Coating composition and electronic component

US10294145B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10294145-B2
Application numberUS-201815868412-A
CountryUS
Kind codeB2
Filing dateJan 11, 2018
Priority dateJul 15, 2015
Publication dateMay 21, 2019
Grant dateMay 21, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A coating composition contains 5 parts by mass or more and 20 parts by mass or less (i.e., 5 to 20) of a first resin composition, 5 parts by mass or more and 20 parts by mass or less (i.e., 5 to 20) of a second resin composition, and 40 parts by mass or more and 65 parts by mass or less (i.e., 40 to 65) of an inorganic powder. The first resin composition is a poly(meth)acrylate with a glass transition temperature Tg of ≤−20° C., and the second resin composition is a compound having structures represented by general formulae (1) and (2), below, one or more structures for each. R 1 , in general formula (1), and R 2 , in general formula (2), are each independently a hydrogen atom or a methyl group. X, in general formula (2), is any substituent that is not a hydrogen atom.

First claim

Opening claim text (preview).

What is claimed is: 1. A coating composition comprising: from 5 parts by mass to 20 parts by mass of a first resin composition; from 5 parts by mass to 20 parts by mass of a second resin composition; and from 40 parts by mass to 65 parts by mass of an inorganic powder, wherein the first resin composition is a poly(meth)acrylate with a glass transition temperature Tg of ≤−20° C., the second resin composition has at least one structure represented by following formula (1) and at least one structure represented by following formula (2), R 1 and R 2 are each independently a hydrogen atom or a methyl group, and X is a substituent other than a hydrogen atom. 2. The coating composition according to claim 1 , wherein X is either a structure having a benzene ring or an alkyl group having eight or more carbon atoms. 3. The coating composition according to claim 1 , wherein a weight-average molecular weight of the second resin composition is 50000 or less. 4. The coating composition according to claim 1 , further comprising a (meth)acrylate having from three to six ethylenically unsaturated groups in one molecule. 5. The coating composition according to claim 1 , further comprising a photopolymerization initiator. 6. The coating composition according to claim 1 , wherein the inorganic powder is composed of glass and filler, and a proportion that the filler accounts for in the inorganic powder is 60% by weight or less. 7. An electronic component comprising an insulating layer made of the coating composition according to claim 1 through firing. 8. The coating composition according to claim 2 , wherein a weight-average molecular weight of the second resin composition is 50000 or less. 9. The coating composition according to claim 2 , further comprising a (meth)acrylate having from three to six ethylenically unsaturated groups in one molecule. 10. The coating composition according to claim 3 , further comprising a (meth)acrylate having from three to six ethylenically unsaturated groups in one molecule. 11. The coating composition according to claim 2 , further comprising a photopolymerization initiator. 12. The coating composition according to claim 3 , further comprising a photopolymerization initiator. 13. The coating composition according to claim 4 , further comprising a photopolymerization initiator. 14. The coating composition according to claim 2 , wherein the inorganic powder is composed of glass and filler, and a proportion that the filler accounts for in the inorganic powder is 60% by weight or less. 15. The coating composition according to claim 3 , wherein the inorganic powder is composed of glass and filler, and a proportion that the filler accounts for in the inorganic powder is 60% by weight or less. 16. The coating composition according to claim 4 , wherein the inorganic powder is composed of glass and filler, and a proportion that the filler accounts for in the inorganic powder is 60% by weight or less. 17. The coating composition according to claim 5 , wherein the inorganic powder is composed of glass and filler, and a proportion that the filler accounts for in the inorganic powder is 60% by weight or less. 18. An electronic component comprising an insulating layer made of the coating composition according to claim 2 through firing. 19. An electronic component comprising an insulating layer made of the coating composition according to claim 3 through firing. 20. An electronic component comprising an insulating layer made of the coating composition according to claim 4 through firing.

Assignees

Inventors

Classifications

  • mainly consisting of inorganic substances · CPC title

  • of aluminium · CPC title

  • Glass · CPC title

  • Powdered glass (C03C8/02 takes precedence); Bead compositions · CPC title

  • C03C8/16Primary

    with vehicle or suspending agents, e.g. slip · CPC title

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What does patent US10294145B2 cover?
A coating composition contains 5 parts by mass or more and 20 parts by mass or less (i.e., 5 to 20) of a first resin composition, 5 parts by mass or more and 20 parts by mass or less (i.e., 5 to 20) of a second resin composition, and 40 parts by mass or more and 65 parts by mass or less (i.e., 40 to 65) of an inorganic powder. The first resin composition is a poly(meth)acrylate with a glass tra…
Who is the assignee on this patent?
Murata Manufacturing Co
What technology area does this patent fall under?
Primary CPC classification C03C8/16. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 21 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).