DDR electronic module assembly

Patent metadata

Field	Value
Publication number	US-10306751-B2
Application number	US-201715788862-A
Country	US
Kind code	B2
Filing date	Oct 20, 2017
Priority date	Oct 20, 2017
Publication date	May 28, 2019
Grant date	May 28, 2019

Abstract

An electronic module assembly has a memory module that includes a memory module and an electronic module. The memory module includes a first board having a first board first surface disposed opposite a first board second surface. The electronic module is operatively connected to the memory module. The electronic module includes a mounting plate having a mounting plate first surface that is disposed opposite a mounting plate second surface that faces towards the first board first surface. The mounting plate has a first post and a second post spaced apart from the first post.

First claim

What is claimed is:

1. An electronic module assembly, comprising:
a memory module, having:
a first board having a first board first surface disposed opposite a first board second surface, each extending longitudinally between a first board first end and a first board second end and each extending laterally between a first board first side and a first board second side, the first board defining a first opening disposed proximate the first board first side and the first board first end and a second opening disposed proximate the first board first side and the first board second end;
a plurality of memory packages disposed on the first board first surface proximate the first board first side; and
a first connector disposed on the first board first surface proximate the first board second side;

an electronic module, having:
a second board having a second board first surface disposed opposite a second board second surface that faces the first board first surface each extending laterally between a second board first end and a second board second end and longitudinally between a second board first side and a second board second side, the electronic module having a first post disposed proximate the second board first end and the second board first side and a second post disposed proximate the second board first end and the second board second side,

wherein the first post is proximately aligned with the first opening and the second post is proximately aligned with the second opening;
a first fastener arranged to extend through the first opening and into the first post; and
a second fastener arranged to extend through the second opening and into the second post.

2. The electronic module assembly of claim 1 , wherein the electronic module has a second connector disposed on the second board second surface proximate the second board first end and arranged to interface with the first connector.

3. The electronic module assembly of claim 1 , wherein the first board is made of a first material and the plurality of memory packages are made of a second material.

4. The electronic module assembly of claim 3 , wherein the first material and the second material have substantially similar coefficients of thermal expansion.

5. An electronic module assembly, comprising: a memory module having a first board having a first board first surface disposed opposite a first board second surface each extending longitudinally between a first board first end and a first board second end and laterally between a first board first side and a first board second side; and an electronic module operatively connected to the memory module, electronic module having: a mounting plate having a mounting plate first surface disposed opposite a mounting plate second surface that faces towards the first board first surface, each extending between a mounting plate first end, a mounting plate second end, a mounting plate first side, and a mounting plate second side, the mounting plate having a first post and a second post spaced apart from the first post wherein the electronic module has a second board having a second board first surface disposed opposite a second board second surface that is disposed on the mounting plate first surface; wherein the first board defines a first opening that is proximately aligned with the first post and a second opening that is proximately aligned with the second post.

6. The electronic module assembly of claim 5 ,
wherein the mounting plate has a third post extending from the mounting plate second surface and disposed proximate the mounting plate second side.

7. The electronic module assembly of claim 6 , wherein the first board defines a third opening that is proximately aligned with the third post.

8. The electronic module assembly of claim 5 , wherein the mounting plate has a first mounting lug extending from the mounting plate second side and disposed proximate the mounting plate first end.

9. The electronic module assembly of claim 5 , wherein the memory module has a plurality of memory packages disposed on the first board first surface proximate the first board first side and extending between the first board first end and the first board second end.

10. The electronic module assembly of claim 8 , wherein the first board is made of a first material and the plurality of memory packages are made of a second material.

11. The electronic module assembly of claim 9 , wherein the first material and the second material have substantially similar coefficients of thermal expansion.

12. The electronic module assembly of claim 8 , wherein the memory module has a first connector disposed on the first board first surface.

13. The electronic module assembly of claim 11 , wherein the electronic module has a second connector disposed on the second board second surface and extends through the mounting plate, the second connector being arranged to interface with the first connector.

Assignees

• Hamilton Sundstrand Corp

Inventors

• Duffy Jason C
• Gosse James A
• Lin Shun-Tien
• Maynard Michael
• Nguyen An

Classifications

• H05K1/144

  Stacked arrangements of planar printed circuit boards · CPC title

• H05K2201/10325

  Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support · CPC title

• H05K2201/10189

  Non-printed connector · CPC title

• H05K2201/049

  PCB for one component, e.g. for mounting onto mother PCB · CPC title

• H05K2201/068

  wherein the coefficient of thermal expansion is important · CPC title