Coated cutting tool

US10300533B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10300533-B2
Application numberUS-201515500784-A
CountryUS
Kind codeB2
Filing dateJul 31, 2015
Priority dateAug 1, 2014
Publication dateMay 28, 2019
Grant dateMay 28, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A coated cutting tool has a substrate and a coating layer formed onto a surface of the substrate. The coating layer contains a hard layer of a composition represented by (TixM1-x)N, wherein M represents at least one kind of an element selected from the group consisting of Zr, Hf, V, Nb, Ta, Cr, Mo, W, Al, Si and Y, and x represents an atomic ratio of a Ti element based on a sum of the Ti element and an M element, and satisfies 0.45≤x≤0.9. Also, an average grain size of grains constituting the hard layer is 200 nm or more and 600 nm or less, and the grains of the hard layer satisfy predetermined conditions.

First claim

Opening claim text (preview).

The invention claimed is: 1. A coated cutting tool which comprises a substrate and a coating layer formed onto a surface of the substrate, wherein the coating layer contains a hard layer having a composition represented by (Ti x M 1-x )N that satisfies 0.45≤x≤0.9, wherein M represents at least one kind of an element selected from the group consisting of Zr, Hf, V, Nb, Ta, Cr, Mo, W, Al, Si and Y, and x represents an atomic ratio of a Ti element based on a sum of the Ti element and an M element, an average grain size of grains comprising the hard layer is 200 nm or more and 600 nm or less, and a value Sa in area % satisfies 55 area % ≤Sa≤90 area % under conditions such that (i) the hard layer is polished in a direction substantially parallel to the surface of the substrate to obtain a polished surface, (ii) an angle formed by a normal line of the polished surface and a normal line at a cubic (311) plane of the grains of the hard layer is determined as an orientation difference, (iii) A is an area of a cross-section of the grains of the hard layer where orientation differences of the grains are within a range of 0° or more and 35° or less, (iv) B is an area of a cross-section of the grains of the hard layer where orientation differences of the grains are within a range of 0° or more and less than 15° , and (v) Sa is computed in terms of a total of the area A and a total of the area B as Sa=B/A×100. 2. The coated cutting tool according to claim 1 , wherein an average thickness of the hard layer is 0.5 μm or more and 10 μm or less. 3. The coated cutting tool according to claim 1 , wherein the hard layer has compression stress. 4. The coated cutting tool according to claim 1 , wherein the hard layer has compression stress of 0.2 GPa or more and 3 GPa or less. 5. The coated cutting tool according to claim 1 , wherein the coating layer has a lower layer between the substrate and the hard layer, and the lower layer has a composition represented by (Al y L 1-y )N, wherein L represents at least one kind of an element selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Si and Y, and y represents an atomic ratio of an Al element based on a sum of the Al element and an L element, and satisfies 0.6≤y≤0.9. 6. The coated cutting tool according to claim 5 , wherein an average thickness of the lower layer is 0.2 μm or more and 5μm or less. 7. The coated cutting tool according to claim 1 , wherein a total thickness of the coating layer is 0.5 μm or more and 10 μm or less. 8. The coated cutting tool according claim 1 , wherein the substrate is any of a cemented carbide, cermet, ceramics or a cubic boron nitride sintered body. 9. The coated cutting tool according to claim 1 , wherein an average thickness of the hard layer is 0.5 μm or more and 10 μm or less. 10. The coated cutting tool according to claim 9 , wherein the hard layer has compression stress. 11. The coated cutting tool according to claim 10 , wherein the hard layer has compression stress of 0.2 GPa or more and 3 GPa or less. 12. The coated cutting tool according to claim 11 , wherein the coating layer has a lower layer between the substrate and the hard layer, and the lower layer has a composition represented by (Al y L 1-y )N, wherein L represents at least one kind of an element selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Si and Y, and y represents an atomic ratio of an Al element based on a sum of the Al element and an L element, and satisfies 0.6<y<0.9. 13. The coated cutting tool according to claim 12 , wherein an average thickness of the lower layer is 0.2 μm or more and 5μm or less. 14. The coated cutting tool according to claim 13 , wherein a total thickness of the coating layer is 0.5 μm or more and 10 μm or less. 15. The coated cutting tool according claim 14 , wherein the substrate is any of a cemented carbide, cermet, ceramics or a cubic boron nitride sintered body.

Assignees

Inventors

Classifications

  • B23B27/148Primary

    Composition of the cutting inserts · CPC title

  • applied by physical vapour deposition [PVD] · CPC title

  • Cutting tools of which the bits or tips {or cutting inserts} are of special material · CPC title

  • Nitrides (C23C14/0617 takes precedence) · CPC title

  • B23D61/028Primary

    of special material · CPC title

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What does patent US10300533B2 cover?
A coated cutting tool has a substrate and a coating layer formed onto a surface of the substrate. The coating layer contains a hard layer of a composition represented by (TixM1-x)N, wherein M represents at least one kind of an element selected from the group consisting of Zr, Hf, V, Nb, Ta, Cr, Mo, W, Al, Si and Y, and x represents an atomic ratio of a Ti element based on a sum of the Ti elemen…
Who is the assignee on this patent?
Tungaloy Corp
What technology area does this patent fall under?
Primary CPC classification B23B27/148. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 28 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).