Secure crypto module including optical glass security layer

Patent metadata

Field	Value
Publication number	US-10303639-B2
Application number	US-201815862104-A
Country	US
Kind code	B2
Filing date	Jan 4, 2018
Priority date	Mar 24, 2016
Publication date	May 28, 2019
Grant date	May 28, 2019

Abstract

A method of fabricating a printed circuit board (PCB) is presented. The PCB includes a glass security layer. The method includes forming the glass security layer upon a PCB wiring layer. The method includes optically attaching an optical electromagnetic radiation (EM) emitter upon the glass security layer. The method includes optically attaching an optical EM receiver upon the glass security layer. The method further includes electrically connecting an optical monitor device to the optical EM receiver.

First claim

What is claimed is:

1. A method of fabricating a printed circuit board (PCB) comprising a glass security layer, the method comprising:
forming the glass security layer upon a PCB wiring layer;
optically attaching an optical electromagnetic radiation (EM) emitter upon the glass security layer;
optically attaching an optical EM receiver upon the glass security layer;
electrically connecting an optical monitor device to the optical EM receiver;
electrically connecting the optical monitor device to a destruct feature within the crypto component, wherein the destruct feature is programmed when the optical EM receiver detects that an interference pattern of optical EM emitted from the optical EM emitter and transmitted by the glass security layer is different from a predetermined expected optical EM interference pattern.

2. The method of claim 1 , further comprising:
forming an optically opaque encapsulation layer upon the glass security layer, upon the optical EM emitter, and upon the optical EM receiver.

3. The method of claim 1 , further comprising:
electrically connecting the optical monitor device to the optical EM emitter.

4. The method of claim 2 , wherein the optically opaque encapsulation layer is formed to a thickness greater than respective heights of the optical EM emitter and the optical EM receiver.

5. The method of claim 1 , further comprising:
electrically attaching a crypto component to a wire of the PCB.

6. The method of claim 1 , wherein the destruct feature is programmed when the optical EM receiver detects a predetermined threshold decrease of optical flux of optical EM transmitted from the optical EM emitter to the optical EM receiver by the glass security layer.

Assignees

• IBM

Inventors

• Bartley Gerald K
• Becker Darryl J
• Doyle Matthew S
• Jeanson Mark J
• Maxson Mark O

Classifications

• H04L9/004

  for fault attacks · CPC title

• G09C1/00

  Apparatus or methods whereby a given sequence of signs, e.g. an intelligible text, is transformed into an unintelligible sequence of signs by transposing the signs or groups of signs or by replacing them by others according to a predetermined system (cryptographic typewriters G09C3/00) · CPC title

• H04B10/80

  Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water · CPC title

• G06F13/4068 Primary

  Electrical coupling · CPC title