Electronic device

US10305208B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10305208-B2
Application numberUS-201715834248-A
CountryUS
Kind codeB2
Filing dateDec 7, 2017
Priority dateDec 15, 2016
Publication dateMay 28, 2019
Grant dateMay 28, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An electronic device includes: a substrate; a housing which covers the substrate; a plurality of conductive pins which are mounted on one edge portion of the substrate and each of which includes: a projection portion projecting from the substrate along a plane of the substrate; and a soldering portion soldered to the substrate; and a resin molded portion which includes a connection portion connecting the plurality of conductive pins. The resin molded portion includes a first projection portion, and the housing includes a recess portion receiving the first projection portion.

First claim

Opening claim text (preview).

What is claimed is: 1. An electronic device comprising: a substrate; a housing which covers the substrate; a plurality of conductive pins which are arranged in a plane and mounted on one edge portion of the substrate, each conductive pin of the plurality of pins which includes a projection portion projecting from the substrate along a plane of the substrate and a soldering portion soldered to the substrate; and a resin molded portion which includes a connection portion connecting the plurality of conductive pins, wherein the resin molded portion includes a first projection portion extending in a first direction orthogonal to the plane in which the plurality of conductive pins are arranged, and the housing includes a recess portion receiving the first projection portion; wherein the resin molded portion includes a second projection portion, the substrate includes a recess portion receiving the second projection portion extending in a second direction opposite to the first direction. 2. The electronic device according to claim 1 , wherein the first projection portion includes at least two side surfaces which are not parallel to each other. 3. The electronic device according to claim 1 , wherein a tip end of the first projection portion is in contact with a bottom surface of the recess portion. 4. The electronic device according to claim 1 , wherein the housing includes a support portion which is in contact with the projection portions of the plurality of conductive pins. 5. The electronic device according to claim 1 , wherein the first projection portion has a U shape in a plan view, and each side of the first projection portion extends along an external shape of the connection portion of the resin molded portion.

Assignees

Inventors

Classifications

  • H01R12/727Primary

    Coupling devices presenting arrays of contacts · CPC title

  • characterised by the locating members · CPC title

  • surface mounting terminals · CPC title

  • Four or more poles · CPC title

  • Mechanical details of casings (covers, lids, hoods or members for covering apertures H05K5/03) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10305208B2 cover?
An electronic device includes: a substrate; a housing which covers the substrate; a plurality of conductive pins which are mounted on one edge portion of the substrate and each of which includes: a projection portion projecting from the substrate along a plane of the substrate; and a soldering portion soldered to the substrate; and a resin molded portion which includes a connection portion conn…
Who is the assignee on this patent?
Toyoda Gosei Kk, Toyota Gosei Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01R12/727. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 28 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).