System and method for manufacturing a micropillar array

Patent metadata

Field	Value
Publication number	US-10297832-B2
Application number	US-201515523555-A
Country	US
Kind code	B2
Filing date	Nov 19, 2015
Priority date	Nov 19, 2014
Publication date	May 21, 2019
Grant date	May 21, 2019

Abstract

A system and method for manufacturing a micropillar array ( 20 ). A carrier ( 11 ) is provided with a layer of metal ink ( 20 i ). A high energy light source ( 14 ) irradiates the metal ink ( 20 i ) via a mask ( 13 ) between the carrier ( 11 ) and the light source. The mask is configured to pass a cross-section illuminated image of the micropillar array onto the metal ink ( 20 i ), thereby causing a patterned sintering of the metal ink ( 20 i ) to form a first subsection layer ( 21 ) of the micropillar array ( 20 ) in the layer of metal ink ( 20 i ). A further layer of the metal ink ( 20 i ) is applied on top of the first subsection layer ( 21 ) of the micropillar array ( 20 ) and irradiated via the mask ( 13 ) to form a second subsection layer ( 21 ) of the micropillar array on top. The process is repeated to achieve high aspect ratio micropillars 20 p.

First claim

The invention claimed is:

1. A system for manufacturing a micropillar array, the system comprising
a platform configured to hold a carrier;
a deposition means comprising a supply of metal ink, wherein the deposition means is configured to provide a layer of the metal ink onto the carrier;
a light source configured to provide light capable of sintering the metal ink;
a mask between the light source and the carrier, wherein the mask comprises a mask pattern configured to pattern the light according to a cross-section image of the micropillar array, wherein the light source and the mask are configured to have the patterned light impinge onto the layer of metal ink thereby causing a patterned sintering of the metal ink to form a subsection layer of the micropillar array in the metal ink;
a controller arranged to control the deposition means, the light source, and the platform; and
a computer-readable storage medium operatively linked to the controller and comprising program instructions that when executed by the controller, cause the controller to repeatedly execute the steps of
controlling the deposition means to provide a further layer of metal ink onto a previously formed subsection layer of the micropillar array; and
controlling the light source to provide the patterned light onto the further layer of metal ink to form a further subsection layer of the micropillar array in the metal ink onto to the previously formed subsection layer.

2. The system according to claim 1 , wherein the controller is arranged and programmed for
removing the mask between the light source and the carrier after building a plurality of subsection layers of the micropillar array;
providing a further layer of metal ink onto a last formed subsection layer of the plurality of subsection layers; and
providing unpatterned light onto the further layer of metal ink to form a continuous base section of the micropillar array in the metal ink onto the last formed subsection layer, wherein the base section forms a metal foil connecting the pillars of the array.

3. The system according to claim 1 , wherein the system further comprises etching means for etching the non-sintered parts of the metal ink to provide an array of spatially separated pillars with spacing therein between.

4. The system according to claim 1 , wherein the system further comprises an electroplating means configured to electroplate the sintered parts of the metal ink for smoothing an interface of the micropillars.

5. The system according to claim 1 , wherein the carrier is transparent to the light of the light source.

6. The system according to claim 1 , wherein the platform is configured to act as a heat sink in thermal contact with the carrier for drawing heat from the carrier to prevent sintering of the metal ink by heating of the carrier.

7. The system according to claim 1 , wherein the light source is a high energy flash lamp configured to provide a light flash capable of sintering the metal ink.

8. The system according to claim 1 , wherein the cross-section image comprises a plurality of cross-section shapes corresponding to micropillars forming the array, wherein each of the cross-section shapes have a diameter in a range between 1 and 100 micrometers.

9. A method for manufacturing a micropillar array, the method comprising
providing a carrier with a layer of metal ink;
providing a high energy light source and irradiating the layer of metal ink via a mask between the carrier and the light source, wherein the mask is configured to pass a cross-section illuminated image of the micropillar array onto the metal ink, thereby causing a patterned sintering of the metal ink to form a first subsection layer of the micropillar array in the layer of metal ink;
applying a further layer of the metal ink on top of the first subsection layer of the micropillar array and irradiating the further layer via the same mask to form a second subsection layer of the micropillar array on top.

10. The method according to claim 9 , further comprising
removing the mask between the light source and the carrier after building a plurality of subsection layers of the micropillar array;
providing a further layer of metal ink onto a last formed subsection layer of the plurality of subsection layers; and
providing unpatterned light onto the further layer of metal ink to form a continuous base section of the micropillar array in the metal ink onto the last formed subsection layer, wherein the base section forms a metal foil connecting the pillars of the array.

11. The method according to claim 9 , wherein the carrier comprises a sacrificial layer, wherein a first layer of metal ink is deposited onto the sacrificial layer of the carrier, wherein the micropillar array from the carrier is released after manufacturing by disintegrating the sacrificial layer.

12. The method according to claim 9 , further comprising etching the non-sintered parts of the metal ink to provide an array of spatially separated pillars with spacing therein between.

13. The method according to any of claim 9 , further comprising electroplating the micropillar array.

14. A micropillar array comprising a plurality of micropillars, wherein the micropillars are formed of a periodic layered structure of sintered metal ink comprising polymerized particles in a matrix of fused metal particles.

15. The micropillar array according to claim 14 , wherein the plurality of micropillars are disposed on a foil connecting the micropillars, wherein the foil is formed of the same sintered metal ink as the micropillars.

16. The micropillar array according to claim 14 , wherein the micropillars have a height to diameter ratio in a range between 20 and 200.

17. The micropillar array according to claim 16 , wherein the micropillars are periodically arranged with a pitch period between 1.5 and 5 times a diameter of the micropillars.

18. The micropillar array according to claim 14 , wherein the array is comprised in a battery.

Assignees

• TNO

Inventors

• Unnikrishnan Sandeep
• Hendriks Rob Jacob

Classifications

• B81C1/00111 Primary

  Tips, pillars, i.e. raised structures (microneedles A61M37/0015) · CPC title

• H01M4/0471

  involving thermal treatment, e.g. firing, sintering, backing particulate active material, thermal decomposition, pyrolysis · CPC title

• C25D7/00

  Electroplating characterised by the article coated · CPC title

• H01M2004/025

  with shapes other than plane or cylindrical · CPC title

• G03F7/2004

  characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light · CPC title