III-nitride light emitting device with a region including only ternary, quaternary, and/or quinary III-nitride layers

US10304997B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10304997-B2
Application numberUS-201113882744-A
CountryUS
Kind codeB2
Filing dateOct 27, 2011
Priority dateNov 2, 2010
Publication dateMay 28, 2019
Grant dateMay 28, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A device includes a substrate ( 10 ) and a III-nitride structure ( 15 ) grown on the substrate, the III-nitride structure comprising a light emitting layer ( 16 ) disposed between an n-type region ( 14 ) and a p-type region ( 18 ). The substrate is a RA0 3 (MO) n where R is one of a trivalent cation: Sc, In, Y and a lanthanide; A is one of a trivalent cation: Fe (III), Ga and Al; M is one for a divalent cation: Mg, Mn, Fe (II), Co, Cu, Zn and Cd; and n is an integer≥1. The substrate has an inplane lattice constant a substrate . At lease one III-nitride layer in the III-nitride structure has a bulk lattice constant a layer such that [(|a substrate −a layer |)/a substrate ]*100% is no more than 1%.

First claim

Opening claim text (preview).

What is being claimed is: 1. A method comprising: growing a III-nitride structure grown on a substrate, the III-nitride structure comprising a light emitting layer disposed between an n-type region and a p-type region, wherein the III-nitride structure comprises a region including only ternary, quaternary, and/or quinary III-nitride layers and the region including only ternary, quaternary, and/or quinary IIInitride layers is thicker than 2 μm and growing a base region disposed between the substrate and the light emitting layer, the base region comprising a first layer proximate the substrate and a second layer proximate the light emitting layer wherein the net polarization-induced charge at the interface of the first layer and the second layer is zero, the first layer is a quaternary layer AlxInyGa1-x-yN between 3 and 1000 nm, and the second layer is a quaternary layer AlxInyGa1-x-y N of a different composition than the first layer; attaching the III-nitride structure to a mount; and removing the substrate, wherein: the substrate is RA03(MO) n , where R is one of a trivalent cation, Sc, In, Y, and a lanthanide; A is one of a trivalent cation, Fe (III), Ga, and AI; M is one of a divalent cation, Mg, Mn, Fe (II), Co, Cu, Zn and Cd; and n is an integer≥1; the substrate has an in-plane lattice constant a substrate ; at least one III-nitride layer in the III-nitride structure has a bulk lattice constant a layer ; and [(1 a substrate −a layer |)/a substrate ]*100% is no more than 1%. 2. The method of claim 1 wherein the substrate is ScA1Mg0 4 . 3. The method of claim 1 wherein the III-nitride structure includes at least one layer that is lattice matched to the substrate. 4. The method of claim 1 wherein the III-nitride structure includes a first layer in direct contact with a second layer, wherein an interface between the first and second layers has no polar charge. 5. The method of claim 4 wherein the first layer is Al 0.06 In 0.17 /Ga 0.77 N and the second layer is In 0.14 Ga 0.86 N. 6. The method of claim 1 wherein growing comprises growing a base region disposed between the substrate and the light emitting layer, the base region comprising a first layer proximate the substrate and a second layer proximate the light emitting layer, wherein the first layer has a smaller band gap than the second layer. 7. The method of claim 6 wherein: the substrate is ScA1Mg0 4 ; the first layer is one of In 0.14 Ga 0.86 N and quaternary Al x In y Ga 1-x-y N with a composition x and y that satisfies the relationship y=0.136+0.228*x, x+y≤; 1, that is lattice-matched to the substrate; and the second layer is one of Al 0.06 In 0.17 Ga 0.77 N, Al 0.6 In 0.18 Ga 0.27 N, and a quaternary layer Al x In y Ga 1-x-y N with an indium composition y between 0.14 and 0.32 that satisfies x=2*y−0.28. 8. The method of claim 1 wherein at least a portion of the n-type region has a graded composition. 9. The method of claim 1 wherein: the light emitting layer is part of a multi quantum well light emitting region comprising at least two light emitting layers and at least one barrier layer disposed between the at least two light emitting layers; and a composition of at least one of the light emitting layers and a composition of the at least one barrier layer are selected such that net strain in the light emitting region is zero. 10. The method of claim 1 wherein: the light emitting layer is part of a multi quantum well light emitting region comprising at least two light emitting layers and at least one barrier layer disposed between the at least two light emitting layers; and a composition of the at least one barrier layer is one of a quaternary layer that is lattice-matched to the substrate, GaN, and lnyGa 1-y N with an indium composition between 0 and YLEL−0.08, where YLEL is an indium composition of at least one of the light emitting layers. 11. The method of claim 1 wherein the semiconductor structure further comprises a distributed Bragg reflector. 12. The method of claim 11 wherein the distributed Bragg reflector comprises alternating AllnN and InGaN layers. 13. A device comprising: a substrate; a III-nitride structure on the substrate, the III-nitride structure comprising a light emitting layer disposed between an n-type region and a p-type region, wherein the IIInitride structure comprises a region including only ternary, quaternary, and/or quinary IIInitride layers and the region including only ternary, quaternary, and/or quinary III-nitride layers is thicker than 2 μm; and a base region disposed between the substrate and the light emitting layer, the base region comprising a first layer proximate to the substrate and a second layer proximate to the light emitting layer, wherein the net polarization-induced charge at the interface of the first layer and the second layer is zero, the first layer is a quaternary layer Al x In y Ga 1-x-y N between 3 and 1000, and the second layer is a quaternary layer Al x In y Ga 1-x-y N of a different composition than the first layer; wherein the substrate is RA03(MO) n , where R is one of a trivalent cation, Sc, In, Y, and a lanthanide; A is one of a trivalent cation, Fe (III), Ga, and Al; M is one of a divalent cation, Mg, Mn, Fe (II), Co, Cu, Zn and Cd; and n is an integer≥1; the substrate has an in-plane lattice constant a substrate ; at least one III-nitride layer in the III-nitride structure has a bulk lattice constant a layer ; and [(|a substrate −a layer )/a substrate ]*100% is no more than 1%. 14. The device of claim 13 wherein: the light emitting layer is configured to emit light having a peak wavelength greater than 440 nm. 15. The device of claim 14 wherein: strain for each layer in the region of including only ternary, quaternary, and/or quinary III-nitride layers is defined as [(|a bulk −a in-plane |)/α bulk ]*100%, where a bulk is a lattice constant of a layer of the same composition as each layer when fully relaxed and a in-plane is a lattice constant of each layer as grown in the device; and the strain in each layer in the region of including only ternary, quaternary, and/or quinary III-nitride layers is less than 0.8%. 16. The device of claim 13 further comprising a base region disposed between the substrate and the light emitting layer, the base region comprising a first layer proximate the substrate and a second layer proximate the light emitting layer, wherein the first layer has a smaller band gap than the second layer. 17. The method of claim 1 , further comprising depositing a smoothing layer between the base region and the light emitting layer, the smoothing layer comprising a band gap larger than a band gap of the light emitting layer. 18. The method of claim 1 , further comprising depositing a spacer layer between the base region and the light emitting layer, the spacer layer comprising a band gap larger than a band gap of the light emitting layer.

Assignees

Inventors

Classifications

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10304997B2 cover?
A device includes a substrate ( 10 ) and a III-nitride structure ( 15 ) grown on the substrate, the III-nitride structure comprising a light emitting layer ( 16 ) disposed between an n-type region ( 14 ) and a p-type region ( 18 ). The substrate is a RA0 3 (MO) n where R is one of a trivalent cation: Sc, In, Y and a lanthanide; A is one of a trivalent cation: Fe (III), Ga and Al; M is one for…
Who is the assignee on this patent?
Grundmann Michael Jason, Gardner Nathan Frederick, Goetz Werner Karl, and 4 more
What technology area does this patent fall under?
Primary CPC classification H01L33/32. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 28 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).