Light emitting diode component

Patent metadata

Field	Value
Publication number	US-10309587-B2
Application number	US-201313886878-A
Country	US
Kind code	B2
Filing date	May 3, 2013
Priority date	Aug 30, 2002
Publication date	Jun 4, 2019
Grant date	Jun 4, 2019

Abstract

In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

First claim

The invention claimed is:

1. A white light emitting lighting apparatus comprising:
at least one light emitting diode (LED) chip;
at least one luminescent element comprising a light transparent body including at least one phosphor layer or a phosphor inclusive light transparent body that is arcuate in at least one dimension and defines a hollow interior volume, said phosphor performing wavelength conversion of light emitted by the LED chip, the luminescent element spaced from the LED chip by a distance at least 2 times the length of a longest side of the LED chip, wherein the phosphor layer or the phosphor inclusive light transparent body defines a surface area at least 10 times as large as the exposed surface area of light absorbing components of the LED chip; and
a common reflective support on which both the LED chip and the luminescent element are mounted, wherein internal surfaces of the support and the luminescent element are phosphor coated except the LED chip.

2. The lighting apparatus according to claim 1 , wherein the luminescent element is a hemispheric shape, and wherein the LED chip is sealed between the common reflective surface and the luminescent element.

3. The lighting apparatus according to claim 2 , wherein the LED chip is disposed at the center of the luminescent element.

4. The lighting apparatus according to claim 1 , further including:
a submount or substrate of the LED chip, the submount or substrate mounted on the common reflective support and disposed between the common reflective support and the LED chip.

5. The lighting apparatus according to claim 1 , wherein the common reflective support is planar.

6. The lighting apparatus according to claim 1 , wherein the common reflective support includes a heat sink for the LED chip.

7. The lighting apparatus according to claim 1 , wherein the common reflective support comprises a reflector cup including sidewalls, the LED chip disposed in the reflector cup.

8. The lighting apparatus according to claim 1 , comprising multiple layers of phosphor and wherein at least two layers are comprised of different phosphor compositions.

9. The lighting apparatus according to claim 1 , wherein the luminescent element is comprised of glass or crystalline.

10. The lighting apparatus of claim 1 , wherein said phosphor layer is disposed on at least one of an interior or exterior surface of the luminescent element.

11. The lighting apparatus of claim 1 , wherein said phosphor layer is of substantially uniform thickness.

12. The lighting apparatus of claim 1 wherein said light transmissive element is tube-shaped.

13. The lighting apparatus of claim 1 consisting of a plurality of UV or blue emitting LED chips and wherein each LED chip is spaced at all locations from the luminescent element by a distance of at least two times the length of the longest side of one of the LED chips.

14. The lighting apparatus of claim 4 wherein said substrate is comprised of silicon carbide or alumina and said lighting apparatus has a package efficiency of at least about 98%.

15. The lighting apparatus of claim 14 wherein said substrate comprises alumina.

16. The lighting apparatus of claim 4 having a power consumption of less than about 3.9 milliwatts per lumen.

Assignees

• Aanegola Srinath K
• Radkov Emil V
• Reginelli James
• Stadelman Larry R
• Mrakovich Matthew
• Stimac Tomislav J
• Weaver Jr Stanton Earl
• Soules Thomas F
• Ge Lighting Solutions Llc

Inventors

• Aanegola Srinath K
• Radkov Emil V
• Reginelli James
• Stadelman Larry R
• Mrakovich Matthew
• Stimac Tomislav J
• Weaver Jr Stanton Earl
• Soules Thomas F

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• F21K9/64 Primary

  using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer · CPC title

• H01L33/505

  Electricity · mapped topic

• F21Y2105/10

  comprising a two-dimensional [2D] array of point-like light-generating elements · CPC title