Thermosetting resin composition

Patent metadata

Field	Value
Publication number	US-10301517-B2
Application number	US-201715473170-A
Country	US
Kind code	B2
Filing date	Mar 29, 2017
Priority date	Mar 30, 2016
Publication date	May 28, 2019
Grant date	May 28, 2019

Abstract

A resin composition including at least (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, satisfies the following conditions:
(I-I) the minimum modulus is no greater than 10 4 MPa when evaluated at a set temperature of 200° C. after temperature increase from room temperature to 200° C. at 50° C./min by evaluation with a rheometer, and the final modulus is 10 5 MPa or greater from 10 minutes after the initial temperature increase; (I-II) the softening point of the epoxy resin (A) is 35° C. or higher; (I-III) the residual solvent in the resin composition is no greater than 0.1%; and (I-IV) the equivalent value of the curing agent (B) is no greater than 90 g/eq and the softening point is 105° C. or higher.

First claim

The invention claimed is:

1. A resin composition including (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, and satisfying the following conditions:
(II-I) X atoms other than C, O, H and N atoms in the main component of the inorganic filler (C) (the component present in a range of 1 to 95 mol %), based on EDX measurement, are on the surface of the inorganic filler (C) in the resin composition;
(II-II) the weight percentage of the inorganic filler (C) in the resin composition is no greater than 95 wt %;
(II-III) the mean particle size of the inorganic filler (C) is 0.5 μm or greater;
(II-IV) a ratio of the specific surface area of the inorganic filler (C) with respect to the total resin composition is no greater than 2 m 2 /g;
(II-V) the softening point of the epoxy resin (A) is 35° C. or higher;
(II-VI) the residual solvent in the resin composition is less than 0 .1 wt %; and
(II-VII) the softening point of the curing agent (B) is 105° C. or higher; and
wherein, under the condition (II-I), the abundance ratio of C atoms of the epoxy resin (A) or curing agent (B) and the X atoms of the inorganic filler (C), based on EDX measurement, on the surface of the inorganic filler (C) in the resin composition satisfies the following formula:
C/X =>1

wherein C is defined as a molar concentration of the C atoms and X is defined as a molar concentration of the X atoms.

2. The resin composition according to claim 1 , wherein, under the condition (II-VII), the equivalent value of the curing agent (B) is no greater than 90 g/eq and the softening point is 105° C. or higher.

3. A resin composition according to claim 1 , wherein the curing agent (B) is a compound with amino groups.

4. A sealing material comprising the cured product of a resin composition according to claim 1 .

5. A semiconductor device wherein a semiconductor element is sealed with a sealing material according to claim 4 .

6. A method for producing a semiconductor device, including a step of sealing a semiconductor element by compression molding using a sealing material according to claim 4 .

Assignees

• Asahi Chemical Ind

Inventors

• Inoue Akinori
• Takada Shozo

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• C08L2203/206

  use in coating or encapsulating of electronic parts · CPC title

• C08L2201/08

  Stabilised against heat, light or radiation or oxydation · CPC title