Implantable medical devices with header structures including conductive paths that facilitate the interconnection of feedthrough conductors to electrical connectors

Patent metadata

Field	Value
Publication number	US-10300291-B2
Application number	US-201816173309-A
Country	US
Kind code	B2
Filing date	Oct 29, 2018
Priority date	Dec 30, 2014
Publication date	May 28, 2019
Grant date	May 28, 2019

Abstract

Implantable medical devices include header structures with conductive paths from the feedthrough conductors that may be located on one side of the device to electrical connectors that may be located on an opposite side of the device. The conductive paths may include conductive interconnect pins and lead frame conductors. The conductive interconnect pins may be located in holes present in a header body where the conductive interconnect pins are attached to the feedthrough conductors on one end and are attached to the lead frame conductors on the opposite end. The lead frame conductors then extend to the corresponding electrical connectors. The header body may provide cavities on each side to allow for the insertion of stack assemblies that include the electrical connectors and lead frame conductors.

First claim

What is claimed is:

1. A method of constructing an implantable medical device, comprising:
providing a header body having a first cavity exposed on a first side of the header body, having a second cavity exposed on a second side of the header body, and having at least one hole extending from the first side to the second side, the first cavity being laterally spaced from the second cavity;
providing a first stack assembly within the first cavity, the first stack assembly comprising at least one electrical connector and a lead frame conductor electrically connected to the at least one electrical connector;
providing a housing that houses electrical circuitry, the electrical circuitry comprising feedthrough conductors that exit from the housing;
inserting a conductive pin into the hole;
establishing an electrical connection between the lead frame conductor of the first side and a first end of the conductive pin present on the first side;
mounting the header body to the housing;
establishing an electrical connection of a first feedthrough conductor to a second end of the conductive pin present on the second side.

2. The method of claim 1 , further comprising:
providing a second stack assembly within the second cavity, the second stack assembly comprising at least one electrical connector and a lead frame conductor electrically connected to the at least one electrical connector; and
establishing an electrical connection of a second feedthrough conductor to the lead frame conductor of the second side.

3. The method of claim 2 , further comprising:
applying a medical adhesive over the first stack assembly and first end of the conductive pin after establishing the electrical connection between the lead frame conductor of the first side and the first end of the conductive pin;
applying a medical adhesive over the second stack assembly but not over the second end of the conductive pin prior to establishing the electrical connection of the of the first feedthrough conductor to the lead frame conductor of the second side and prior to establishing the electrical connection of the second feedthrough conductor to the second end of the conductive pin present on the second side; and
applying a medical adhesive over the second end of the conductive pin and over the feedthrough conductors after establishing the electrical connection of the of the first feedthrough conductor to the lead frame conductor of the second side and after establishing the electrical connection of the second feedthrough conductor to the second end of the conductive pin present on the second side.

4. The method of claim 2 , wherein providing the first stack assembly within the first cavity comprises loading the at least one electrical connector and at least one seal of the first stack assembly onto a first stack pin and placing the first stack assembly on the first stack pin into the first cavity, and wherein providing the second stack assembly within the second cavity comprises loading the at least one electrical connector and at least one seal of the second stack assembly onto a second stack pin and placing the second stack assembly on the second stack pin into the second cavity.

5. The method of claim 4 , further comprising:
providing a third stack assembly within the first cavity by loading an additional electrical connector and an additional seal of the third stack assembly onto a third stack pin and placing the third stack assembly on the third stack pin into the first cavity vertically spaced from the first stack assembly; and
providing a fourth stack assembly within the second cavity by loading an additional electrical connector and an additional seal of the fourth stack assembly onto a fourth stack pin and placing the fourth stack assembly on the fourth stack pin into the second cavity vertically spaced from the second stack assembly.

6. The method of claim 2 , wherein providing the first stack assembly comprises creating an electrical connection of the lead frame conductor of the first side to the electrical connector of the first stack assembly and wherein providing the second stack assembly comprises creating an electrical connection of the lead frame conductor of the second side to the electrical connector of the second stack assembly.

7. The method of claim 1 , wherein each hole of the plurality of holes of the header body defines a shoulder, wherein each of the conductive pins defines a shoulder, and wherein the shoulder of each conductive pin engages the shoulder of a corresponding hole of the plurality of holes.

8. The method of claim 1 , wherein each lead frame conductor travels in a vertical direction from the conductive pin to the electrical connector, with each hole being aligned along a horizontal direction with a corresponding electrical connector.

Assignees

• Medtronic Inc

Inventors

• Baade Michael J
• Bach Katherine J
• Deininger Steven T

Classifications

• A61N1/3752

  Details of casing-lead connections · CPC title

• A61N1/3754 Primary

  Feedthroughs · CPC title