Insulating tape for covering, and method for producing structure

Patent metadata

Field	Value
Publication number	US-10304583-B2
Application number	US-201514944657-A
Country	US
Kind code	B2
Filing date	Nov 18, 2015
Priority date	Jul 4, 2013
Publication date	May 28, 2019
Grant date	May 28, 2019

Abstract

To provide an insulating tape for covering, in which a polyimide film and a fluorinated resin film are laminated with excellent adhesion, and a method for producing a structure, which comprises covering a conductor with such an insulating tape for covering, followed by thermal treatment. The insulating tape for covering, comprises a polyimide film and a fluorinated resin film directly laminated on one or both surfaces of the polyimide film, wherein the fluorinated resin film contains a fluorinated copolymer (A) which has a melting point of from 220 to 320° C. and can be melt-molded and which has at least one type of functional groups selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups.

First claim

What is claimed is:

1. A method for producing a structure, comprising:
covering the surface of a conductor with an insulating tape to form a covering layer; and
thermally treating the conductor covered with the covering layer at a temperature of at least the melting point of the fluorinated copolymer (A) to obtain a structure,
wherein the insulating tape comprises a polyimide film and a fluorinated resin film directly laminated on one or both surfaces of the polyimide film,
wherein the fluorinated resin film comprises a fluorinated copolymer (A) which has a melting point of from 220 to 320° C. and can be melt-molded, and the fluorinated copolymer (A) comprises at least one functional group selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups.

2. The method for producing a structure according to claim 1 , wherein the thermal treatment is conducted at a temperature of at least the melting point of the fluorinated copolymer (A) and lower than 400° C.

3. The method for producing a structure according to claim 1 , wherein the structure is an electric cable.

4. The method for producing a structure according to claim 1 , wherein the melting point of the fluorinated copolymer (A) is from 260 to 320° C.

5. The method for producing a structure according to claim 1 , wherein the fluorinated copolymer (A) comprises a carbonyl group-containing group, wherein the carbonyl group-containing group is at least one selected from the group consisting of groups containing a carbonyl group between carbon atoms of a hydrocarbon group, carbonate groups, carboxy groups, haloformyl groups, alkoxycarbonyl groups and acid anhydride residual groups.

6. The method for producing a structure according to claim 1 , wherein a content of the functional groups is from 10 to 60,000 groups to 1×10 6 carbon atoms in the main chain of the fluorinated copolymer (A).

7. The method for producing a structure according to claim 1 , wherein the fluorinated copolymer (A) has a melt flow rate of from 0.5 to 15 g/10 min., as measured at 372° C. under a load of 49N.

8. The method for producing a structure according to claim 1 , wherein the fluorinated copolymer (A) has a melt flow rate of from 0.5 to 25 g/10 min., as measured at 297° C. under a load of 49N.

9. The method for producing a structure according to claim 1 , wherein the fluorinated copolymer (A) is a tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer (PFA) or a tetrafluoroethylene/ethylene copolymer (ETFE).

Assignees

• Agc Inc

Inventors

• Hosoda Tomoya
• Matsuoka Yasuhiko
• Sasaki Toru
• Kasai Wataru

Classifications

• B32B2307/206

  Insulating · CPC title

• B32B27/304

  comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF · CPC title

• C08J5/121

  by heating · CPC title

• B32B27/281

  comprising polyimides · CPC title

• H01B3/445

  from vinylfluorides or other fluoroethylenic compounds · CPC title