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LED array and method for fabricating same
US10295147B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10295147-B2 |
| Application number | US-98227607-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 31, 2007 |
| Priority date | Nov 9, 2006 |
| Publication date | May 21, 2019 |
| Grant date | May 21, 2019 |
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- Title
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Abstract
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A light emitting device or array comprising a submount having a top surface, a bottom surface and a plurality of edges, with input and output terminals disposed on the top surface. A plurality of attach pads and traces are also disposed on the top surface and electrically connected between the input and output terminals. A plurality of LEDs are also included, each of which is mounted to one of the attach pads. The attach pads cover more of the top surface than the LEDs and spread heat from the LEDs to the top surface of the submount. A plurality of lenses are also included each of which is molded over a respective one of the attach pads and covers the LED mounted to the particular attach pad. The arrays are shaped and arranged so that they can be easily attached to similar arrays in a tiling fashion, with the desired number of arrays included to meet the desired lighting requirements. Methods for fabricating the arrays from a single submount or submounts panel are also disclosed.
First claim
Opening claim text (preview).
We claim: 1. An emitter array, comprising: a submount comprising at least one of a PCB, a FR-4 PCB, or a metal core PCB, said submount further comprising a top surface, a plurality of edges, and conductive features; said conductive features comprising input and output terminals, a plurality of attach pads, and a plurality of electrical traces distinct from said input and output terminals, wherein at least some of said conductive features are on a portion of said top surface of s…
Assignees
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Classifications
- F21V5/007Primary
Mechanical Engineering · mapped topic
Mechanical Engineering · mapped topic
Mechanical Engineering · mapped topic
Mechanical Engineering · mapped topic
Mechanical Engineering · mapped topic
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Frequently asked questions
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- What does patent US10295147B2 cover?
- A light emitting device or array comprising a submount having a top surface, a bottom surface and a plurality of edges, with input and output terminals disposed on the top surface. A plurality of attach pads and traces are also disposed on the top surface and electrically connected between the input and output terminals. A plurality of LEDs are also included, each of which is mounted to one of …
- Who is the assignee on this patent?
- Yuan Thomas Cheng Hsin, Keller Bernd, Cree Inc
- What technology area does this patent fall under?
- Primary CPC classification F21V5/007. Mapped technology areas include Mechanical Engineering.
- When was this patent published?
- Publication date Tue May 21 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).