Composition, and method for producing foam molded material and electric wire

US10304585B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10304585-B2
Application numberUS-201414759089-A
CountryUS
Kind codeB2
Filing dateJan 15, 2014
Priority dateJan 24, 2013
Publication dateMay 28, 2019
Grant dateMay 28, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The present invention aims to provide a composition which can provide molded foams and foamed electric wires having a small average cell size and a high expansion ratio. The composition of the present invention includes a fluororesin; and boron nitride having an average particle size of 10.5 μm or greater, or boron nitride having a particle size distribution represented by (D84−D16)/D50 of 1.2 or lower.

First claim

Opening claim text (preview).

The invention claimed is: 1. A composition comprising: a fluororesin; and boron nitride having an average particle size of 13.0 μm or greater, wherein the amount of the boron nitride based on the sum of the amounts of the fluororesin and the boron nitride is 2.0% by mass or less, wherein the fluororesin is one that has been subjected to fluorination so as to reduce unstable end groups. 2. The composition according to claim 1 , wherein the boron nitride has a particle size distribution represented by (D84−D16)/D50 of 1.2 or lower. 3. The composition according to claim 1 , wherein the boron nitride is in a pulverized form. 4. The composition according to claim 1 , wherein the fluororesin is a tetrafluoroethylene/hexafluoropropylene copolymer, a tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer, or a tetrafluoroethylene/ethylene copolymer. 5. The composition according to claim 1 , wherein the amount of the boron nitride is 0.5% to 2.0% by mass based on the sum of the amounts of the fluororesin and the boron nitride. 6. A molded foam, which is formed from the composition according to claim 1 . 7. An electric wire comprising a core, and a covering material which covers the core and which is formed from the composition according to claim 1 . 8. A method for producing a molded foam, comprising foam-molding the composition according to claim 1 . 9. A method for producing an electric wire, comprising covering a core with the composition according to claim 1 , to provide an electric wire. 10. A composition comprising: a fluororesin; and boron nitride having a particle size distribution represented by (D84−D16)/D50 of 1.1 or lower. 11. The composition according to claim 10 , wherein the boron nitride has an average particle size of 5.0 μm or greater. 12. A composition comprising: a fluororesin; boron nitride having an average particle size of 13.0 μm or greater, and a sulfonic acid or a salt thereof, wherein the amount of the boron nitride based on the sum of the amounts of the fluororesin and the boron nitride is 2.0% by mass or less. 13. The composition according to claim 12 , wherein the boron nitride is in a pulverized form. 14. The composition according to claim 12 , wherein the fluororesin is a tetrafluoroethylene/hexafluoropropylene copolymer, a tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer, or a tetrafluoroethylene/ethylene copolymer. 15. The composition according to claim 12 , wherein the amount of the boron nitride is 0.5% to 2.0% by mass based on the sum of the amounts of the fluororesin and the boron nitride. 16. The composition according to claim 12 , wherein the sulfonic acid or a salt thereof is a sulfonic acid represented by the following formula (1): F(CF 2 ) n SO 3 H  (1) wherein n is 4 or 5, or the following formula (2): F(CF 2 ) n CH 2 CH 2 SO 3 H  (2) wherein n is 4 or 5, or a salt thereof. 17. A molded foam, which is formed from the composition according to claim 12 . 18. An electric wire comprising a core, and a covering material which covers the core and which is formed from the composition according to claim 12 . 19. A method for producing a molded foam, comprising foam-molding the composition according to claim 12 . 20. A method for producing an electric wire, comprising covering a core with the composition according to claim 12 to provide an electric wire.

Assignees

Inventors

Classifications

  • Feeding, melting, plasticising or pumping zones, e.g. the melt itself · CPC title

  • Sulfonic acids; Derivatives thereof · CPC title

  • Homopolymers or copolymers of tetrafluoroethene · CPC title

  • containing fluorine atoms · CPC title

  • Extrusion of the foamable blend · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10304585B2 cover?
The present invention aims to provide a composition which can provide molded foams and foamed electric wires having a small average cell size and a high expansion ratio. The composition of the present invention includes a fluororesin; and boron nitride having an average particle size of 10.5 μm or greater, or boron nitride having a particle size distribution represented by (D84−D16)/D50 of 1.2 …
Who is the assignee on this patent?
Daikin Ind Ltd
What technology area does this patent fall under?
Primary CPC classification C08K3/38. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 28 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).