Cooling mechanism of high mounting flexibility

Patent metadata

Field	Value
Publication number	US-10306805-B2
Application number	US-201715493721-A
Country	US
Kind code	B2
Filing date	Apr 21, 2017
Priority date	Mar 31, 2015
Publication date	May 28, 2019
Grant date	May 28, 2019

Abstract

A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.

First claim

What the invention claimed is:

1. A cooling mechanism of high mounting flexibility, comprising a heat sink, at least one heat transfer block and at least one elastic member mounted in said heat sink, and a plurality of heat pipes mounted in said heat sink and set between said at least one heat transfer block and said at least one elastic member, wherein:
said heat sink comprises a heat sink body, said heat sink body comprising at least one accommodation portion and a plurality of position-limit sliding grooves extended from said at least one accommodation portion for accommodating said heat pipes with a margin therebetween to allow adjustment of the position of the heat pipes in the sliding grooves, respectively, a recessed positioning groove located in said at least one accommodation portion, and a plurality of stop blocks fastened to said heat sink body to stop said heat pipes in said position-limit sliding grooves;
each said heat pipe comprises a hot interface located at one end thereof and accommodated in one said accommodation portion, and a cold interface located at an opposite end thereof and positioned in one said position-limit sliding groove;
said at least one heat transfer block is mounted in said at least one accommodation portion of said heat sink body, each said heat transfer block comprising a recessed insertion passage located in one side thereof for accommodating the hot interface of at least one said heat pipe and a planar contact surface located at an opposite side thereof for the contact of a heat source of an external circuit board;
a metal sheet fixedly fastened to said heat transfer block to secure said hot interfaces of said heat pipes in said recessed insertion passage between said metal sheet and said heat transfer block;
said at least one elastic member each comprises an elastic thermal pad respectively positioned in said recessed positioning groove of said heat sink, said elastic thermal pad being elastically positioned to keep in direct contact with said metal sheet;
the metal sheet set in between said heat transfer block and the elastic thermal pad;
each heat transfer block being configured to move vertically toward the inner side of the accommodation portion of the heat sink to impart a pressure to the hot interface of the respective heat pipe, and the stop blocks stop the cold interfaces of the heat pipes in the respective position-limit sliding grooves.

2. The cooling mechanism of high mounting flexibility as claimed in claim 1 , wherein the width of said position-limit sliding grooves of said heat sink is larger than the outer diameter of said heat pipes.

3. The cooling mechanism of high mounting flexibility as claimed in claim 1 , wherein said heat sink body of said heat sink further comprises a plurality of mounting through hole spaced around said position-limit sliding grooves; each said stop block comprises a plurality of through holes fastened to respective said mounting through holes of said heat sink body of said heat sink by respective screws.

4. The cooling mechanism of high mounting flexibility as claimed in claim 3 , wherein said heat sink body of said heat sink further comprises a plurality of locating grooves respectively extended from said position-limit sliding grooves; said mounting through holes are located in said locating grooves; said stop blocks are respectively fitted into said locating grooves and kept in flush with said heat sink body of said heat sink.

5. The cooling mechanism of high mounting flexibility as claimed in claim 1 , wherein said heat sink is selectively made from aluminum or copper.

Assignees

• Adlink Tech Inc

Inventors

• Yu Hsiu-Ling
• Chiang Hsuan-Chan

Classifications

• H05K7/20809

  within server blades for removing heat from heat source · CPC title

• F28F2275/08

  by clamping or clipping · CPC title

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• F28D15/0233

  the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence) · CPC title

• G06F1/20 Primary

  Cooling means · CPC title