Micro flow channel chip and method for producing flow channel chip

Patent metadata

Field	Value
Publication number	US-10293573-B2
Application number	US-201615389820-A
Country	US
Kind code	B2
Filing date	Dec 23, 2016
Priority date	Jan 6, 2016
Publication date	May 21, 2019
Grant date	May 21, 2019

Abstract

Provided is a method for producing a micro flow channel chip that is used for a treatment or analysis of a liquid sample, the method being capable of producing a micro flow channel chip with high shape accuracy and high efficiency. The method includes a step of forming a groove on one surface of a base material; a lamination step of forming an adhesive resin layer on at least one surface of a resin film, and thereby obtaining a first laminate; and an adhesion step of arranging the surface of the base material where a groove has been formed and the adhesive resin layer of the first laminate to face each other, and bonding the base material and the first laminate such that the adhesive resin layer covers the groove, in which the glass transition temperature of the adhesive resin layer is 25° C. or lower.

First claim

The invention claimed is:

1. A method for producing a micro flow channel chip, the method comprising:
a step of forming a groove on one surface of a base material;
a lamination step of forming an adhesive resin layer on at least one surface of a resin film, and thereby obtaining a first laminate; and
an adhesion step of arranging the surface of the base material where a groove has been formed and the adhesive resin layer of the first laminate to face each other, and bonding the base material and the first laminate such that the adhesive resin layer covers the groove,
wherein the adhesive resin layer has a glass transition temperature of 25° C. or lower.

2. The method for producing a micro flow channel chip according to claim 1 ,
wherein the adhesive resin layer contains a (meth)acrylic resin.

3. The method for producing a micro flow channel chip according to claim 1 ,
wherein the adhesive resin layer of the micro flow channel chip has pressure-sensitive adhesive properties.

4. The method for producing a micro flow channel chip according to claim 1 ,
wherein the base material contains one or more kinds of resins selected from the group consisting of a (meth)acrylic resin, a styrene-based resin, a polycarbonate-based resin, and a polyolefin-based resin.

5. The method for producing a micro flow channel chip according to claim 1 ,
wherein the groove has a standard deviation of a distance from a bottom of the micro flow channel chip to the adhesive resin layer is 0.5 μm or less.

6. The method for producing a micro flow channel chip according to claim 1 ,
wherein the adhesion step further comprises a second laminate that includes pressing the base material and the first laminate at a temperature of from 15° C. to 40° C.

7. The method for producing a micro flow channel chip according to claim 6 ,
wherein in the adhesion step, the second laminate is pressed at a pressure of from 0.3 MPa to 3.0 MPa.

8. A micro flow channel chip, comprising:
a base material that has a groove formed on one surface;
a resin film; and
an adhesive resin layer that covers the groove of the base material and bonds the resin film to the surface of the base material,
wherein the adhesive resin layer has a glass transition temperature of 25° C. or lower.

9. The micro flow channel chip according to claim 8 ,
wherein the adhesive resin layer has pressure-sensitive adhesive properties.

10. The micro flow channel chip according to claim 8 , wherein the adhesive resin layer contains a (meth)acrylic resin.

11. The micro flow channel chip according to claim 8 ,
wherein the base material contains one or more kinds of resins selected from the group consisting of a (meth)acrylic resin, a styrene-based resin, a polycarbonate-based resin, and a polyolefin-based resin.

12. The micro flow channel chip according to claim 8 ,
wherein the groove has a standard deviation of a distance from a bottom of the adhesive resin layer is 0.5 μm or less.

Assignees

• Sumitomo Bakelite Co

Inventors

• Taniguchi Hirohito

Classifications

• B81C2201/019

  Bonding or gluing multiple substrate layers · CPC title

• B81C1/00119

  Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems · CPC title

• B81B2201/058

  Microfluidics not provided for in B81B2201/051 - B81B2201/054 · CPC title

• B32B2309/02

  Temperature · CPC title

• B32B2307/728

  Hydrophilic · CPC title