Filling material for three-dimensional mounting of semiconductor element

Patent metadata

Field	Value
Publication number	US-10308758-B2
Application number	US-201415024910-A
Country	US
Kind code	B2
Filing date	Sep 25, 2014
Priority date	Sep 27, 2013
Publication date	Jun 4, 2019
Grant date	Jun 4, 2019

Abstract

Provided are a filling component useful for the production of a thin, low-profile three-dimensional integrated semiconductor device via a COW process, and a curable composition for the formation of the filling component. The filling component according to the present invention for three-dimensional mounting of semiconductor elements is used to fill gaps between laterally adjacent semiconductor elements in the production of a three-dimensional integrated semiconductor device by stacking and integrating semiconductor elements. The filling component is a component that is polished and/or ground flat from the front side of semiconductor elements while gaps between the semiconductor elements are filled with the filling component.

First claim

The invention claimed is:

1. A curable composition for three-dimensional mounting of semiconductor elements,
the curable composition comprising:
an epoxide having a bisphenol skeleton represented by formula (1), (2) or (3)

wherein r represents a number of 0 to 8;
a cycloaliphatic epoxide represented by formula (4),

wherein Y 1 is selected from a single bond and a linkage group, and the linkage group is selected from the group consisting of divalent hydrocarbon group, carbonyl group (—CO—), ether bond (—O—), ester bond (—COO—), amide bond (—CONH—), carbonate bond (—OCOO—) and combinations thereof; and
a cationic-polymerization initiator,
wherein a ratio in parts by weight of the epoxide having a bisphenol skeleton represented by formula (1), (2), or (3) to the cycloaliphatic epoxide represented by formula (4) in the curable composition is 55:45 to 99:1,
wherein the curable composition does not contain a radical polymerization initiator,
wherein the curable composition is a liquid at 25° C., and
wherein the curable composition is suitable for use in the formation of a filling component.

2. The curable composition according to claim 1 for three-dimensional mounting of semiconductor elements, the curable composition further comprising
at least one filler selected from the group consisting of inorganic fillers and organic fillers each having an average particle diameter of 0.05 to 1 μm.

3. The curable composition according to claim 2 for three-dimensional mounting of semiconductor elements, the curable composition further comprising
a silane coupling agent.

4. The curable composition according to claim 1 for three-dimensional mounting of semiconductor elements, the curable composition further comprising
a silane coupling agent.

Assignees

• Daicel Corp

Inventors

• Tanaka Hiroki
• Nakaguchi Katsuhiro

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W70/099

  Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/874

  On different surfaces · CPC title