Substrates, systems and methods for analyzing materials
US-9029802-B2 · May 12, 2015 · US
US10310178B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10310178-B2 |
| Application number | US-201815953792-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 16, 2018 |
| Priority date | Jun 17, 2012 |
| Publication date | Jun 4, 2019 |
| Grant date | Jun 4, 2019 |
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Arrays of integrated analytical devices and their methods for production are provided. The arrays are useful in the analysis of highly multiplexed optical reactions in large numbers at high densities, including biochemical reactions, such as nucleic acid sequencing reactions. The integrated devices allow the highly sensitive discrimination of optical signals using features such as spectra, amplitude, and time resolution, or combinations thereof. The arrays and methods of the invention make use of silicon chip fabrication and manufacturing techniques developed for the electronics industry and highly suited for miniaturization and high throughput.
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What is claimed is: 1. An array of integrated analytical devices comprising: a substrate layer; a waveguide module layer disposed on the substrate layer; wherein the waveguide module layer comprises a lower waveguide cladding material, a waveguide core material, an upper waveguide cladding material, and an etch hardmask layer disposed between the waveguide core material and the upper waveguide cladding material; a zero-mode waveguide module layer disposed on the waveguide module layer; wherein the zero-mode waveguide module layer comprises a plurality of nanometer-scale apertures penetrating to the waveguide module layer. 2. The array of claim 1 , wherein the plurality of nanometer-scale apertures is formed by etching up to the etch hardmask layer. 3. The array of claim 1 , wherein the upper waveguide cladding material is SiO 2 . 4. The array of claim 1 , wherein the waveguide core material is Si 3 N 4 . 5. The array of claim 1 , wherein the at least one of the plurality of nanometer-scale apertures is partially backfilled. 6. The array of claim 5 , wherein the at least one nanometer-scale aperture is partially backfilled using atomic layer deposition or low pressure chemical vapor deposition. 7. The array of claim 1 , wherein the substrate layer is a detector layer. 8. The array of claim 7 , wherein the detector layer comprises a color-separation layer. 9. The array of claim 1 , wherein the substrate layer is a CMOS wafer. 10. The array of claim 1 , further comprising a collection module layer disposed between the substrate layer and the waveguide module layer. 11. The array of claim 10 , wherein the collection module layer comprises a Fresnel lens structure. 12. The array of claim 11 , wherein the Fresnel lens structure is a phase Fresnel zone plate. 13. The array of claim 10 , further comprising a filter module layer disposed between the substrate layer and the collection module layer. 14. The array of claim 13 , wherein the filter module layer comprises a dielectric filter. 15. The array of claim 13 , wherein the filter module layer comprises an absorptive filter. 16. The array of claim 1 , wherein at least one of the plurality of nanometer-scale apertures comprises a fluid sample comprising a fluorescent species. 17. The array of claim 16 , wherein the fluorescent species is a fluorescently labeled nucleotide analog. 18. The array of claim 1 , wherein the plurality of nanometer-scale apertures comprise at least 100 nanometer-scale apertures. 19. The array of claim 1 , wherein the plurality of nanometer-scale apertures have a density of at least 1000 apertures per cm 2 .
Combinations of two or more optical elements · CPC title
using an integrated detector array · CPC title
Light guides, optical cables · CPC title
Optical filters · CPC title
Fresnel lenses · CPC title
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