Circuit board having conductive polymer

Patent metadata

Field	Value
Publication number	US-10299367-B2
Application number	US-201715716541-A
Country	US
Kind code	B2
Filing date	Sep 27, 2017
Priority date	May 17, 2016
Publication date	May 21, 2019
Grant date	May 21, 2019

Abstract

A circuit board includes a flexible board, a composite film, and a copper layer. The composite film is formed on the flexible board and defines at least one through hole. The composite film includes a base layer having an active surface, and a conductive layer formed by coated a conductive polymer on the active surface. The conductive polymer is made by a mixture comprising liquid crystal monomers, a silver complex, an initiator, and a catalytic agent, and a solvent, the mixture is heated to undergo atom transfer radical polymerization. The copper layer covers the conductive layer and an inner wall of each of the at least one through hole. The copper layer is electrically connected to the flexible substrate by the through hole.

First claim

What is claimed is:

1. A circuit board comprising:
a flexible board;
a composite film formed on the flexible board and defining at least one through hole, the composite film comprising:
a base layer having an active surface; and
a conductive layer formed by coated a conductive polymer on the active surface, the conductive polymer made by a mixture comprising liquid crystal monomers, a silver complex, an initiator, and a catalytic agent, and a solvent, the mixture is heated to undergo atom transfer radical polymerization; and

a copper layer covering the conductive layer and an inner wall of each of the at least one through hole, the copper layer electrically connected to the flexible substrate by the at least one through hole;
wherein the liquid crystal monomers has a mass percentage of about 42.2% to about 52.2% of a total mass of the mixture, the silver complex has a mass percentage of about 43.1% to about 53.1% of the total mass of the mixture, the initiator has a mass percentage of about 0.85% to about 1.35% of the total mass of the mixture, the catalytic agent has a mass percentage of about 2.85% to about 4.35% of the total mass of the mixture, the mixture and the solvent has a ratio selected from 3:17 to 1:3 by weight, and the silver complex in the conductive polymer is bonded to the active surface.

2. The circuit board of claim 1 , wherein the flexible board comprises a substrate and at least one conductive wiring layer formed on one surface of the substrate; and wherein the composite film is formed on the conductive wiring layer.

3. The circuit board of claim 1 , further comprising a solder mask layer, wherein the solder mask layer is formed on the copper layer and further covers the inner wall and a bottom surface of each of the at least one through hole.

4. The circuit board of claim 1 , wherein the at least one through hole is defined by one of punching and etching.

5. The circuit board of claim 1 , wherein the liquid crystal monomers are selected from a group consisting of 2,5-bis[(4methoxyphenyl) oxycarbonyl]styrene, 4-vinyl benzene and derivant thereof, methyl acrylate, hydroxyethyl acrylate, vinyl acrylate, N,N-dimethylamino propenyl ketone, acrylonitrile, methyl methacrylate, butyl methacrylate, N,N-dimethylaminoethyl methacrylate, and tert-butyl methacrylate.

6. The circuit board of claim 1 , wherein the silver complex is selected from a group consisting of AgNO 3 , Ag 2 O, AgBP 4 , and AgPF 6 .

7. The circuit board of claim 1 , wherein the initiator is selected from a group consisting of 1,3,5-(2′-bromo-2-methylpropionato) benzene, α-bromine ethane, 2-ethyl bromide, 2-bromine-2-methyl ethyl propionate, and 2-dibromine propionitrile.

8. The circuit board of claim 1 , wherein the catalytic agent is copper bromide.

9. The circuit board of claim 1 , wherein the catalytic agent is copper bromide and sparteine.

10. The circuit board of claim 1 , wherein the solvent is selected from a group consisting of dimethyl sulfoxide, dimethylformamide, and N-methyl-2-pyrrolidone.

Assignees

• Avary Holding Shenzhen Co Ltd
• Hongqisheng Prec Electronics Qinhuangdao Co Ltd

Inventors

• Ho Ming-Jaan
• Hsu Hsiao-Ting

Classifications

• H05K2201/05

  Flexible printed circuits [FPCs] · CPC title

• C08K3/28

  Nitrogen-containing compounds · CPC title

• H05K2201/0215

  Metallic fillers · CPC title

• C09D5/24

  Electrically-conducting paints {(conductive materials H01B1/00)} · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title