Cleaning device for atomizing and spraying liquid in two-phase flow

Patent metadata

Field	Value
Publication number	US-10304705-B2
Application number	US-201615083290-A
Country	US
Kind code	B2
Filing date	Mar 29, 2016
Priority date	Dec 10, 2015
Publication date	May 28, 2019
Grant date	May 28, 2019

Abstract

A cleaning device for atomizing and spraying liquid in two-phase flow comprising a nozzle provided with multiple liquid bypass pipelines each having liquid guiding outlets inclined at a predetermined angle and an exhaust mesh plate having vertical gas guiding outlets, which makes the high speed liquid flow and high speed gas flow sprayed out therefrom collide against each other sufficiently to form ultra-micro atomized particles with uniform and adjustable size. The ultra-micro atomized particles are sprayed out downwardly to the wafer surface under the acceleration and vertical orientation effects of an atomized particle guiding outlet to perform a reciprocating cleaning for the wafer. Other components such as an ultrasonic or megasonic generation unit, a gas shielding unit, a self-cleaning unit or a rotating unit can also be provided to perform the multifunction of the nozzle.

First claim

The invention claimed is:

1. A cleaning device for atomizing and spraying liquid in two-phase flow for cleaning a wafer positioned on a spin chuck in a cleaning chamber, comprising a nozzle, a liquid intake pipeline, a gas intake pipeline and an atomized particle guiding outlet; wherein;
the nozzle includes:
a liquid pipe inside the nozzle;
a gas pipe surrounding the liquid pipe;
a liquid-gas guiding part disposed at a lower end of the nozzle and provided with multiple liquid bypass pipelines which are connected with the liquid pipe, wherein the liquid bypass pipelines are symmetric with respect to the center of the liquid-gas guiding part;
an exhaust mesh plate disposed adjacent to the liquid bypass pipelines and connected with the gas pipe; wherein each portion of the exhaust mesh plate arranged between each two adjacent liquid bypass pipelines is provided with a plurality of gas guiding outlets oriented in a direction perpendicular to the exhaust mesh plate, and each liquid bypass pipeline is provided with a surface having liquid guiding outlets formed along its length; wherein the surface is disposed below the exhaust mesh plate and inclined in a downward direction with respect to the exhaust mesh plate at a predetermined angle from 10 degrees to 80 degrees;
wherein the liquid guiding outlets and/or the gas guiding outlets are straight tubular shaped, spiral tubular shaped or Laval nozzle structured;

wherein, the liquid intake pipeline and the gas intake pipeline are both connected to a spray arm and respectively communicated with the liquid pipe and the gas pipe inside the nozzle; wherein, the spray arm drives the nozzle to perform an arc-shaped reciprocating motion passing through the center of the wafer;
wherein, the atomized particle guiding outlet is disposed around and below the liquid-gas guide part; the atomized particle guiding outlet has a Laval nozzle structure or an inner wall oriented in the direction perpendicular to the exhaust mesh plate;
wherein, a liquid sprayed from the liquid guiding outlets and a gas sprayed from the gas guiding outlets collide against each other below the liquid-gas guiding part to form atomized particles which are then sprayed downward to the wafer surface through the atomized particle guiding outlet to perform a reciprocating two-phase flow cleaning process.

2. The cleaning device according to claim 1 , wherein the gas intake pipeline is introduced into the nozzle from an upper side wall of the nozzle to be communicated with the gas pipe; a gas separating plate is horizontally disposed in the gas pipe below a gas inlet of the gas pipe and around the liquid pipe, on which a series of through holes with different sizes surrounding the liquid pipe are formed in a way that diameters of the holes decrease gradually along a direction away from the gas inlet of the gas pipe.

3. The cleaning device according to claim 1 , wherein the gas intake pipeline is introduced into the nozzle from an upper side wall of the nozzle to be communicated with the gas pipe; a gas separating plate is horizontally disposed in the gas pipe below a gas inlet of the gas pipe and around the liquid pipe, on which an arc-shaped through hole surrounding the liquid pipe is formed in a way that an opening of the through hole gradually decreases along a direction away from the gas inlet of the gas pipe.

Assignees

• Beijing Naura Microelectronics Equipment Co Ltd

Inventors

• Teng Yu
• Li Wei

Classifications

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• B05B7/045

  the gas and liquid flows being parallel just upstream the mixing chamber (B05B7/0458, B05B7/0466 take precedence) · CPC title

• B05B15/55

  using cleaning fluids · CPC title

• B05B13/0278

  Arrangement or mounting of spray heads (B05B13/0207 takes precedence) · CPC title

• B05B7/0466

  with means for deflecting the central liquid flow towards the peripheral gas flow · CPC title