method as claimed in claim 2 , wherein the conductive layer is a transparent conductive layer; or the conductive layer is a metal conductive layer.

4. The method as claimed in claim 3 , wherein the substrate is a substrate of an array substrate;
in a situation where the first electrode and the second electrode are transparent electrodes, the first electrode and the second electrode are formed in the same layer as a pixel electrode, or are formed in the same layer as a common electrode; and
in a situation where the first electrode and the second electrode are metal electrodes, the first electrode and the second electrode are formed in the same layer as a gate electrode, or are formed in the same layer as source and drain electrodes.

5. The method as claimed in claim 3 , wherein the substrate is a substrate of an array substrate;
in a situation where the conductive layer is a transparent conductive layer, the conductive layer is formed in the same layer as a pixel electrode, or is formed in the same layer as a common electrode; and
in a situation where the conductive layer is a metal conductive layer, the conductive layer is formed in the same layer as a gate electrode, or is formed in the same layer as source and drain electrodes.

6. The method as claimed in claim 1 , wherein the organic film is formed of a negative photoresist and the photoresist is a positive photoresist; or, the organic film is formed of a positive photoresist and the photoresist is a negative photoresist.

7. The method as claimed in claim 6 , wherein the mask is a gray-tone mask or a half-tone mask.

8. The method as claimed in claim 7 , further comprising: forming a second organic film, through a patterning process, on the substrate on which the first organic film and the bridging connection layer have been formed.

Assignees

• Boe Technology Group Co Ltd
• Hefei Xinsheng Optoelectronics Technology Co Ltd

Inventors

• Wan Yunhai
• Wang Wenlong
• Ma Tao
• Cao Binbin
• Yang Chengshao

Classifications

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

• G06F3/0412 Primary

  Digitisers structurally integrated in a display · CPC title

• G06F2203/04111

  Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate · CPC title

• H01L27/1288

  Electricity · mapped topic

• G06F3/044 Primary

  by capacitive means · CPC title