Integrally bonded and installed protective enclosure

Patent metadata

Field	Value
Publication number	US-10299392-B2
Application number	US-201715782375-A
Country	US
Kind code	B2
Filing date	Oct 12, 2017
Priority date	Oct 12, 2017
Publication date	May 21, 2019
Grant date	May 21, 2019

Abstract

A protective enclosure for an electrically-conductive element disposed along a component surface includes a base, a first side with an electrical connector, and a second side with an aperture for receiving a potting material. The base, the first side, and the second side at least partially define an internal void, and the internal void communicates with an external environment via the aperture.

First claim

The invention claimed is:

1. A protective enclosure for an electrically-conductive element disposed along a component surface, the enclosure comprising:
a base;
a first side comprising an electrical connector;
a second side comprising an aperture configured to receive a potting material;
an internal void at least partially defined by the base, the first side, and the second side, the internal void being in communication with an external environment via the aperture; and
an anchoring mechanism within the internal void and disposed around the electrically-conductive element;
wherein the internal void comprises the potting material and a potting-free region adjacent the potting material; and
wherein the anchoring mechanism is positioned in the potting-free region.

2. The enclosure of claim 1 , wherein the base is mountable to the component surface.

3. The enclosure of claim 1 , wherein the electrically-conductive element comprises a wire.

4. The enclosure of claim 3 , wherein the potting material covers at least a portion of the electrically-conductive element within the internal void.

5. The enclosure of claim 4 , wherein the potting material comprises an epoxy material or a polymer material.

6. The enclosure of claim 1 , wherein the component is a floor panel or a leading edge.

7. The enclosure of claim 1 , wherein the base, the first side, and the second side are formed from a material selected from the group consisting of: nylon, ABS, polyurethane, epoxy, phenolic, and combinations thereof.

8. The enclosure of claim 7 , wherein the material is semitransparent.

9. The enclosure of claim 1 , wherein the first side is orthogonal to the base.

10. The enclosure of claim 1 , wherein the first side is parallel to the base.

11. The enclosure of claim 1 , wherein the base is non-planar.

12. The enclosure of claim 1 , wherein the base comprises a flange.

13. A method of making a protective enclosure for an electrically-conductive element disposed along a component surface, the method comprising:
forming a base;
forming a first side comprising an electrical connector; and
forming a second side comprising an aperture extending therethrough;
connecting the base, the first side, and the second side such that they at least partially form an internal void;
partially filling the internal void with a potting material such that the internal void comprises the potting material and a potting-free region adjacent the potting material; and
disposing an anchoring mechanism about the electrically-conductive element in the potting-free region.

14. The method of claim 13 , wherein forming the base comprises contouring the base to the component surface.

15. The method of claim 13 and further comprising: mounting the base to the component surface.

16. The method of claim 13 , wherein partially filling the internal void with the potting material comprises introducing the potting material into the internal void through the aperture.

17. The method of claim 16 and further comprising: covering at least a portion of the electrically-conductive element with the potting material.

18. The method of claim 16 and further comprising: optionally removing the enclosure after the potting material has cured.

19. The method of claim 13 , wherein the base, the first side, and the second side are formed using a 3D printing technique.

20. The method of claim 19 , wherein the 3D printing technique is a vat photopolymerization technique.

Assignees

• Goodrich Corp

Inventors

• Mullen James A

Classifications

• H05K5/064

  sealed by potting, e.g. waterproof resin poured in a rigid casing · CPC title

• H05K5/0056 Primary

  characterized by features for protecting electronic components against vibration and moisture, e.g. potting, holders for relatively large capacitors · CPC title

• H05K7/14

  Mounting supporting structure in casing or on frame or rack · CPC title

• H01R13/66

  Structural association with built-in electrical component (coupling devices having concentrically or coaxially-arranged contacts H01R24/38) · CPC title

• H02G15/007 Primary

  Devices for relieving mechanical stress · CPC title